• Korean Journal of Materials Research
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• v.20 no.12
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• Journal of Adhesion and Interface
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• v.17 no.2
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• pp.56-61
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• 2016

This study was to investigate the effect of main monomer, butyl acrylate instead of 2-ethylhexyl acrylate, of acrylic PSAs on adhesive properties. The copolymers of butyl acrylate, acrylic acid and 2-hydroxyethyl acrylate were synthesized and their adhesive properties were investigated after crosslinking with two different agents. Comparing to 2-hydroxyethyl acrylate-based one which has branch-like side groups, butyl acrylate-based PSA with linear side groups show poor adhesive properties. In case of crosslinking agent, epoxy-typed agent than isocyanate-typed one showed better properties than isocyanate-typed one because epoxy-typed agent has more crosslinking sites and produces more flexible bonds, ester and ether, than isocynate-typed one. Most adhesive properties of PSAs were increased with acid content.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.783-790
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• 2004

Adhesive-bonded joints are widely used in the industry. Recently, applications of adhesive bonding joints have been increased extensively in automobile and aircraft industry. The strength of adhesive joints is influenced by the surface roughness, adhesive shape, stress distribution, and etc. However, the magnitude of the influence has not yet been clarified because of the complexity of the phenomena. In this study, as the fundamental research of adhesive bonding joints, the effects of adhesive shape and loading speed on bonding strength properties and durability of aluminum to polycarbonate single-lap joints were studied. To evaluate the effect of adhesive shape, several modified shapes were used, and loading speeds were varied from 0.05 to 5 mm/min. As a result, the load-displacement distribution was shown a brittle fracture tendency. The trigonal edged single lap and bevelled lap joints showed the higher strength than the plain single lap, trigonal single lap, joggle lap and double lap joints in same adhesive area. The fractures of trigonal single lap and trigonal edged single lap joints that had the higher strength level were shown as the mixture type of the cohesive and interfacial-failure, mostly joggle lap joints that had the lower strength level were shown as the adhesive-failure.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2012.11a
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• pp.13-14
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• 2012

This study investigates the effect of adhesive type applying to surface-strengthening Ondol floor on level of attachment. Adhesive materials of four types produced in different companies were prepared and their attaching performance was examined. Test results showed that the water-based epoxy type produced in S company was the most effective on attaching the pieces of the surface-strengthening Ondol floor product.

• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.1-7
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• 2004

A novel carboxyl terminated butadiene-acrylonitrile (CTBN) modified, low temperature cure epoxy film adhesive was developed in this paper. It can be cured at as low as $75^{\circ}C$ for 4 hours with a pressure of 0.1MPa. After post cure at $120^{\circ}C$ for 2 hours, the bonding strengths of Phosphoric Acid Anodizing(PAA) surface treated aluminum adherend were similar to those of structural film adhesives curing at $120^{\circ}C$. It is suitable to bond both metal/composite laminate-to-laminate and laminate to honeycomb structure.

• Journal of Adhesion and Interface
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• v.22 no.1
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• pp.8-15
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• 2021

In this study, a polyol was prepared using Jeffamine D-400 as a propylene glycol-based diamine to impart flexibility to the urethane-modified epoxy, and a urethane-modified epoxy was synthesized using the polyol. Urethane-modified epoxy synthesized with existing Bisphenol A diglycidyl ether (BADGE) epoxy, a curing agent, and a curing accelerator are mixed to prepare an epoxy adhesive, and shear strength is measured by measuring adhesion strength. As a result, shear strength and shear elongation tended to increase. These results are due to the high crosslinking density. It is believed that it can be applied to structural adhesives that are restricted in use.

• Composites Research
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• v.33 no.2
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• pp.55-60
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• 2020

A study on the heating behavior and adhesion property of structural epoxy adhesive through induction heating have been conducted. An adhesive for induction heating was manufactured through mixing with nano and micro sized Fe₃O₄. From the results, it was observed that induction heating is less affected by adherend (GFRP) thickness than oven heating. The heating rate of Fe₃O₄ embedded epoxy adhesive using induction heating much higher than that of oven curing process and it is more appreciable when the contents of Fe₃O₄ increased. Furthermore, adhesion strength increased with increase of Fe₃O₄ particle contents.

• Composites Research
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• v.29 no.5
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• pp.276-281
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• 2016

Improvement of the thermal and adhesion properties of stone/wood composites was studied. Tensile test was performed for wood and stone to know the basic mechanical properties. Real-time temperature of stone and wood was measured when stone and wood was heated. To compare thermal transfer properties of stone/wood composites, two types of specimens were tested: one was stone upper whereas another was wood upper. Real time temperature measurement and lap shear test were performed to know thermal and adhesion properties by using CNT-epoxy adhesive in which CNT was dispersed in epoxy adhesive uniformly. The thermal transfer property was better for the wood upper case than stone upper case. Adding CNT improved the heat transfer as well as mechanical properties including lap shear strength.

• Journal of Adhesion and Interface
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• v.2 no.2
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• pp.35-47
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• 2001

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.517-520
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• 2008

Recently, use of adhesive bonding technology is increased to achieve the multi-material design for lightweight structure in automobile industry. In this paper, the fracture strength of adhesive has been studied with the single lap shear test conducted at different temperatures. The joint specimens are made from Al 5052 and SPRC 440 bonded with structural epoxy adhesive. The operating temperature has been considered up to $150[^{\circ}C]$ and the single lap shear test has been conducted with 5mm/min tensile rate. Fracture strength of adhesive bonded joint has been decreased with increase of operating temperature. The fracture strength at the $100[^{\circ}C]$ was shown about half of that at room temperature.