• 한국정밀공학회지
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• 제28권2호
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

• 대한기계학회논문집B
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• 제25권12호
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• pp.1667-1675
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• 2001

Numerical simulations are carried out for the liquid encapsulant Czochralski(LEC) by imposing a magnetic field. The use of a magnetic field to the crystal growth is to suppress melt convection and to improve the homogeneity of the crystal. In the present numerical investigation, we focus on the range of 0-0.3Tesla strength for the axial and cusped magnetic field and the effect of the magnetic field on the melt-crystal interface, flow field and temperature distribution which are the major factors to determine the quality of the single crystal are of particular interest. For both axial and cusped magnetic field, increase of the magnetic field strength causes a more convex interface to the crystal. In general, the flow is weakened by the application of magnetic field so that the shape of the melt-crystal interface and the transport phenomena are affected by the change of the flow and temperature field.

• Current Photovoltaic Research
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• 제6권3호
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• pp.81-85
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• 2018

The photovoltaic modules installed in the actual field are affected by various external environments and the electrical performance output value is generally lowered compared to initial output value. The most of photovoltaic modules consists of low iron glass, encapsulant (EVA), back sheet, frame and junction box assembly based on the solar cells. In this paper, the characteristics of encapsulant which is an important constituent material of photovoltaic module were verified by maximum power determination, electro luminescence images, yellowness index measurement, and gel content measurement after ultraviolet (UV) irradiation exposure. The most commonly installed 72 cells crystalline photovoltaic modules were tested after various UV exposure of 0, 15, 30, and $60kWh/m^2$ and compared with the reference module. After UV exposure of $15kWh/m^2$, which is the current international test condition, a small amount of change was observed in yellowness index and electroluminescence, while a gell content rapidly increased. At a cumulative dose of $60kWh/m^2$, which will be a new international test condition in the near future, however, the yellowness index increased sharply and showed the greatest output power drop.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 국제표면실장및인쇄회로기판생산기자재전 전자패키지 기술세미나
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• pp.45-58
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• 2005

• International Journal of Korean Welding Society
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• 제4권1호
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• pp.61-66
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• 2004

In this paper, the effect of underfill packages was investigated by numerical approach and experimental test. Reliability improvement was the main issue in the package technology. BGA, CSP and small-sized packages, have problems due to concentration of the stress in solder joints. One of the latest technologies to overcome is underfill encapsulant. Mainly, it is noticed the effect of the underfill in the packages. The predicted thermal fatigue lifes are performed by Coffin-Manson's equation with ANSYS (v.5.62). Also, thermal cycle test during from 218K to 423K was included. Finally we could find that underfill greatly reduce the concentration stress in solder joint, thus the fatigue life was improved than without underfill.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.134-137
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• 2001

The cure kinetics of a cycloalipatic epoxy / anhydride / Co(II) system for a no-flow underfill encapsulant, has been studied by using a differential scanning calorimetry(DSC) under isothermal and dynamic conditions over the temperature range of $160^{\circ}C ~220^{\circ}C$. The kinetic analysis was carried out by fitting dynamic/isothermal heating experimental data to the kinetic expressions to determine the reaction parameters, such as order of reaction and reaction constants. Diffusion-controlled reaction has been observed as the cure conversion increases and successfully analyzed by incorporating the diffusion control term into the rate equation. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperature.

• Journal of Welding and Joining
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• 제21권4호
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2008년도 춘계학술발표대회 논문집
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• pp.92-97
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• 2008

To survive in outdoor environments, photovoltaic modules rely on packaging materials to provide requisite durability. We analyzed the properties of encapsulant materials that are important for photovoltaic module packaging. The properties of Ethylene Vinyl Acetate(EVA) sheet in photovoltaic encapsulant materials have to meet conditions that are high optical transmittance, good adhesion and high cross-linking rate. The objective of this paper is to understand the property evaluation methods of EVA sheet. Through this research, we could confirm that properties of EVA sheet have an effect on durability and operating efficiency of photovoltaic module.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 추계 기술심포지움 논문집
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• pp.43-46
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• 2000

• 한국전기전자재료학회논문지
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• 제35권3호
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• pp.281-291
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• 2022

Global warming is accelerating due to the use of fossil fuels that have been used continuously for centuries. Now, humankind recognizes its seriousness, and is conducting research on searching for eco-friendly and sustainable energy. In the field of solar energy, which is a kind of eco-friendly and sustainable, many studies are being conducted to enhance the output performance of the module. In this study, the output improvement for the shingled module structure was studied. In order to improve the output performance of the module, the thickness of the encapsulant was increased, and the lamination process conditions have been improved accordingly. After that, the crosslinking rate was analyzed, and the suitability of the lamination process conditions was judged using this. In addition, a peeling test was conducted to analyze the correlation between the adhesion of the encapsulant and the output performance of the module. Finally, the optimization for the encapsulant material and the lamination process conditions for high-power shingled modules was established, and accordingly, the market share of high-power shingled modules in the solar module market can be expected to rise.