• JSTS:Journal of Semiconductor Technology and Science
• /
• 제11권4호
• /
• pp.295-301
• /
• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

• 한국콘텐츠학회:학술대회논문집
• /
• 한국콘텐츠학회 2005년도 춘계 종합학술대회 논문집
• /
• pp.443-447
• /
• 2005

텔레매틱스를 위한 임베디드 이동체 자동화시스템(EMAST : Embedded Mobile Automatic System for Telematics)인 EMAST는, CAN(Controller Area Network)과 ARM Processor를 이용한 임베디드 이동체 자동화 시스템을 단일 칩(System-on-Chip)으로 구현된다. EMAST가 범용적으로 사용되기 위해서는 다음 두 조건을 만족해야만 한다. 첫째, 이동체 내부 인터페이스는 Differential Transceiver와 Optical Transceiver, Wireless Transceiver를 지원하도록 설계되어야하며, 둘째, EMAST와 텔레매틱스 망을 사용하는 단말기들 간의 인터페이스를 지원해야만 한다. 본 논문에서는 텔레매틱스를 위한 임베디드 이동체 자동화 시스템 구조 및 EMAST와 이동체각 Unit들과의 효율적인 인터페이스 구조를 제안하였다.

• 대한임베디드공학회논문지
• /
• 제4권1호
• /
• pp.29-34
• /
• 2009

In this paper, we design RF transceiver architecture and building blocks for impulse radio UWB system. Impulse radio UWB signal occupies the wide frequency band which is very low transmission power. So, it can minimize the interference effect with the other system. Using UWB technology, we obtain position awareness service. Therefore, we describe the RF transceiver architecture of direct conversion receiver and define the requirement of RF transceiver. Moreover, we implement a prototype RF transceiver based on the presented standard and verify a function and performance through the wireless data communication and ranging test.

• 전자공학회논문지CI
• /
• 제41권4호
• /
• pp.41-49
• /
• 2004

본 논문은 FPGA 임베디드 기가비트 트랜시버의 테스트에 관한 방법과 측정 결과를 다룬다. 실험에 사용한 디바이스는 Altera 사의 Stratix GX 디바이스로 범용 고속 프로토콜을 지원하는 트랜시버(GXB)이다. 본 논문은 차세대 IO 버스로 대두되는 PCI Express 직렬 프로토콜을 GXB에 구현하였다. PCI Express 규격에 맞게 생성된 GXB 모듈은 타이밍 시뮬레이션을 거쳐 하드웨어 구현과 테스트를 수행하였다. 트랜시버 테스트 방법으로 GXB 내부 블록 테스트, GXB 신호 무결성 테스트, GXB 입출력 버퍼 및 온칩 터미네이션 테스트, GXB 프로토콜 테스트의 네 가지 검증 절차를 거쳤다. 본 논문을 통해 FPGA 임베디드 트랜시버의 설계방법과 테스트 절차, 측정 결과를 제시한다.

• JSTS:Journal of Semiconductor Technology and Science
• /
• 제16권6호
• /
• pp.817-824
• /
• 2016

A simultaneous bidirectional transceiver over a single wire has been developed in a 65 nm CMOS technology for a command and control bus. The echo signals of the simultaneous bidirectional link are cancelled by controlling the decision level of receiver comparators without power-hungry operational amplifier (op-amp) based circuits. With the clock information embedded in the rising edges of the signals sent from the source side to the sink side, the data is recovered by an open-loop digital circuit with 20 times blind oversampling. The data rate of the simultaneous bidirectional transceiver in each direction is 75 Mbps and therefore the overall signaling bandwidth is 150 Mbps. The measured energy efficiency of the transceiver is 56.7 pJ/b and the bit-error-rate (BER) is less than $10^{-12}$ with $2^7-1$ pseudo-random binary sequence (PRBS) pattern for both signaling directions.

