• Title/Summary/Keyword: Embosing

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A Study on the cracks ways minimizing at circular forming (원형포밍 성형 시 크랙 발생 최소화 방안에 관한 연구)

  • Son, Jong-Min;Kim, Sei-Whan;Lee, Chun-Kyu
    • Design & Manufacturing
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    • v.10 no.3
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    • pp.20-24
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    • 2016
  • Foaming is a step of forming by the ratio of the internal combustion chamber in a state where the in flow of the material is suppressed, if the diameter is small and a high to a crack generated on the molding is not possible. The present study, we studied using as part experiments for forming the circular shape of the forming height of 10 mm without the occurrence of cracks, results preformed primary, the need to set the height of the forming than the height of the product, preformed secondary. It was able to increase the height of the molded product with less than the height of the next step to be carried out compression processing to create a small comer of the desired shape. In addition, it was found that on a great influence on the quality of the final quality on the final molding of the primary preformed, secondary.

NUMERICAL SIMULATION OF THERMAL CONTROL OF A HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY MACHINES (고온 나노임프린트 장비용 핫플레이트의 열제어에 대한 수치모사)

  • Park, G.J.;Kwak, H.S.;Shin, D.W.;Lee, J.J.
    • 한국전산유체공학회:학술대회논문집
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    • 2007.04a
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    • pp.153-158
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    • 2007
  • Since the introduction of Nanoimprint in the mid-1990s, Nanoimprint lithography, a low-cost, non-convential method, has been the dominant lithography technology that guarantees high-throughput patterning of nanostructures. Based on the mechanical embossing mechanism, Nanoimprint lithography creates the nanopatterns on the polymer material cast on the substrate. In essence, the process needs nanofabrication equipment for printing with the adequate control of temperature, pressure and control of parallels of the stamp and substrate. This article introduce the possibility and reality of the thermal control on the hot plate using a CFD code. Numerical computation has been conducted for assessing the feasibility of a hot plate($120{\times}120\;mm2$). PID control is adopted to ensure high temperature uniformity in several zones. Parallel experiments have also been performed for verifying thermal performance. Not only show the results the optimum number of thermocouples related to controllers but also suggest that the thermal simulation using a CFD code would be an alternative method to design and develop the thermal control equipment in the financial aspect.

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