• Title/Summary/Keyword: Embedded chip

검색결과 372건 처리시간 0.026초

임베디드 영상 응용을 위한 GP_SoC (A SoC based on the Gaussian Pyramid (GP) for Embedded image Applications)

  • 이봉규
    • 전기학회논문지
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    • 제59권3호
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    • pp.664-668
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    • 2010
  • This paper presents a System-On-a-chip (SoC) for embedded image processing and pattern recognition applications that need Gaussian Pyramid structure. The system is fully implemented into Field-Programmable Gate Array (FPGA) based on the prototyping platform. The SoC consists of embedded processor core and a hardware accelerator for Gaussian Pyramid construction. The performance of the implementation is benchmarked against software implementations on different platforms.

IC 칩을 내장한 무선 단말기에 적용 가능한 키 분배 프로토콜 (Key Distribution Protocol Appropriate to Wireless Terminal Embedding IC Chip)

  • 안기범;김수진;한종수;이승우;원동호
    • 정보보호학회논문지
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    • 제13권4호
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    • pp.85-98
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    • 2003
  • 현재 co-processor를 탑재한 IC 칩이 계속 출시되고 있어 IC 칩의 연산 능력이 나날이 발전하고 있다. 또한, 무선 단말기 시장에는 간편하고 다양한 서비스를 제공하기 위해 IC 칩(Integrated Circuit Chip)을 내장한 무선 단말기 제품이 많이 출시되고 있다. 하지만 현재 IC 칩에 탑재된 co-processor의 연산 능력은 아직 유선 통신 환경의 연산 능력에 미치지 못하고 있어 기존 유선 통신 환경의 키 분배 프로토콜을 무선 통신 환경에 그대로 활용하기 어렵다. 따라서 본 논문에서는 무선 단말기의 제한적인 연산 능력을 고려하여 암호 전용 연산을 하는 co-processor를 무선 단말기에 탑재함으로써 연산 능력을 보완하고, 기존의 이동 통신 환경에서의 키 분배 프로토콜에서 제공하지 않는 보안 요구 사항을 만족하며, 사용자와 서버 양측에 연산 부담을 줄일 수 있는 무선 단말기 환경에 적합한 키 분배 프로토콜을 제안한다.

임베디드 시스템의 가상 ARM 머신의 개발 (Virtual ARM Machine for Embedded System Development)

  • 이소진;안영호;한현희;황영시;정기석
    • 대한임베디드공학회논문지
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    • 제3권1호
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    • pp.19-24
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    • 2008
  • To reduce time-to-market, more and more embedded system developers and system-on-chip designers rely on microprocessor-based design methodology. ARM processor has been a major player in this industry over the last 10 years. However, there are many restrictions on developing embedded software using ARM processor in the early design stage. For those who are not familiar with embedded software development environment or who cannot afford to have an expensive embedded hardware equipment, testing their software on a real ARM hardware platform is a challenging job. To overcome such a problem, we have designed VMA (Virtual ARM Machine), which offers easier testing and debugging environment to ARM based embedded system developers. Major benefits that can be achieved by utilizing a virtual ARM platform are (1) reducing development cost, (2) lowering the entrance barrier for embedded system novices, and (3) making it easier to test and debug embedded software designs. Unlike many other purely software-oriented ARM simulators which are independent of real hardware platforms, VMA is specifically targeted on SYS-Lab 5000 ARM hardware platform, (designed by Libertron, Inc.), which means that VMA imitates behaviors of embedded software as if the software is running on the target embedded hardware as closely as possible. This paper will describe how VMA is designed and how VMA can be used to reduce design time and cost.

