• 대한전자공학회논문지SD
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• 제47권9호
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• pp.7-13
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• 2010

본 논문은 스마트폰, 타블렛 PC와 같은 개인용 정보 단말장치 응용에 적합한 프로세서 구조를 제안한다. 고성능 내장형 프로세서 개발은 아키텍쳐의 변화가 필요하고, 오버헤드가 크기 때문에, 업계에서는 높은 동작 주파수의 고성능 내장형 프로세서의 개발에 전념하고 있다. 고성능 프로세서 구조 중 비순차 슈퍼스칼라(out-of-order superscalar)는 하드웨어 복잡도가 과도하게 증가하며, 그에 비해 성능 향상이 적으므로 내장형 응용에 적합하지 않다. 따라서 하드웨어 복잡도가 낮은 고성능 내장형 프로세서 구조의 개발이 필요하다. 본 논문에서는 스칼라, 슈퍼스칼라, 멀티프로세서 방식에 비하여 복잡도가 낮은 새로운 SMT(Simultaneous Multi-Threading) 구조를 제안한다. 최근의 개인용 정보단말기는 많은 작업을 동시에 수행하기 때문에, SMT나 CMP는 이에 적합한 구조라 할 수 있다. 또한, 시뮬레이션 결과 SMT는 여러 프로세서 구조 중 가장 효율이 높은 프로세서로 보인다.

• 대한임베디드공학회논문지
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• 제5권4호
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• pp.217-224
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• 2010

Nowadays, people perform their tasks anywhere anytime using their mobile devices. For this reason, data synchronization (DS) between mobile devices and a central server has become one of the most essential technologies in mobile environments. Currently, several mobile DS protocols are proposed and used. However, the existing DS protocols cannot guarantee interoperability between them. To solve the problem, an embedded DS gateway has been developed in our previous study. The gateway runs on a Windows Mobile-based emulator. It converts data on a mobile device into common data specified by OMA DS standard protocol and vice versa. The embedded gateway has been built to support the OMA DS standard protocol. In order to verify that the embedded gateway conforms to the OMA DS standard protocol, two kinds of OMA conformance tests have to be conducted - interoperability test with an OMA DS-based server and conformance test with SCTS (SyncML Conformance Test Suit). In this paper, some parts of the gateway previously built are modified and the modified gateway is installed on a Windows Mobile-based smart phone. And the interoperability test and the conformance test with the SCTS are conducted. The results of the tests show that the embedded DS gateway operates properly on the Windows Mobile-based smart phone and that the gateway passes the tests, verifying its conformity to the OMA DS standard protocol. In addition, DS performance tests show that DS delay times between a real smart phone and a DS server increase gently as the number of DS data increases. In other words, the embedded DS gateway built in this paper can be used for a real smart phone at a reasonable performance cost.

• 대한임베디드공학회논문지
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• 제5권4호
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• pp.195-205
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• 2010

The popularity of Smartphones makes new fields of applications based on location based service easily feasible with a new user interface called augmented reality (AR). It presents a particularly powerful user interface to context-aware computing environments. AR on Smartphones integrates virtual information into a person's physical environment by overlaying information on an image taken through Smartphone's camera and motion sensors. Mobile augmented reality systems provide this service without constraining the individual's whereabouts to a specially equipped area. This work presents an overview of handheld augmented reality focusing on applications with introducing the basic issues of them. For this purpose, an example system, Studierstube ES (embedded system), is cited, which introduces the most significant problems and various methods of solving them through the experience of converting existing PC-based AR system into handheld AR.

• 대한임베디드공학회논문지
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• 제5권4호
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• pp.175-184
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• 2010

This paper designs a virtual USB drive for mobile devices which gives an illusion of a traditional USB flash memory drive and provides capacity-free storage space over IP network. The virtual USB drive operating with a S3C2410 hardware platform and embedded linux consists of USB device driver, an iSCSI-enabled network stack, and a seamless USB/iSCSI tunneling module. For performance enhancement, it additionally provides a kernel-level seamless USB/iSCSI tunneling module and data sharing with symbol references among kernel modules. Experiments reveal that the kernel-level implementation can improve the I/O performance up to 8 percentage, as compared with the user-level implementation.

• Journal of Information Processing Systems
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• 제13권1호
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• pp.26-39
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• 2017

The need for embedded devices to be able to exchange information with each other and with data centers is essential for the advent of the Internet of Things (IoT). Several existing communication protocols are designed for small devices including the message-queue telemetry transport (MQTT) protocol or the constrained application protocol (CoAP). However, most of the existing implementations are convenient for computers or smart phones but do not consider the strict constraints and limitations with regard resource usage, portability and configuration. In this paper, we report on an industrial research and development project which focuses on the design, implementation, testing and deployment of a MQTT module. The goal of this project is to develop this module for platforms having minimal RAM, flash code memory and processing power. This software module should be fully compliant with the MQTT protocol specification, portable, and inter-operable with other software stacks. In this paper, we present our approach based on abstraction layers to the design of the MQTT module and we discuss the compliance of the implementation with the requirements set including the MISRA static analysis requirements.

• 대한임베디드공학회논문지
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• 제6권4호
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• pp.231-241
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• 2011

Recently, system virtualization has been applied to consumer electronics (CE) such as smart mobile phones. Although multi-core processors have become a viable solution for complex applications of consumer electronics, the issue of utilizing multi-core resources in the virtualization layer has not been researched sufficiently. In this paper, we present a new hypervisor design and implementation for multi-core CE devices. We concretely describe virtualization methods for a multi-core processor and multi-core-related subsystems. We also analyze bottlenecks of network performance in a virtualization environment that supports multimedia applications and propose an efficient virtual interrupt distributor. Our new multi-core hypervisor improves network performance by 5.5 times as compared to a hypervisor without the virtual interrupt distributor.

• 센서학회지
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• 제31권1호
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2008년도 제34회 동계학술대회 초록집
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• pp.126-126
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• 2008

• 한국공작기계학회논문집
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• 제17권2호
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• 대한임베디드공학회논문지
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• 제7권2호
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• pp.95-101
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• 2012

In order to supply emotion service depending on user's emotional change in a mobile environment, various researches have been carried. This paper discusses a protocol for wireless charging and an embedded platform of the mobile emotional sensing device which supports that. Wireless charging process relieves user's vexatious task to charge the emotional sensing device. To support wireless charging, there are one basestation and several mobile devices. Basestation coordinates and controls the devices over wireless communication, as well as supplies energy. For 1:N communication we defines the network whose superframe is classified into four categories: a network join superframe, a charging request superframe, a charging superframe and an inactive superframe. Physical layer provides how to supply energy to the devices and communicate physically. Mobile device is equipped with energy charged circuits, which correspond with the defined energy supplying method, as well as bidirectional communication circuits. Mobile device monitors and analyzes its own battery status, and is able to send a request packet to basestation. Therefore, it can be charged before its battery is exhausted without user's perception.