• Proceedings of the KIEE Conference
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• 1997.11a
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• pp.345-347
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• 1997

The thermal decomposition kinetics of epoxy resin system as an electrical insulator for high voltage was investigated by using thermogravimetric analysis and Horowitz & Metzger equation. Epoxy resin system was degraded by one stage. The thermal decomposition activation energies of epoxy resin systems were all about 380 kJ/mol at the GN contents of 0 and 5 phr, and it abruptly decreased at 10 phr.

• The Korean Journal of Rheology
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• v.11 no.2
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• pp.135-142
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• 1999

The effects of 1 wt.% N-benzylpyrazinium hexafluoroantimonate (BPH) as a thermal latent initiator and blend compositions composed of 0, 5, 10, 20 and 40 wt.% of phenol-novolac resin to epoxy resin were investigated in terms of cure kinetics, thermal stabilities and rheological properties. Thermal latent properties of BPH were measured from the conversion as a function of reaction temperature on a dynamic DSC. This cationic BPH system turned out to be an effective thermal latent initiator in the epoxy-phenol curing system. And the increase of phenol-novolac resin concentration led to the decrease in the latent temperature and to the increase of cure activation energy ($E_a$) of the blend system. The thermal stability and activation energy ($E_t$) for decomposition, gel-time and activation energy ($E_c$) for cross-linking from rheometer increased within the composition range of 20~40 wt.% of phenol-novolac resin. This implies that the three-dimensional cross-linking may take place among hydroxyl group within phenol resin, epoxide ring within epoxy resin and BPH.

• Elastomers and Composites
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• v.31 no.1
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• pp.13-22
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• 1996

In order to Improve the fracture toughness of epoxy resin system, liquid chloroprene rubber(LCR) and liquid butadiene rubber (LBR) which have hydroxy group were used in the brittle epoxy system. Mechanical and toughness characterization of the modified epoxy resins were investigated as a function of liquid rubbers content. Epoxy resins modified with both of the liquid rubbers showed complete phase-separation microstructure : In all of the LCR content, it was observed that the domain size of LCR dispersed in the epoxy matrix ranging from $2{\mu}m\;to\;5{\mu}m$. It was found that fracture toughness, $K_{ic}$, of the modified LCR system was enhanced continuously as increasing LCR content. However around 10phr of LBR system showed maximum fracture toughness. Specifically, when BPA add to the modified LCR system, thermal and mechanical properties increased than neat epoxy. At the same time, fracture toughness was enhanced.

• Applied Chemistry for Engineering
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• v.1 no.2
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• pp.124-132
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• 1990

In order to improve the mechanical properties and fracture toughness of HPT 1071/DDS system, poly(aryl etherimide) (PEI) was incorporated in the resin system. In HPT 1071/DDS system, mechanical properties of cured epoxy resins were not strongly dependent on the concentration of DDS curing agent strongly. In the case of HPT 1071/DDS/PEI system, the fracture toughness and flexural properties of epoxy resins increased with increasing the concentration of PEI. SEM micrographs of cured epoxy resin indicated that the phase separation occured at the low concentration of PEI in this system. In addition, investigation of the relationship between mechanical properties and the morphology of modified epoxy resin was undertaken in HPT 1071/DDS/PEI system.

• Textile Coloration and Finishing
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• v.27 no.1
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• pp.11-17
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• 2015

Recently, super fiber reinforced composite materials are widely used in many industries due to high mechanical properties. In this study, 2 different types of composite materials were manufactured in order to compare their mechanical properties. Carbon and Aramid fibers were used for reinforcement materials and Bisphenol-A type epoxy resin was for matrix. Two kinds of fiber-reinforced materials were manufactured by RIM(Resin Injection Molding) method. Before manufacturing composite materials, the optimal manufacturing and curing process condition were established and the ratio of reinforcement to epoxy resin was discussed. FT-IR analysis was conducted to clarify the structure of epoxy resin. Thermal and mechanical property test were also carried out. The cross-section of composite materials was observed using a scanning electron microscope(SEM).

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.10a
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• pp.273-275
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• 2002

In this studies, curing behavior and mechanical properties of tetrafunctional epoxy resin (4EP)/ fluorine-containing epoxy resin (FEP) blend systems was investigated with 4, 4'-diaminodiphenol methane (DDM) as a curing agent. The cure activation energies $(E_a)$) were studied by Flynn-Wall-Ozawa's equation with dynamic DSC method. For the fracture toughness of the casting specimens, the critical stress intensity factor ($K_{IC}$) and the specific fracture energy ($G_{IC}$) were determined by fracture toughness test.

• Textile Coloration and Finishing
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• v.34 no.3
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• pp.157-164
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• 2022

This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.149-152
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• 2012

The effects of amino silane coupling agent on the AC electrical treeing and breakdown behaviors in an epoxy/layered silicate (1 wt%) were examined in needle-plate electrode geometry. A layered silicate was exfoliated in an epoxy base resin by using our AC electric field apparatus. To measure the tree initiation and propagation and the breakdown rate, an alternating current (AC) of 10 kV (60 Hz) was applied to the specimen in needle-plate electrode arrangement with a $30^{\circ}C$ insulating oil bath. In the epoxy/amino silane system, the tree initiation time was 11.5 times higher and the breakdown time was 17.9 times higher than those of the neat epoxy resin. The tree initiation time in the epoxy/layered silicate (1 wt%) system with the amino silane was 2.0 times higher, and the breakdown time was 1.5 times higher than those of the epoxy/layered silicate (1 wt%) system.

• Journal of Conservation Science
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• v.27 no.3
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• pp.301-312
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• 2011

Epoxy resin has superior durability and adhesive strength and proper physical strength so that it is used to diversity materials for multi-purposes. However epoxy resin is hardly removed after hardening specially once it is applied to artefacts, it is difficult to remove them under re-conservation. This paper is an experimental study on removing epoxy resin applied to iron objects using Nd:YAG laser cleaning system. Tests conducted in this study investigated how increasing laser energy and pulses would give effect on samples. The samples were prepared in a way that epoxy resin, itself pure and one which was mixed with pigment and they were applied to iron coupons and corroded iron coupons respectively. As a result of experiment, pure epoxy resin applied to corroded iron coupons was ablated at high laser energy but epoxy resin applied to iron coupons and mixing with pigment were not ablated but discolored and bubbled due to laser-induced heat generation. Results of FT-IR showed no component alteration of shifted resins and no residues on the surfaces ablated by laser irradiation. From SEM-EDS for removed surfaces, the debris from epoxy resin and melting iron was observed. Therefore, this study demonstrated the possibilities and limitations for laser cleaning to remove epoxy resin from iron objects.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.227-230
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• 1998

The effects of post curing conditions on thermal properties of alumina filled epoxy resin system DGEBA/MDA/SN were investigated. As the post curing time increased at 15$0^{\circ}C$, the glass transition temperature increased from 121 to 124, slightly. As the heating rate increased, high thermal decomposing temperature (T$_{d}$) and most decomposing temperature (T$_{p}$) increased. For the case of post-cured system at 15$0^{\circ}C$ for 4 days showed lower values than virgin system. At the post curing condition the system must have been thermally degraded.ded.