• Title/Summary/Keyword: Energy havesting

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마이크로 필러 제작을 위한 공정 연구

  • Ham, Yong-Su;Yun, Seok-U;Jeong, Sun-Jong;Kim, Min-Su;Go, Jung-Hyeok
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.107-107
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    • 2009
  • Micro pillar structure was investigated for the energy havesting applications. The micro pillar structures were investigated to find proper size of pillars. In this experiments, the aspect ratio between the height and diameter were changed to extract maximum peizoelectric coefficient. We proposed the idea and model for the energy harvesting systems based on the micro-pillar structure.

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Processing Study for the Micro Pillar for Piezoelectric Energy Harvest (압전 에너지 하베스트를 위한 마이크로 필라 공정 연구)

  • Yun, Seok-Woo;Lee, Ku-Tak;Lee, Kyoung-Su;Jeong, Soon-Jong;Kim, Min-Soo;Cho, Kyoung-Ho;Koh, Jung-Hyuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.8
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    • pp.601-604
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    • 2010
  • In this study, the piezoelectric energy harvester was investigated employing the pillar structure with the diameter size of 50~500 um. Usually, the aspect ratio between the height and diameter was related with the piezoelectric performance. High aspect ratio was showed the low electric noise and high piezoelectric properties than low aspect ratio. Therefore, we have selected the Su-8 photo-resist and modified lithography process to manufacture the pillar structure with height above the 250 ${\mu}m$. In this presentation, we will report the process and properties of micro pillar structure based on the PMN-PZT (Pb$(Mg_{1/3}Nb_{2/3})O_3$-PbZrTiO$_3$) materials.

A Study on the Relationship between Factors Affecting Soldering Characteristics and Efficiency of Half-cell Soldering Process with Multi-wires (Half-cell 기반 multi-wires 접합 공정에서 접합 특성에 영향을 주는 요인과 효율의 상관관계 연구)

  • Kim, Jae Hun;Son, Hyoung Jin;Kim, Sung Hyun
    • Current Photovoltaic Research
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    • v.7 no.3
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    • pp.65-70
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    • 2019
  • As a demand of higher power photovoltaic modules, shingled, multi-busbar, half-cell, and bifacial techniques are developed. Multi-busbar module has advantage for large amount of light havesting. And, half-cell is high power module for reducing resistive losses and higher shade tolerance. Recently, researches on multi-busbar is focused on reliability according to adhesion and intermetallic compound between Sn-Pb solder and Ag electrode. And half-cell module is researched to comparing with full-sized cell module for structure difference. In this study, we investigated the factors affecting to efficiency and adhesion of multi-wires half-cell module according to wire thickness, solder thickness, and flux. The results of solar simulator and peel test was that peel strength and efficiency of soldered cell is not related. But samples with flux including high solid material showed high efficiency. The results of FE-SEM and EDX line scan on cross-section between wire and Ag electrode for different flux showed thickness of solder joint between wire and Ag electrode is increasing through solid material increasing. Flux including high solid material would affect to solder behavior on Ag electrode. Higher solid material occurred lower growth of IMC layer because solder permeate to sider of wire ribbon than Ag electrode. And it increased fill factor for high efficiency. In soldering process, amount of solid material in flux and solder thickness are the factor related with characteristic of soldered photovoltaic cell.