• Journal of Electrical Engineering and Technology
• /
• 제13권4호
• /
• pp.1638-1643
• /
• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• 대한임베디드공학회논문지
• /
• 제4권1호
• /
• pp.16-22
• /
• 2009

This paper aims at designing an impulse-radio ultra-wideband (IR-UWB) transceiver, especially targeting the IEEE 802.15.4a indoor ranging and communication systems. We first investigate the IEEE 802.15.4a IR-UWB signals and suggest the full-digital transceiver architecture accordingly. Since the wireless systems equipped with the impulse signal have the property of low-duty cycle, i.e., discontinuity in time, while the conventional systems takes the continuous signals, it is required to reconfigure the system design, including link budget. Following brief introduction to our IEEE 802.15.4a IR-UWB system hardware, we finally examine the ranging performance in indoor environments to verify our system design.

• 전기전자학회논문지
• /
• 제20권1호
• /
• pp.107-110
• /
• 2016

본 논문에서는 IoT 시스템을 위한 IEEE 802.15.4 LR-WPAN 868/915 MHz 대역 ZigBee 송수신기를 설계하고 구현하였다. IEEE 802.15.4 LR-WPAN에서 권고하는 ${\pm}80ppm$의 주파수 오프셋에서도 동작이 가능한 비간섭성 방식의 복조 알고리즘을 적용하였으며, 모드에 따라 가변 데이터 전송률을 지원하도록 구현하였다. 또한 SPI 통신 모듈을 탑재하여 다양한 MCU에 연결하여 사용이 가능하다. 설계된 ZigBee 송수신기는 Verilog HDL로 기술하고 $0.18{\mu}m$ 공정에서 합성 및 검증하였으며 게이트 수는 약 32,000 게이트였다.

• Journal of electromagnetic engineering and science
• /
• 제5권3호
• /
• pp.140-145
• /
• 2005

In this paper, an experimental investigation for return loss and a software-based prediction for interference level of single-packaged filtering antenna composed of dielectric waveguide filter and PCB(Printed Circuit Board) slot antenna in transceiver module have been carried out with several different feeding structures in millimeter-wave regime. The implementation and embedding method of the existing air-filled waveguide filters working at millimeter-wave frequency on general PCB substrate have been described. In a view of the implementation of each components, the dielectric waveguide embedded in PCB and LTCC(Low Temparature Co-fired Ceramic) substrates has employed the via fences as a replacement with side walls and common ground plane to prevent energy leakage. The characteristics of several prototypes of filtering antenna embedded in PCB substrate are considered by comparing the wideband and transmission characteristics as a function of bent angle of transmission line connecting two components. In addition, as an essential to the packaging of transceiver module working at millimeter-wave, miniaturization technology maintaining the performances of independent components and the important problems caused by integrating and connecting the different components in different layers are described in this paper.

• 한국전자파학회논문지
• /
• 제22권2호
• /
• pp.154-161
• /
• 2011

본 논문에서는 저온 동시 소성 세라믹(Low Temperature Co-fired Ceramic: LTCC) 기술을 이용하여 집적화된 2.4 GHz 대역 무선 송수신 모듈을 구현하였다. 구현된 송수신 모듈은 무선 전단부(RF front-end)단과 송수신 IC칩 단으로 나누어진다. 무선 전단부단은 송수신을 선택하기 위한 SPDT 스위치와 스위치 동작을 위한 DC block 커패시터를 제외하고, 모두 LTCC 내부에 내장하였다. 제작된 무선 전단부는 8층으로 설계되었고, 크기는 $3.3\;mm{\times}5.2\;mm{\times}0.4\;mm$이며, 무선 전단부의 측정 결과는 시뮬레이션과 유사한 결과를 보인다. 송수신 IC 칩 단은 신호 및 전원 선로와 송수신 IC 칩으로 구성이 되어 있다. 제작된 무선 송수신 모듈은 내부 접지(inner GND) 3개 층을 포함한 9층으로 설계되었으며, 크기는 $12\;mm{\times}8.0\;mm{\times}1.1\;mm$이다. 최종적으로 2.4 GHz 대역 송수신 모듈의 송신 파워는 18.1 dBm이고, 수신 민감도는 -85 dBm의 특성으로 우수한 결과를 나타내었다.