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내장형 네트워크 프로세서의 설계 및 구현 (Design and implementation of an Embedded Network Processor)

  • 정진우;김성철
    • 한국정보통신학회논문지
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    • 제9권6호
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    • pp.1211-1217
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    • 2005
  • Embedded system은 소수의 System-On-Chip (SOC)으로 대부분의 기능이 구현되어지는 추세이며, 이러한 SOC의 구조는 대체로 RISC 기반의 내장 마이크로프로세서를 중심으로 발전해 왔다. 하지만 RISC 기반의 ARM, MIPS등의 범용 프로세서들은 점차 그 필요성이 커지고 있는 네트워크 기능과 멀티미디어 처리 기능 등에 대해서는 많은 고려 없이 설계된 프로세서들이다. 소규모 사업자 및 개인 사용자를 위한 네트워크 기기의 경우는 가격대비 성능이 우수한 제품이 시장을 차지하는데 유리하므로, 지금까지 대부분의 경우에서 전용 하드웨어를 사용하지 않고, PHY와 MAC layer 일부의 기본적인 기능을 제외한 나머지 네트워크 기능을 모두 상기한 내장 마이크로프로세서로 처리하고 있다. VDSL, FTTH과 같이 고속 인터넷을 가능하게 하는 기술이 발전함에 따라, 기존의 범용 프로세서에 기반을 둔 네트워크 기기는 빠른 속도로 그 성능의 한계에 다다르고 있다. 이는 단순히 프로세서의 동작 속도를 높이는 것으로 해결할 수 있는 문제가 아닌 것으로 보이며, 네트워크 프로토콜의 처리에 최적화 되어 있지 않은 범용 프로세서의 사용에 근본적인 문제점이 있다고 하겠다. 본 연구를 통하여 네트워크 기능 수행에 효율적인 네트워크 프로세서를 설계하고 이를 Home gateway용 SOC에 내장하고 성능을 측정하여 그 상용화 가능성을 타진한다.

