• Journal of the Korean Society of Propulsion Engineers
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• v.16 no.1
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• pp.55-63
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• 2012

The turbulent flow characteristics in a coaxial injector were investigated by the nonlinear $k-{\varepsilon}-f_{\mu}$ model of Park et al.[1] and large eddy simulation (LES). In order to analyze the geometric effects on the scalar mixing for nonreacting variable-density flows, several recessed lengths and momentum flux ratios are selected at a constant Reynolds number. The nonlinear $k-{\varepsilon}-f_{\mu}$�� model proposed the meaningful characteristics for various momentum flux ratios and recess lengths. The LES results showed the changes of small-scale structures by the recess. When the inner jet was recessed, the development of turbulent kinetic energy became faster than that of non-recessed case. Also, the mixing characteristics were mainly influenced by the variation of shear rates, but the local mixing was changed by the adoption of recess.

• The Transactions of the Korean Institute of Electrical Engineers B
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• v.48 no.1
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• pp.19-26
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• 1999

A moving-coil-type linear motor, designed and fabricated, is consisted of the NdFeB permanent magnets with high specific energy as the stator, a coil-wrapped nonmagnetic hollow rectangular structure and an iron core as a pathway for magnetic flux. The interaction between permanent magmet and armature fie1d, so called "push/pull effect", is to shift the airgap flux density variation due to the magnet alone by a certain amount. Thrust therefore is shift downward or upward. The push/pull effect was presented through the FEM analysis and the static tests. We compared the thrust obtained through the FEM analysis with the static tests. Finally, we present the linearity and correction coefficients of the thrust in consideration of the push/pull effects.l effects.

• KIEE International Transaction on Electrical Machinery and Energy Conversion Systems
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• v.3B no.4
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• pp.165-172
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• 2003

Low voltage circuit breakers are widely used in power distribution systems to interrupt fault current rapidly and to assure the reliability of the power supply. This paper is focused on understanding the interrupting capability, more specifically of the contacts and the arc runner, based on the shape of the contact system in the current molded case circuit breaker (hereafter MCCB). Moreover, in order to improve the interrupting capability of the circuit breaker, the estimation and analysis of the interrupting capability, based on the 3-D magnetic flux analysis, were developed. Furthermore, this paper also presents results of the estimation and analysis of the interrupting capability when applied to different model breakers. In addition, this paper analyzes the efficiency of the interrupting tests by forming false current paths consisting of a three-division cascade arc runner in the contact system. With regards to the interrupting test, there is a need to assure that the optimum design required to analyze the electromagnetic forces of the contact system generated by the current and flux density be present. Based on the results of this study, this paper presents both computational analysis and test results for the newly developed MCCB 460V/225A/50㎄ contact system.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.7
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• pp.782-787
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• 2004

Superconducting flux flow transistor (SFFT) is based on a control of the Abrikosov vortex flowing along a channel. The induced voltage by moving of the Abrikosov vortex in an SFFT is greatly affected by the thickness, the width, and the length of channel. In order to fabricate a reproducible channel in the SFFT, we studied the variation of the critical characteristics of ${YBa}_2{Cu}_3{O}_7-\delta(YBCO)$ thin films with the etching time using ICP (Inductively coupled plasma) system. From the simulation, it was certified that the vortex velocity was increased in a low pinning energy at channel width 0,5 mm. The surfaces of YBCO thin film were etched by ICP etching system. We observed the etched channel surfaces by AFM (Atomic Force Microscope) and measured the critical current density with etching time. As a measured results, the etching thickness of channel should be optimized to fabricated a flux flow transistor with specified characteristics.

• Progress in Medical Physics
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• v.27 no.3
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• pp.125-130
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• 2016

Dual energy computed tomography (DECT) is used to classify two materials and quantify the mass density of each material in the human body. An energy modulation filter based DECT could acquire two images, which are generated by the low- and high-energy photon spectra, in one scan, with one tube and detector. In the case of DECT using the energy modulation filter, the filter should perform the optimization process for the type of materials and thicknesses for generating two photon spectra. In this study, Geant4 Monte-Carlo simulation toolkit was used to execute the optimization process for determining the property of the energy modulation filter. In the process, various materials used for the energy modulation filter are copper (Cu, $8.96g/cm^3$), niobium (Nb, $8.57g/cm^3$), stannum (Sn, $7.31g/cm^3$), gold (Au, $19.32g/cm^3$), and lead (Pb, $11.34g/cm^3$). The thickness of the modulation filter varied from 0.1 mm to 1.0 mm. To evaluate the overlap region of the low- and high-energy spectrum, Geant4 Monte-Carlo simulation is used. The variation of the photon flux and the mean energy of photon spectrum that passes through the energy modulation filter are evaluated. In the primary photon spectrum of 80 kVp, the optimal modulation filter is a 0.1 mm lead filter that can acquire the same mean energy of 140 kVp photon spectrum. The lead filter of 0.1 mm based dual energy CBCT is required to increase the tube current 4.37 times than the original tube current owing to the 77.1% attenuation in the filter.

