• 한국전기전자재료학회논문지
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• 제25권10호
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• pp.849-856
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• 2012

Chip on board type white light emitting diode on metal core printed circuit board with high thixotropy silicone is fabricated by vacuum printing encapsulation system. Encapsulant is chosen by taking into account experimental results from differential scanning calorimeter, shearing strength, and optical transmittance. We have observed that radiant flux and package efficacy are increased from 336 mW to 450 mW and from 11.9 lm/W to 36.2 lm/W as single dome diameter is varied from 2.2 mm to 2.8 mm, respectively. Double encapsulation structure with 2.8 mm of dome diameter shows further significant enhancement of radiant flux and package efficacy to 667 mW and 52.4 lm/W, which are 417 mW and 34.8 lm/W at single encapsulation structure, respectively.

• E2M - 전기 전자와 첨단 소재
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• 제10권6호
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• pp.519-527
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• 1997

The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

• Current Photovoltaic Research
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• 제8권4호
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• pp.129-133
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• 2020

It is very important to optimize the reflectance of incident light in solar modules for improving output power and reducing loss of cell-to-module (CTM). It is assumed that a higher reflectance backsheet may improve optical efficiency. However how much output power is related to optical properties by reflectance property of backsheets have not been revealed clearly yet. A total of 3 types of industrial backsheets with 3 type of industrial encapsulants (EVA or POE) were analyzed as fabricated mini modules used shingled cells. According to the type of backsheets, the difference between the highest and lowest average reflectance in the range of 400 nm to 1200 nm was found to be 13.08% by UV-visible spectroscopy. Also, when using the same encapsulant, the maximum gap value of the output power increase was measured by about 3.755 mW% (166.02 mW). The correlation between reflectance and output power was experimentally found by measuring the output property of the fabricated shingled mini modules.

• Current Photovoltaic Research
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• 제8권4호
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• pp.124-128
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• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.

• Journal of Radiation Protection and Research
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• 제20권4호
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• pp.237-243
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• 1995

파라핀 왁스를 사용하여 건조된 농축폐액을 고화시킬 경우, 방사선적 가수분해에 의해 발생할 가능성이 있는 수소가스의 발생량을 추정하여 보았다 분석결과에 의하면, 코발트 60의 방사선 에너지에 의해 방사선적 가수분해가 주로 발생함을 알 수 있다. 200리터 드럼중 120 리터가 파라핀으로 채워졌다고 가정할 때 수소가스 발생은 초기에 $4.4{\times}10^2cm^3yr^1$이고 100년이 경과한 후는 $7.2cm^3yr^1$로 줄어든다. 수소에 의한 발화점을 25년이 경과한 후 도발할 가능성이 있으나, 폭발한계에는 1000년 이내에 도달할 가능성이 없다. 안전성 관련 주요 한계점에 도달하는 시기는 드럼내 파라핀 왁스의 채움 정도에 매우 민감하게 영향을 받는다 드럼내 공간의 감소시, 발화점에 도달 시간이 줄어듬을 알 수 있다.

• 마이크로전자및패키징학회지
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• 제27권4호
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• pp.55-60
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• 2020

태양광 발전소에 설치된PERC 태양광 모듈 스트링-어레이는 고전압의 전위차로 인해 여전히 potential-induced degradation(PID) 열화 현상이 여전히 보고되고 있다. 이는 태양전지 모듈 커버글라스의 Na+ 이온이 태양전지 봉지재(EVA)를 투과하여 셀 표면으로 전이되고 결함이 많이 분포되어 있는 ARC(SiOx/SiNx) 계면에 양전하가 축적됨으로써 shunt-Resistance(Rsh)가 감소되고 누설전류량이 증가되어 태양전지 출력이 저하되는 현상이다. 본 연구에서는 이를 방지하기 위해 나노임프린트 리소그래피(nano-imprint lithography, NIL) 방식을 이용하여 모스아이(Moth-eye) 나노 구조를 광학 필름 후면에 증착 하였고, 이를 커버글라스와 EVA 사이에 삽입하여 태양광 미니 모듈을 구성하였다. PID 열화 현상을 확인하기 위해 IEC 62804-1 규격에 기반한 셀 단위 PID 열화가속시험을 진행하였고, Light I-V, Dark I-V 분석을 통해 출력(Pmax), 효율(Efficiency), 병렬 저항(shunt resistance)을 확인하였다. 그 결과 기존의 태양전지는 초기 효율 19.76%에서 6.3% 감소하였으나 모스아이 나노 구조 광학 필름(Moth-eye film)이 적용된 태양전지는 0.6% 만 감소하여 PID 열화 현상이 방지되는 것을 확인하였고, 모스아이 나노구조를 통해 투과도가 4% 향상되어 미니 모듈 출력이 2.5% 향상되었다.