Hardware Approach to Fuzzy Inference―ASIC and RISC―

  • Watanabe, Hiroyuki
    • 한국지능시스템학회:학술대회논문집
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    • 한국퍼지및지능시스템학회 1993년도 Fifth International Fuzzy Systems Association World Congress 93
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    • pp.975-976
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    • 1993
  • This talk presents the overview of the author's research and development activities on fuzzy inference hardware. We involved it with two distinct approaches. The first approach is to use application specific integrated circuits (ASIC) technology. The fuzzy inference method is directly implemented in silicon. The second approach, which is in its preliminary stage, is to use more conventional microprocessor architecture. Here, we use a quantitative technique used by designer of reduced instruction set computer (RISC) to modify an architecture of a microprocessor. In the ASIC approach, we implemented the most widely used fuzzy inference mechanism directly on silicon. The mechanism is beaded on a max-min compositional rule of inference, and Mandami's method of fuzzy implication. The two VLSI fuzzy inference chips are designed, fabricated, and fully tested. Both used a full-custom CMOS technology. The second and more claborate chip was designed at the University of North Carolina(U C) in cooperation with MCNC. Both VLSI chips had muliple datapaths for rule digital fuzzy inference chips had multiple datapaths for rule evaluation, and they executed multiple fuzzy if-then rules in parallel. The AT & T chip is the first digital fuzzy inference chip in the world. It ran with a 20 MHz clock cycle and achieved an approximately 80.000 Fuzzy Logical inferences Per Second (FLIPS). It stored and executed 16 fuzzy if-then rules. Since it was designed as a proof of concept prototype chip, it had minimal amount of peripheral logic for system integration. UNC/MCNC chip consists of 688,131 transistors of which 476,160 are used for RAM memory. It ran with a 10 MHz clock cycle. The chip has a 3-staged pipeline and initiates a computation of new inference every 64 cycle. This chip achieved an approximately 160,000 FLIPS. The new architecture have the following important improvements from the AT & T chip: Programmable rule set memory (RAM). On-chip fuzzification operation by a table lookup method. On-chip defuzzification operation by a centroid method. Reconfigurable architecture for processing two rule formats. RAM/datapath redundancy for higher yield It can store and execute 51 if-then rule of the following format: IF A and B and C and D Then Do E, and Then Do F. With this format, the chip takes four inputs and produces two outputs. By software reconfiguration, it can store and execute 102 if-then rules of the following simpler format using the same datapath: IF A and B Then Do E. With this format the chip takes two inputs and produces one outputs. We have built two VME-bus board systems based on this chip for Oak Ridge National Laboratory (ORNL). The board is now installed in a robot at ORNL. Researchers uses this board for experiment in autonomous robot navigation. The Fuzzy Logic system board places the Fuzzy chip into a VMEbus environment. High level C language functions hide the operational details of the board from the applications programme . The programmer treats rule memories and fuzzification function memories as local structures passed as parameters to the C functions. ASIC fuzzy inference hardware is extremely fast, but they are limited in generality. Many aspects of the design are limited or fixed. We have proposed to designing a are limited or fixed. We have proposed to designing a fuzzy information processor as an application specific processor using a quantitative approach. The quantitative approach was developed by RISC designers. In effect, we are interested in evaluating the effectiveness of a specialized RISC processor for fuzzy information processing. As the first step, we measured the possible speed-up of a fuzzy inference program based on if-then rules by an introduction of specialized instructions, i.e., min and max instructions. The minimum and maximum operations are heavily used in fuzzy logic applications as fuzzy intersection and union. We performed measurements using a MIPS R3000 as a base micropro essor. The initial result is encouraging. We can achieve as high as a 2.5 increase in inference speed if the R3000 had min and max instructions. Also, they are useful for speeding up other fuzzy operations such as bounded product and bounded sum. The embedded processor's main task is to control some device or process. It usually runs a single or a embedded processer to create an embedded processor for fuzzy control is very effective. Table I shows the measured speed of the inference by a MIPS R3000 microprocessor, a fictitious MIPS R3000 microprocessor with min and max instructions, and a UNC/MCNC ASIC fuzzy inference chip. The software that used on microprocessors is a simulator of the ASIC chip. The first row is the computation time in seconds of 6000 inferences using 51 rules where each fuzzy set is represented by an array of 64 elements. The second row is the time required to perform a single inference. The last row is the fuzzy logical inferences per second (FLIPS) measured for ach device. There is a large gap in run time between the ASIC and software approaches even if we resort to a specialized fuzzy microprocessor. As for design time and cost, these two approaches represent two extremes. An ASIC approach is extremely expensive. It is, therefore, an important research topic to design a specialized computing architecture for fuzzy applications that falls between these two extremes both in run time and design time/cost. TABLEI INFERENCE TIME BY 51 RULES {{{{Time }}{{MIPS R3000 }}{{ASIC }}{{Regular }}{{With min/mix }}{{6000 inference 1 inference FLIPS }}{{125s 20.8ms 48 }}{{49s 8.2ms 122 }}{{0.0038s 6.4㎲ 156,250 }} }}

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멀티코어시스템에서의 예측 기반 동적 온도 관리 기법 (A Prediction-Based Dynamic Thermal Management Technique for Multi-Core Systems)

  • 김원진;정기석
    • 대한임베디드공학회논문지
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    • 제4권2호
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    • pp.55-62
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    • 2009
  • The power consumption of a high-end microprocessor increases very rapidly. High power consumption will lead to a rapid increase in the chip temperature as well. If the temperature reaches beyond a certain level, chip operation becomes either slow or unreliable. Therefore various approaches for Dynamic Thermal Management (DTM) have been proposed. In this paper, we propose a learning based temperature prediction scheme for a multi-core system. In this approach, from repeatedly executing an application, we learn the thermal patterns of the chip, and we control the temperature in advance through DTM. When the predicted temperature may go beyond a threshold value, we reduce the temperature by decreasing the operation frequencies of the corresponding core. We implement our temperature prediction on an Intel's Quad-Core system which has integrated digital thermal sensors. A Dynamic Frequency System (DFS) technique is implemented to have four frequency steps on a Linux kernel. We carried out experiments using Phoronix Test Suite benchmarks for Linux. The peak temperature has been reduced by on average $5^{\circ}C{\sim}7^{\circ}C$. The overall average temperature reduced from $72^{\circ}C$ to $65^{\circ}C$.

