• Korean Journal of Materials Research
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• v.21 no.5
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• Journal of Conservation Science
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• v.25 no.1
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• pp.77-86
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• 2009

The physical properties of the epoxy resins were studied with an addition of filler content and the application of artificial weathering test. When talc as a filler was added to the epoxy resin (L-30), the water resistance seemed to be increased because of the results of the reducing of water absorption rate and the increasing of contact angle. Although the adhesive strength of epoxy resins was not affected by the increasing amount of talc, its compressive strength was reduced. The physical properties of the epoxy resins had different trends according to the site environments. The artificial weathering test with the change of temperature and humidity showed that the changes of water absorption rate and colour differences of the epoxy resins containing talc were lower than the pure epoxy resin itself. However, the contact angle was higher. The artificial weathering test with ultraviolet irradiations showed the opposite result; the damage of epoxy resins was increased with the increasing of talc content. These mean the site environment of the stone monuments should be considered to determine the content of talc added to increase the durability of epoxy resin.

• The Journal of the Acoustical Society of Korea
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• v.16 no.2
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• pp.26-30
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• 1997

In this paper, the thickness measurement method of adhesive layers of multilayers using power cepstrum signal processing technique has been proposed. The peak values for reflected signal from each layer have been separated by power cepstrum technique. Therefore, thickness of adhesive layers have been measured by the intervals of peak signal. In the experiment, the adhesive layers of 0.5mm-0.75mm thickness using epoxy(2-Ton and Plastic Steel Putty(A)) between the aluminum and the brass were formed. The adhesive layer thickness which is calculated with data of reflected signal by ultrasonic pulse-echo method was within error 1.34% of the measured values.

• Journal of Electrical Engineering and Technology
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• v.8 no.3
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• pp.603-609
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• 2013

In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was $69^{\circ}$, and its surface energy was 18.6 $mJ/m^2$. Also, the substrate temperature was set at $70^{\circ}C$. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of $60{\mu}m$. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.35 no.8
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• pp.123-130
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• 2019

Recently, it is required to develop a monitoring technology that combines an FBG sensor as a means for continuously monitoring whether reinforcing effect of FRP is maintained on FRP reinforced structural members. However, most existing researches focus on the insertion of FBG sensors into bar-shaped FRPs, and there is insufficient study on the details strip-type FRPs combined with FBG sensors. Therefore, in this paper, it is studied to develop a reinforcement in which a FBG sensor is combined with a FRP strip. Especially, combination of FRP and FBG sensor. For this, a series of experiments were performed to find the adhesive strength of fiber-FRP-epoxy joints, the tensile strength of FBG sensor part with reflection-lattice, and the performance depending on the connection method of FRF and FBG sensor. As a result of the study, it was found that a minimum strength of $216.15N/mm^2$ is required for incorporating FBG sensors in FRP using epoxy. It is considered that the adhesion length of epoxy joints should be more than 50mm. When the FBG sensor is attached to the FRP strip as an epoxy, it is considered appropriate to use the complete attachment and the sensor non-attachment method.

• Transactions of the Korean Society of Automotive Engineers
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• v.8 no.1
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• pp.183-190
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• 2000

The objective of this work is to develop a criterion for predicting the failure strength of the joints bonded by ductile adhesives. To obtain a criterion, first, fracture tests were carried out for T-peel joint and Single-lap joint with widely differing joints geometries. Then using the fracture loads obtained at tests, the finite element analysis were performed, in which the stresses in the adhesive bonds were calculated in great detail. After examining four epoxy adhesives, it is concluded that the fracture of adhesively bonded joint occurs when the maximum of the ratio of the mean to effective stresses exceeds a constant value which can be determined from analysis and test for each adhesive.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.653-654
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• 2010

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.20 no.8
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• pp.727-733
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• 2010

Optical tables provide a platform for the establishment and test of measurement systems which use Laser. Therefore, not only static characteristics such as surface flatness, static stiffness and etc. but dynamic response characteristics is very important design parameter. The dynamic stiffness is generally estimated through the modal test, and compliance is used as a representative performance standard. Recently there is an example of defining the dynamic deflection coefficient and using it as a new performance standard of the dynamic stiffness, but it is not generalized yet in industry. In this study, we verify the validity of existing DDC calculus by making an experiment on granite. And for improvement in damping performance of optical tables, we are going to evaluate the effect of fillers on the compliance, then develop an epoxy adhesive based on the result of this experiment.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2001.05a
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• pp.106-109
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• 2001

In this work, we investigate the toughening mechanism of the rubber-modified epoxy resin. The fracture toughness($K_{IC}$) is measured using CT specimens for three kinds of rubber-modified epoxy resin with different rubber content. The damage zone and rubber particles around a crack tip of a damaged specimen just before fracture are observed by a polarization microscope and an atomic force microscope(AFM). Both the fracture energy($G_{IC}$) and the size of damage zone increase with the rubber content below l5wt%. The size of the rubber particles can be qualitatively correlated with the $G_{IC}$ and the size of damage zone. The cavitation of the rubber particles inside the damage zone is observed, which is expected to be main toughening mechanism by rubber particles. the stress which causes the cavitation of rubber particles is estimated by the Dugdale model.

• International Journal of Precision Engineering and Manufacturing
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• v.1 no.1
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• pp.33-41
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• 2000

Fiber reinforced metal laminates(FRMLs) were new type of hybrid materials. FRMLs consist of high strength metals(Al 5052-H34) and laminated fiber with structural adhesive bond. The effect of resin mixture ratios on the fatigue crack propagation behavior and mechanical properties of aramid fiber reinforced aluminum composites was investigated. The epoxy, diglycidylether of bisphenol A(DGEBA), was cured with methylene dianiline(MDA) with or without an accelerator(K-54). Eight kinds of resin mixture ratio were used for the experiment ; five kinds of FRMLs(1)(mixture of epoxy and curing agent) and three kinds of FRMLs(2)mixture of epoxy, curing agent and accelerator). The characteristic of fatigue crack propagation behavior and mechanical properties FRMLs(2) shows more effecting than that of FRMLs(1).