• Proceedings of the Korean Institute of Building Construction Conference
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• 2002.11a
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• pp.59-62
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• 2002

Recently, advanced system for water and wastewater treatment is introduced and operated because of water pollution and etc. One of this System makes use of O3(Ozone) for water and wastewater treatment. In airtight concrete structure, waterproofing phase as well as water are affected by strong oxidative O3 in the long-term. For this reason, material stability against O3 is examined. Consequently, the purpose of this study is to find out material stability an object of epoxy resin by way of accelerated O3 testing.

• Polymer(Korea)
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• v.34 no.1
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• pp.52-57
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• 2010

The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1996.11a
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• pp.421-424
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• 1996

Effects of humidity absorbing deterioration on AC dielectric breakdown characteristics of modified epoxy resin system with SN(succinonitrile) were investigated. As the forced humidity absorbing deterioration proceeded under high temperature and humidify, glass transition temperature increased. The dielectric breakdown strength increased and then decreased at deterioration cycles higher than 2. Not only, the increment of thermal stability but also, the physical detects such as Internal cracks and voids occurred during the humidity absorbing deterioration cycle were the main causes of the change in dielectric properties.

• Journal of Power System Engineering
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• v.20 no.5
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• pp.14-19
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• 2016

This study is about the effect of nitrogen gas pressures during manufacturing process on the mechanical properties of composite materials. $TiO_2$/epoxy resin nanocomposites and carbon fiber reinforced epoxy resin(CFRP) composites were fabricated under various nitrogen gas pressures. Tensile strength test, vicker's hardness test and fracture surface observation were carried out to investigate the effect of nitrogen gas pressure. As a result, the tensile strength of nanocomposite and CFRP composites showed clearly increasing tendency by a change in the nitrogen gas pressure up to 3.0 atm and then the tensile strength decreased a little. However, the vicker's hardness of $TiO_2$/epoxy nanocomposites showed same hardness values regardless of the nitrogen gas pressures.

• Journal of the Korean Ceramic Society
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• v.44 no.5 s.300
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• pp.179-183
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• 2007

BCB $Resin-BaNd_2Ti_4O_{12}$(BNT) composites with BNT contents were prepared by tape casting method and epoxy resin-BNT composites were prepared by using heating press. Their dielectric properties and microstructures were investigated. The dielectric properties such as dielectric constant and dielectric loss at 1 MHz for epoxy resin-BNT composites and BCB resin-BNT composites are improved with an increase of BNT volume fraction. The dielectric constant of the Epoxy-BNT composite increased from 5.9 to 7.8 as the volume fraction of BNT increased from 15 to 25. The dielectric constant of the BCB-BNT composite increased from 9.1 to 15.5 as the volume fraction of BNT increased from 30 to 50. The dielectric behavior of BCB-BNT system can be explained by Lichtenecker's equation. The dielectric constant of epoxy resin-BNT composite is smaller than that of BCB resin-BNT composite. These results are considered to be related with the dispersion of BNT filler in polymer matrix from the result of SEM photograph.

• Transactions on Electrical and Electronic Materials
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• v.13 no.2
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• pp.89-92
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• 2012

The effect of organic impurities on the electrical properties of a neat epoxy resin was studied. 0.05, 0.5 and 1.0 phr of iso-propyl alcohol (IPA) and methylene chloride (MC) mixture (50/50 wt%) were used as impurities. The current density, volume resistance and impedance characteristics of the epoxy/IPA/MC systems were measured with a high voltage source meter and broadband dielectric spectroscopy. Glass transition temperature (Tg) was measured by a differential scanning calorimetry (DSC) and it was found that Tg decreased slightly with increasing IPA/MC content. It was also found that Tg values of the epoxy systems with various IPA/MC contents were closely related to the current density, volume resistance and impedance characteristics.

• Clean Technology
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• v.12 no.1
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• pp.27-35
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• 2006

Main compositions of powder paint based on thermoset type epoxy resin consist of epoxy resin for powder coating, curing agent, filler and pigment. The curing system used in this study was based on diglycidyl ether of bisphenol-A (DGEBA) and dicyan diamide (DICY). The curing behavior and rheological properties of powder coating material were investigated using DSC and rheometer, respectively. And the adhesion strength between steel and powder coating material was measured using lap shear geometry. The optimum formulation of epoxy powder paint obtained from this study was base resin of 100 phr, DICY of 6 phr, $CaCO_3$ of 20 phr, and $TiO_2$ of 10 phr.

• Journal of the Korean Applied Science and Technology
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• v.31 no.3
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• pp.486-491
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• 2014

We have been fabricated Thin-walled carbon nanotubes (TWNTs)/amine epoxy additives composite using Eco-friendly solvent system such as supercritical process and dry mixed process. TWNTs/amine epoxy additives composite has used as a curing agent for urethane based bisphenol A type epoxy resin. The thermo-mechanical property of the epoxy resin cured by TWNTs/amine epoxy additives composite is characterized by dynamic mechanical analysis(DMA) and dispersability of the nanotubes in the epoxy matrix is also confirmed by scanning electron microscope(SEM). As a results, the epoxy resin cured by TWNTs/amine epoxy additives composite with supercritical process shows enhanced dispersability of the TWNTs in the matrix and thermo-mechanical property when compare to dry mixed process.

• Macromolecular Research
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• v.17 no.11
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• pp.870-873
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• 2009

In this study, 2-diglycidylether of benzotrifluoride (2-DGEBTF) and 4-diglycidylether of benzotrifluoride (4-DGEBTF) epoxy resins, which contained fluorine groups in the main chain, were synthesized. The resins were characterized by FTIR, $^1H$ NMR, $^{13}C$ NMR and $^{19}F$ NMR spectroscopy. The 2-DGEBTF and 4-DGEBTF epoxy resins were cured with triethylene tetramine (TETA), and the effect of the fluorine group on the synthesized epoxy resin on the cure behavior, thermal, and mechanical properties was investigated. The 2-DGEBTF/TETA system was more reactive than the 4-DGEBTF/TETA system, whereas the thermal stability factor i.e., the decomposition activation energy ($E_d$), of 4-DGEBTF/TETA was higher than that of 2-DGEBTF/TETA. These results can be explained by the decrease in cross-linking density and decomposition of the short side chains, resulting in the $CF_3$ group at the para position. However, the $K_{IC}$ value of 4-DGEBTF/TETA was higher than that of 2-DGEBTF/TETA. This was attributed to the increase in flexibility in the epoxy backbone, resulting in a difference in steric hindrance and polarlizability.

• Polymer(Korea)
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• v.26 no.4
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• pp.501-507
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• 2002

In this work, diglycidylether of bisphenol-S (DGEBS) epoxy resin was prepared by alkaline condensation of bisphenol-S (BPS) with epichlorohydrin (ECH) in the presence of NaOH catalyst. The structure of the synthesized DGEBS epoxy resin was confirmed by IR, NMR spectra, and elemental analysis. The curing reaction and glass transition temperature ($T_g$) of DGEBS epoxy resin cured with phthalic anhydride (PA) and tetrahydrophthalic anhydride (THPA) at curing agents were studied by dynamic differential scanning calorimetry (DSC). The thermal stability of the cured specimen was investigated by thermogravimetric analysis (TGA). As a result, the activation energy ($E_a$) of DGEBS/PA system was higher than that of DGEBS/THPA system, whereas $T_g$, initial decomposed temperature (IDT), and decomposition activation energy ($E_t$) of DGEBS/PA were lower than those of DGEBS/THPA. This was probably due to the fact that the crosslinking density of DGEBS/THPA was increased by ring strain of curing agent.