• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1995년도 춘계학술대회 논문집
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• pp.477-480
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• 1995

Dccisions of optimal filling conditions for the chip encapsulation have been done primarily by an ad hoc use of expertise accumulated over the years because the chip encapsulation process is quite complicated. The current CAE systems do not provide mold designers with necessary knowledge of the chip encapsulation for the successful design of optimal filling except flow simulation capability. There have been no attempts to solve the optimal filling problem in the process of the chip encapsulation. In this paper, we have constructed an design system for optimal filling to avoid short shot in the chip encapsulation process which combines an optimization methodology with CAE software.

• 마이크로전자및패키징학회지
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• 제9권1호
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• pp.43-48
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• 2002

Semiconductor chip encapsulation process is employed to protect the chip and to achieve optimal performance of the chip. Expert decision-making to obtain the appropriate package design or process conditions with high yields and high productivity is quite difficult. In this paper, an expert system for semiconductor chip encapsulation has been constructed which combines a knowledge-based system with CAE software.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.431-431
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• 2013

Flexible Organic Light Emitting Diode (OLED) displays are required for future devices. It is possible that plastic substrates are instead of glass substrates. But the plastic substrates are permeable to moisture and oxygen. This weak point can cause the degradation of fabricated flexible devices; therefore, encapsulation process for flexible substrate is needed to protect organic devices from moisture and oxygen. Y.G. Lee et al.(2009) [1] reported organic and inorganic multilayer structure as an encapsulation barrier for enhanced reliability and life-time.Flowable Oxide process is a low-temperature process which shows the excellent gap-fill characteristics and high deposition rate. Besides, planarization is expected by covering dust smoothly on the substrate surface. So, in this research, Bi-layer structured is used for encapsulation: Flowable Oxide Thin film by PECVD process and Al2O3 thin film by ALD process. The samples were analyzed by water vapor transmission rate (WVTR) using the Calcium test and film cross section images were obtained by FE-SEM.

• 전기학회논문지
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• 제63권10호
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• pp.1412-1416
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• 2014

We report thin-film organic moisture barriers based on polystyrene(PS) laminates deposition by PECVD for an encapsulation of OLEDs. The organic polystyrene thin-film has the benzene ring structure and high hydrophobic characteristics and it was polymerized by PECVD in dry process. Life time properties of Ca test were obtained 32 minutes at the RF 100W process conditions. From the AFM test, the roughness of multi-layer thin-film was more excellent rather than that of a single-layer thin-film. In addition, 5 layers of the multi-layer film properties were obtained 45 minutes. So that the optical and electrical properties were not affected with these plasma polymerized organic thin-film encapsulation. For life time improvement, the inorganic $Al_2O_3$ thin-film were deposited 5nm using ALD atomic layer deposition. The WVTR(Water Vaper Transmission Rate) value of hybrid thin-film encapsulation in the optimum process conditions was resulted by less than $10-3g/m^2/day$. From the results of experiment, plasma polymerized hybrid encapsulation was suggested as the flexible display applications.

• 한국정밀공학회지
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• 제13권12호
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• pp.13-21
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• 1996

In this paper, methods to reduce wire sweep during the chip-encapsulation process have been studide. Two methods have been tried for this purpose, namely runner balancing and ram velocity control. Runner balancing has been achieved automatically by using a computer program. Ram-velocity control has been achieved using empirical rules and results from a flow simulation of the encapsulation process. A mold which has 12 cavities for chip has been used as a case study. The simulation results show that the wire sweep obtained from the optimal process condition is about 1/5 of that from initial, unoptimized condition.

• 반도체디스플레이기술학회지
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• 제21권1호
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• pp.39-43
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• 2022

In this paper, a study was conducted on encapsulation technology for high mechanical stability of flexible displays. First, unlike conventional encapsulation barrier that exclude cracks as much as possible for low water vapor transmission rate (WVTR), mechanical properties were improved by using a defect suppression mechanism introduced with crack arresters. The zero-stress encapsulation barrier optimizes the residual stress of the thin film based to improve the internal mechanical stability. The zero-stress encapsulation barrier was applied to the organic light emitting diodes (OLEDs) to confirm its characteristics and lifetime. Due to improved internal mechanical stability, it has a longer lifetime more than 35% compared to conventional encapsulation technologies. As the zero-stress encapsulation barrier proposed in this study does not require additional deposition process, it is not difficult to apply it. Based on various advantages, it is expected to play an important role in flexible displays.

• 소성∙가공
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• 제21권2호
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• pp.101-106
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• 2012

Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.

• 한국정밀공학회지
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• 제15권2호
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• pp.99-106
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• 1998

In this paper, we have constructed an expert system for semiconductor chip encapsulation which combines a knowledge-based system with CAE software. The knowledge-base module includes heuristic and pre analysis knowledge for evaluation and redesign. Evaluation of the initial design and generation of redesign recommendations can be developed from the rules as applied to a given chip package. The CAE programs can be used for simulating the filling and packing stage of encapsulation process. The expert system is a new tool which enables package design or process conditions with high yields and high productivity.

• 공업화학
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• 제35권2호
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• pp.115-121
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• 2024

본 연구는 W1/O/W2 이중유화법을 통한 마이크로 캡슐화 공정을 최적화하기 위해 역미셀(reverse micelle), salt 농도 등의 열역학적 변수와 유체의 점도, 계면장력 등 계면의 유동에 영향을 미치는 공정변수들의 영향성을 분석하였다. 아스코르브산의 PLA (polylactic acid) 미립자 내부로의 캡슐화 효율에 가장 큰 영향을 미치는 변수는 W1과 W2상의 삼투압의 차이로 W2상의 salt 농도를 높이거나, W1상의 아스코르브산 농도를 줄이면 캡슐화 효율이 높아짐을 관찰하였다. 또한, 삼투압의 차이가 클수록 미립자 표면의 손상이 심해짐을 확인할 수 있었다. 캡슐화 효율을 높일 것으로 예상되었던 역미셀 도입은 그 기여도가 낮거나 오히려 캡슐화 효율을 낮추었다. 마이크로캡슐의 수율은 공정 조건, 용액 조성 등과 상관없는 universal 함수로 표현하였는데, Ca > 20에서는 더 이상의 수율 증가가 관찰되지 않았다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.470-473
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• 2005

Spent nuclear fuels are regarded as a high level radioactive waste and they will be disposed in a deep geological repository. To maintain the safety of the repository for hundreds of thousands of years, the spent fuels are encapsulated in a disposal canister and the canister containing spent fuels should have the structural integrity and the corrosion resistance below the several hundreds meters from the ground surface. In this study, the concept of the spent fuel encapsulation process and the process equipment fur deep geological disposal were established. To do this, the design requirements, such as the functions and the spent fuel accumulations, were reviewed. Also, the design principles and the bases were established. Based on the requirements and the bases, the encapsulation process and the equipment from spent fuel receiving process to transferring canister into the underground repository including hot cell processes was established. The established concept of the spent fuel encapsulation process and the process equipment will be improved continuously with the future studies. And this concept can be effectively used in implementing the reference repository system of our own case.