• 한국안전학회지
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• 제25권1호
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• pp.1-8
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• 2010

The tensile and fatigue experiments were conducted with tensile-shear specimens for investigating the strength of adhesive bonded and mechanical press joints of SPCC steel sheet used in the field of the automobile industry. The optimal punch press force was evaluated 50kN for combining epoxy adhesive bonding and mechanical press joining with a diameter of 8.3mm using SPCC sheet with a thickness of 0.8mm. The combining epoxy adhesive bonding and mechanical press joining exhibits the maximum tensile force of 750N. The fatigue strengths of the combination of adhesive bond and mechanical press joint and pure adhesive joint were evaluated 370N and 320N at 106cycles, respectively. These values correspond to 22% and 20% of their maximum tensile forces, respectively. However, the fatigue strength of the combination of adhesive bond and mechanical press joining was much lower than that of pure mechanical press joining.

• 분석과학
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• 제24권5호
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• pp.336-344
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• 2011

문화재 보존처리 시 사용되는 에폭시계수지에 플라스틱 첨가제 중 하나인 자외선 안정제를 첨가함으로써 수지의 광노화를 예방하는데 효과가 있는지 알아보고자 하였다. 문화재 접합 및 복원 과정에서 많이 사용되는 3가지 에폭시계수지에 HALS계와 UVA계 자외선 안정제를 농도별로 첨가하여 시편을 제작하였으며, 자외선 노화 실험을 실시하여 색도 변화, SEM 관찰, 접촉각, FT-IR 분석을 하였다. 또한 인장 전단 접착 강도 시험을 통해 자외선 안정제 첨가 유무에 따른 에폭시계수지의 물성 변화를 확인하였다. 분석 결과, 자외선 안정제를 첨가하여도 화학 구조상의 분해를 방지할 수 없지만 에폭시 R과 에폭시 A는 UVA계 자외선 안정제를 0.1% 이하 첨가함으로써 에폭시계수지의 접착 강도에 크게 영향을 미치지 않고 황변현상이나 균열과 같은 광노화로부터 최소화 할 수 있음을 확인하였다. 이를 통해 문화재접합 및 복원에 사용되는 에폭시계수지의 광노화 문제점을 보완하고 접합 및 복원재로서의 수명을 연장시킬 수 있을 것으로 기대된다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.688-693
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• 2002

Adhesive bonding is becoming one of the popular joining techniques in metal industries, since it has some advantages over other techniques such as welding and diffusion bonding, e.g., any dissimilar metals are easily adhesive-bonded together. In this study, the experiments were carried out in order to provide the statistical data with strength evaluation methods: tension, shear and four-point bending tests for thermoplastic epoxy resin based adhesive-bonded metal joints. We should certificate on the probability of the adhesive strength that has the tendency of brittle fracture, the adhesive bonding strength between metals with thermoplastic adhesive has the best probability at four-point bending test. The strength testing method that has higher probability is four-point bending test, shear test and tensile test in order.

• Advanced Composite Materials
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• 제17권4호
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• pp.343-358
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• 2008

This present study provides the structural design and analysis of main wing, horizontal tail and control surface of a small scale WIG (Wing-in-Ground Effect) craft which has been developed as a future high speed maritime transportation system of Korea. Weight saving as well as structural stability could be achieved by using the skin.spar.foam sandwich and carbon/epoxy composite material. Through sequential design modifications and numerical structural analysis using commercial FEM code PATRAN/NASTRAN, the final design structural features to meet the final design goal such as the system target weight, structural safety and stability were obtained. In addition, joint structures such as insert bolts for joining the wing with the fuselage and lugs for joining the control surface to the wing were designed by considering easy assembling as well as more than 20 years service life.

• 한국문화재보존과학회:학술대회논문집
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• 한국문화재보존과학회 2006년도 제23회 학술대회 발표 논문집
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• pp.111-117
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• 2006

• 한국재료학회지
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• 제20권12호
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 춘계학술대회논문집
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• pp.131-135
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• 2003

The form-joining process (or clinching) uses a set of die and punch to impose the plastic deformation-induced geometric constraint on a sheet metal pair, But their joining strength ranges 50-70 percent of that of the resistance spot welding. In this paper, a new form-joining process with the aid of adhesive is proposed in which an epoxy adhesive is applied to a sheet metal pair, to improve joining strength. The strength and mechanical properties of the new process are discussed and compared for other joining processes.

• 한국재료학회지
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• 제22권9호
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of Welding and Joining
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• 제12권4호
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• pp.117-126
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• 1994

APAL (Aramid Patched ALuminum alloy) was manufactured, which was a material that was consisting of a A12024-T3 aluminum alloy plate bonded to single-side of it with aramid/epoxy laminates. The aramid/epoxy laminates were bonded to it in condition of 1, 2 ply and fiber orientation of .+-.45, 0.deg./90.deg. Fatigue crack propagation tests were performed at stress ratio R-0.2, 0.5 with Al 2024-T3, APAL 45-1P, APAL 0/90-1P, APAL 45-2P, APAL 0/90-2P specimens to examine behavior of retardation in fatigue crack propagation. All the APAL specimens showed superior fatigue crack resistance. Number of cycle spended for crack to propagate from $a_{M}$=37 to $a_{M}$=65 mm in case of APAL 0/90-2P specimen was half that of Al 2024-T3 specimen. Fatigue crack propagation rate of APAL 0/90 specimens were retarded more compared to APAL 45 specimens and the amounts of retardation at R=0.5 were larger than that at R=0.2. It was found that the retardation in fatigue crack propagation was caused by intact fibers in the wake of crack.ack.

• 한국분말재료학회지
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• 제15권2호
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• pp.119-124
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• 2008

To increase pot life in the formulation mixed with bisphenol F epoxy resin, anhydride-based curing agent, and imidazole-based curing accelerator powders as a paste material for high-speed RFID chip bonding, size variation of the imidazole-based powders and a coating method of the powders were adopted in this study. In experiment with regard to the size variation, the pot life was not outstandingly increased. Through the idea using the coating method, however, the pot life was increased up to 4.25 times in comparison with the addition of initial imidazole-based powders. Consequently, successive bonding of RFID chip could be performed with very short time of 5sec using the suggested formulation having improved pot life.