• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.295-301
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• 2011

A triple-band transceiver module for 2.3/2.5/3.5 GHz mobile WiMAX, IEEE 802.16e, applications is introduced. The suggested transceiver module consists of RFIC, reconfigurable/multi-resonance MIMO antenna, embedded PCB, mobile WiMAX base band, memory and channel selection front-end module. The RFIC is fabricated in $0.13{\mu}m$ RF CMOS process and has 3.5 dB noise figure(NF) of receiver and 1 dBm maximum power of transmitter with 68-pin QFN package, $8{\times}8\;mm^2$ area. The area reduction of transceiver module is achieved by using embedded PCB which decreases area by 9% of the area of transceiver module with normal PCB. The developed triple-band mobile WiMAX transceiver module is tested by performing radio conformance test(RCT) and measuring carrier to interference plus noise ratio (CINR) and received signal strength indication (RSSI) in each 2.3/2.5/3.5 GHz frequency.

• Proceedings of the Korea Contents Association Conference
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• 2005.05a
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• pp.443-447
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• 2005

EMAST(Embedded Mobile Automatic System for Telematics) is implemented in SoC using the CAN and ARM Processor. For the general usage, EMAST must satisfy the two condition. First, Mobile internal interface is to be designed to support Differential Transceiver, Optical Transceiver and Wireless Transceiver Second, it should be supporting the interface between terminals using EMAST and telematics networks. In this paper, we propose EMAST structure and the efficient interface structure between EMAST and each mobile units.

• IEMEK Journal of Embedded Systems and Applications
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• v.4 no.1
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• pp.29-34
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• 2009

In this paper, we design RF transceiver architecture and building blocks for impulse radio UWB system. Impulse radio UWB signal occupies the wide frequency band which is very low transmission power. So, it can minimize the interference effect with the other system. Using UWB technology, we obtain position awareness service. Therefore, we describe the RF transceiver architecture of direct conversion receiver and define the requirement of RF transceiver. Moreover, we implement a prototype RF transceiver based on the presented standard and verify a function and performance through the wireless data communication and ranging test.

• Journal of the Institute of Electronics Engineers of Korea CI
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• v.41 no.4
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• pp.41-49
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• 2004

In this paper, a design and measurement method for FPGA embedded gigabit-transceiver is presented. Altera's Stratix GX device which is general purpose transceiver called GXB was used for implementing PCI Express transceiver. PCI Express is the generation high performance serial I/O bus used to interconnect peripheral devices. After GXB was set follow by PCI Express specifications, the design has been verified by timing simulation and implemented as hardware. We tested it as follow. First GXB internal digital and analog block test second GXB transmitter signal integrity test called Eye mask test, third GXB high-speed serial I/O buffer and on-chip termination test and the last GXB protocol test. This paper shows all the design and measurement procedure about FPGA embedded gigabit-transceiver.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.6
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• pp.817-824
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• 2016

A simultaneous bidirectional transceiver over a single wire has been developed in a 65 nm CMOS technology for a command and control bus. The echo signals of the simultaneous bidirectional link are cancelled by controlling the decision level of receiver comparators without power-hungry operational amplifier (op-amp) based circuits. With the clock information embedded in the rising edges of the signals sent from the source side to the sink side, the data is recovered by an open-loop digital circuit with 20 times blind oversampling. The data rate of the simultaneous bidirectional transceiver in each direction is 75 Mbps and therefore the overall signaling bandwidth is 150 Mbps. The measured energy efficiency of the transceiver is 56.7 pJ/b and the bit-error-rate (BER) is less than $10^{-12}$ with $2^7-1$ pseudo-random binary sequence (PRBS) pattern for both signaling directions.