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Novel Hierarchical Test Architecture for SOC Test Methodology Using IEEE Test Standards

  • Han, Dong-Kwan;Lee, Yong;Kang, Sung-Ho
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제12권3호
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    • pp.293-296
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    • 2012
  • SOC test methodology in ultra deep submicron (UDSM) technology with reasonable test time and cost has begun to satisfy high quality and reliability of the product. A novel hierarchical test architecture using IEEE standard 1149.1, 1149.7 and 1500 compliant facilities is proposed for the purpose of supporting flexible test environment to ensure SOC test methodology. Each embedded core in a system-on- a-chip (SOC) is controlled by test access ports (TAP) and TAP controller of IEEE standard 1149.1 as well as tested using IEEE standard 1500. An SOC device including TAPed cores is hierarchically organized by IEEE standard 1149.7 in wafer and chip level. As a result, it is possible to select/deselect all cores embedded in an SOC flexibly and reduce test cost dramatically using star scan topology.

CMOS IC-카드 인터페이스 칩셋 (A CMOS IC-Card Interface Chipset)

  • 오원석;이성철;이승은;최종찬
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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    • pp.1141-1144
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    • 2003
  • For proper communication with various types of IC-Card, multiple IC-Card interface complying with the IC-Card standard (ISO7816) is embedded and realized as a peripheral on the 32-bit RISC based system-on-a-chip. It provides the generation of either 3.3V or 5V power supply for the operation of the inserted IC-Card as well. IC-Card interface is divided into an analog front-end (AFE) and a digital back-end (DBE). The embedded DC-DC converters suitable for driving IC-Cards are incorporated in the AFE. The chip design for multiple IC-Card interface is implemented on a standard 0.35${\mu}{\textrm}{m}$ triple-metal double-poly CMOS process and is packaged in a 352-pin plastic ball grid array (PBGA). The total gate count is about 400,000, excluding the internal memory. Die area is 7890${\mu}{\textrm}{m}$ $\times$ 7890${\mu}{\textrm}{m}$.

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SOC 설계를 위한 저전력 32-비트 RISC 프로세서의 재사용 가능한 설계 (Resuable Design of 32-Bit RISC Processor for System On-A Chip)

  • 이세환;곽승호;양훈모;이문기
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2001년도 하계종합학술대회 논문집(2)
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    • pp.105-108
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    • 2001
  • 4 32-bit RISC core is designed for embedded application and DSP. This processor offers low power consumption by fully static operation and compact code size by efficient instruction set. Processor performance is improved by wing conditional instruction execution, block data transfer instruction, multiplication instruction, bunked register file structure. To support compact code size of embedded application, It is capable cf executing both 16-bit instructions and 32-bit instruction through mixed mode instruction conversion Furthermore, for fast MAC operation for DSP applications, the processor has a dedicated hardware multiplier, which can complete a 32-bit by 32-bit integer multiplication within seven clock cycles. These result in high instruction throughput and real-time interrupt response. This chip is implemented with 0.35${\mu}{\textrm}{m}$, 4- metal CMOS technology and consists of about 50K gate equivalents.

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LPF 내장형 7중 대역 LTCC 프런트엔드모듈 설계 (Design of 7 Bands LTCC Front-end Module Embedded LPF)

  • 김형은;서영광;김인배;문제도;이문규
    • 전기학회논문지
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    • 제61권3호
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    • pp.427-432
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    • 2012
  • In this paper, we have designed and fabricated 7-bands (GSM 850/900, DCS/PCS, and UMTS 3 bands) LTCC front end module (FEM) embedded LPF (low pass filter) to efficiently eliminate harmonics generated in TX path. The proposed FEM is composed of flip-chip typed CMOS SP9T switch to select transceiver signals, dual type SAW filters to receive Rx signals, and 0603 size chip components for the antenna matching and ESD protection. The whole size of FEM is $4.5{\times}3.2{\times}1.2mm^3$. The insertion loss of Tx and Rx ports are measured at 1.7 dB and 4.8 dB, respectively.