• Journal of Powder Materials
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• v.15 no.3
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• pp.182-187
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• 2008

Carbon was known to be one of effective additives which can improve the flux pinning of $MgB_2$ at high magnetic fields. In this study, glycerin $(C_3H_8O_3)$ was selected as a chemical carbon source for the improvement of critical current density of $MgB_2$. In order to replace some of boron atoms by carbon atoms, the boron powder was heat-treated with liquid glycerin. The glycerin-treated boron powder was mixed with an appropriate amount of magnesium powder to $MgB_2$ composition and the powder pallets were heat treated at $650^{\circ}C\;and\;900^{\circ}C$ for 30 min in a flowing argon gas. It was found that the superconducting transition temperature $(T_c)$ of $Mg(B_{1-x}C_x)_2$ prepared using glycerin-treated boron powder was 36.6 K, which is slightly smaller than $T_c$(37.1 K) of undoped $MgB_2$. The critical current density $(J_c)$ of $Mg(B_{1-x}C_x)_2$ was higher than that of undoped $MgB_2$ and the $T_c$ improvement effect was more remarkable at higher magnetic fields. The $T_c$, decrease and $J_c$ increase associated with the glycerin treatment for boron powder was explained in terms of the carbon substitution to boron site.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.6
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• pp.234-238
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• 2005

Effects of plasma composition, ion flux and ion energy on the etch rate, surface morphology and near surface stoichiometry of a single crystalline $La_3Ga_5SiO_{14}$ wafer have been examined in $Cl_2/Ar$ inductively coupled plasma (ICP) discharges. Maximum etch rate ${\sim}1600{\AA}/min$ was achieved either at relatively high source power $({\sim}1000W)$ or high $Cl_2$ content conditions in $Cl_2/Ar$ discharges. The etched surfaces showed similar or better RMS roughness values than those of the unetched control sample and the near surface stoichiometry was found not to be affected by ICP etching.

• Journal of Microbiology and Biotechnology
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• v.16 no.6
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• pp.993-998
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• 2006

We earlier suggested a hierarchical regulatory network using defined modeling symbols and weights in order to improve the flux balance analysis (FBA) with regulatory events that were represented by if-then rules and Boolean logic. In the present study, the simulation results of the models, which were developed and improved from the previou model by incorporating a hierarchical regulatory network into the FBA, were compared with the experimental outcome of an aerobic batch growth of E. coli on glucose and tryptophan. From the experimental result, a diauxic growth curve was observed, reflecting growth resumption, when tryptophan was used as an alternativee after the supply of glucose was exhausted. The model parameters, the initial concentration of substrates (0.92 mM glucose and 1 mM tryptophan), cell density (0.0086 g biomass/1), the maximal uptake rates of substrates (5.4 mmol glucose/g DCW h and 1.32 mmol tryptophan/g DCW h), and lag time (0.32 h) were derived from the experimental data for more accurate prediction. The simulation results agreed with the experimental outcome of the temporal profiles of cell density and glucose, and tryptophan concentrations.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.3
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• pp.319-324
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• 2013

In this study, an EP (electro-polishing)-MAP (magnetic abrasive polishing) hybrid process was developed as a precision finishing process. To evaluate the characteristics of this EP-MAP hybrid process, a series of experiments were carried out using various working gaps, current densities, and electrolyte concentrations. As a result, $NaNO_3$ was found to be very suitable as the electrolyte of the hybrid process because there was no electrochemical reaction with the CNT-Co composite. Moreover, an increase in the magnetic flux density affected the liquidity of the electrolyte and prevented it from flowing into the CNT-Co composite powder. For that reason, the lower liquidity of the electrolyte increased the thermal energy on the surface of the workpiece.