• Journal of Electrical Engineering and Technology
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• v.13 no.4
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• pp.1638-1643
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• 2018

Multi-layer ceramic capacitors as decoupling capacitor were fabricated by dielectric composition with a high dielectric constant. The fabricated decoupling capacitors were embedded in the PCB of the 10G RF transceiver module and evaluated for the characteristics of electrical noise by the level of AC input voltage. In order to further improve the electrical properties of the $BaTiO_3$ based composite, glass frit, MgO, $Y_2O_3$, $Mn_3O$, $V_2O_5$, $BaCO_3$, $SiO_2$, and $Al_2O_3$ were used as additives. The electrical properties of the composites were determined by various amounts of additives and optimum sintering temperature. As a result of the optimized composite, it was possible to obtain a density of $5.77g/cm^3$, a dielectric constant of 1994, and an insulation resistance of $2.91{\times}10^{12}{\Omega}$ at an additive content of 5wt% and a sintering temperature of $1250^{\circ}C$. After forming a $2.5{\mu}m$ green sheet using the doctor blade method, a total of 77 layers were laminated and sintered at $1180^{\circ}C$. A decoupling capacitor with a size of $0.6mm(W){\times}0.3mm(L){\times}0.3mm(T)$ (width, length and thickness, respectively) and a capacitance of 100 nF was embedded using a PCB process for the 10G RF Transceiver modules. In the range of AC input voltage 400mmV @ 500kHz to 2200mV @ 900kHz, the embedded 10G RF Transceiver modules evaluated that it has better electrical performance than the non-embedded modules.

• IEMEK Journal of Embedded Systems and Applications
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• v.4 no.1
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• pp.16-22
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• 2009

This paper aims at designing an impulse-radio ultra-wideband (IR-UWB) transceiver, especially targeting the IEEE 802.15.4a indoor ranging and communication systems. We first investigate the IEEE 802.15.4a IR-UWB signals and suggest the full-digital transceiver architecture accordingly. Since the wireless systems equipped with the impulse signal have the property of low-duty cycle, i.e., discontinuity in time, while the conventional systems takes the continuous signals, it is required to reconfigure the system design, including link budget. Following brief introduction to our IEEE 802.15.4a IR-UWB system hardware, we finally examine the ranging performance in indoor environments to verify our system design.

• Journal of IKEEE
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• v.20 no.1
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• pp.107-110
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• 2016

In this paper, an IEEE 802.15.4 LR-WPAN 868/915 MHz ZigBee transceiver for IoT systems was designed and implemented. Non-coherent demodulation was exploited to satisfy ${\pm}80ppm$ frequency offset recommended in IEEE 802.15.4 LR-WPAN. Variable bitrate was supported according to operation modes. SPI module was embedded to connect various MCUs. The designed Zigbee transceiver was described in Verilog HDL and it was synthesized and verified in $0.18{\mu}m$ process. Its gate count was about 32,000 gates.

• Journal of electromagnetic engineering and science
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• v.5 no.3
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• pp.140-145
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• 2005

In this paper, an experimental investigation for return loss and a software-based prediction for interference level of single-packaged filtering antenna composed of dielectric waveguide filter and PCB(Printed Circuit Board) slot antenna in transceiver module have been carried out with several different feeding structures in millimeter-wave regime. The implementation and embedding method of the existing air-filled waveguide filters working at millimeter-wave frequency on general PCB substrate have been described. In a view of the implementation of each components, the dielectric waveguide embedded in PCB and LTCC(Low Temparature Co-fired Ceramic) substrates has employed the via fences as a replacement with side walls and common ground plane to prevent energy leakage. The characteristics of several prototypes of filtering antenna embedded in PCB substrate are considered by comparing the wideband and transmission characteristics as a function of bent angle of transmission line connecting two components. In addition, as an essential to the packaging of transceiver module working at millimeter-wave, miniaturization technology maintaining the performances of independent components and the important problems caused by integrating and connecting the different components in different layers are described in this paper.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.154-161
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• 2011

This paper presents a compact integrated transceiver module for 2.4 GHz band applications using Low Temperature Co-fired Ceramic(LTCC) technology. The implemented transceiver module is divided into an RF Front-End Module (FEM) part and a transceiver IC chip part. The RF FEM part except an SPDT switch and DC block capacitors is fully embedded in the LTCC substrate. The fabricated RF FEM has 8 pattern layers and it occupies less than $3.3\;mm{\times}5.2\;mm{\times}0.4\;mm$. The measured results of the implemented RF FEM are in good agreement with the simulated results. The transceiver IC chip part consists of signal line, power line and transceiver IC for 2.4 GHz band communication system. The fabricated transceiver module has 9 layers including three inner grounds and it occupies less than $12\;mm{\times}8.0\;mm{\times}1.1\;mm$. The implemented transceiver module provides an output power of 18.1 dBm and a sensitivity of -85 dBm.