• Proceedings of the KIPE Conference
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• 2018.07a
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• pp.108-110
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• 2018

This paper proposes shortcircuit fault protection method in a synchronous buck converter using the PCB pattern Rogowski coil. The PCB pattern Rogowski coils are embedded in the gate driver to measure the device currents of the top and bottom side. When shortcircuit occurs in the system, the gate signal is blocked by the proposed fault protection method using the device current. The simulation and experimental results show that the proposed fault protection method is verified in the shortcircuit system.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.84-88
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• 2013

These days embedded technology may be the most significant development in the electronics industry. The study focused on the development of active device embedding using flexible printed circuit in view of process and materials. The authors fabricated 30um thickness Si chip without any crack, chipping defects with a dicing before grinding process. In order to embed chips into flexible PCB, the chip pads on a chip are connected to bonding pad on flexible PCB using an ACF film. After packaging, all sample were tested by the O/S test and carried out the reliability test. All samples passed environmental reliability test. In the future, this technology will be applied to the wearable electronics and flexible display in the variety of electronics product.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1587_1588
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• 2009

In this paper, PCB embedded balanced-to-unbalamced duplexer using coupled LC resonator was introduced for low cost dualband WiMax front-end-module application. In order to obtain the function of bandpass filter and balun transformer, proposed duplexer was configured by using magnetically coupled LC resonator. Out-of-band suppression was enhanced by applying two m-Derived transform circuits to obtain transmission zeros at 2GHz and 4.8GHz. In order to reduce the size of embedded duplexer, BaSrTiO3 (BST) composite high Dk RCC film was applied to improve the capacitance density. This high Dk film provided the capacitance density of 12.2 pF/mm2. The simulation results shows that fabricated duplexer had an insertion loss of 2.9dB and 5.5dB and return loss of 15dB and 16dB for 2.5GHz~2.6GHz and 3.5GHz~3.6GHz, respectively. The maximum magnitude and phase imbalance were 0.01dB and 0.17dB, and 1degree and 2degree in its passband, respectively. The out-of-band suppression was observed approximately 29dB and 40dB below 1.9GHz and over 4.5GHz, respectively. It has a volume of 6 mm $\times$ 7 mm $\times$ 0.7 mm (height).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.8
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• pp.702-707
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• 2002

This paper presents a micro fluxgate sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3$\times$5.7$\textrm{mm}^2$. Excellent linear response over the range of -100$\mu$T to +100$\mu$T is obtained with 540V/T sensitivity at excitation square wave of 3 $V_{p-p}$ and 360kHz. The very low power consumption of ~8mW was measured. This magnetic sensing element, which measures the lower fields than 50$\mu$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.h.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.9
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• pp.940-946
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• 2010

In this paper, we proposed the internal antenna on PCB(Planar Circuit Board) for achieving WWAN(Wireless Wide Area Network) operation in the laptop computer. The proposed antenna has a metal structure instead of printed pattern on PCB to improve the antenna characteristics for GSM850/900 bands. Compared to PCB embedded antenna without metal structure, the proposed antenna occupies similar area of $74{\times}11{\times}0.5\;mm^3$ with before and the bandwidth of the proposed one for GSM850/900 bands is increased 13 MHz than before. Further we confirmed that the proposed antenna has higher radiation gain of -4.45~-2.29 dBi for GSM850/900 bands than PCB embedded antenna without metal structure.

• Journal of Advanced Navigation Technology
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• v.25 no.3
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• pp.223-228
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• 2021

In this paper, we proposed a slot-type antenna with microstrip feed embedded in a PCB for Zigbee communication (2.4 ~ 2.484 GHz). The proposed antenna is designed on a FR-4 substrate with dielectric constant 4.3, thickness of 1.6 mm, and size of 50×65 mm². Through simulations, trends of design parameters are analyzed and optimized, and the proposed antenna composed with three slots satisfy the frequency band. The measured impedance bandwidths (|S₁₁| ≤ -10 dB) of fabricated antenna are 900 MHz (2 ~ 2.9 GHz) in Zigbee frequency band. In addition, the radiation pattern showed omnidirectional characteristics for E and H-planes, and the gain of antenna in Zigbee frequency band was 1.782 dBi.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.61-68
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• 2007

Interfacial fracture energy(${\Gamma}$) between $Al_2O_3$ thin film deposited by Atomic Layer Deposition(ALD) and sputter deposited Cu electrode for embedded PCB applications is measured from a $90^{\circ}$ peel test. While the interfacial fracture energy of $Cu/Al_2O_3$ is very poor, Cr adhesion layer increases the interfacial fracture energy to $39.8{\pm}3.2g/mm\;for\;Ar^+$ RF plasma power density of $0.123W/cm^2$, which seems to come from the enhancement of the mechanical interlocking and Cr-O chemical bonding effects.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1366-1367
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• 2006

Embedded capacitor technology is one of the effective packaging technologies for further miniaturization and higher performance of electric package systems. So we used the 3D EM simulator for embedded capacitor design in 8-layed PCB(Printed Circuit Board). The designed capacitors value are 2 pF, 5pF, 10 pF, respectly. we investigated characteristics of capacitance - frequency and SRF(Self Resonance Frequency) as changing the rate of hight and width of upper pad of embedded capacitors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.224-225
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• 2006

$BaTiO_3$ powder를 epoxy/solvent에 혼합한 슬러리와 solvent에 혼합한 슬러리의 분산 특성을 평가하기 위하여 분산제인 silane을 $BaTiO_3$ powder 표면에 코팅한 powder를 이용하여 분산실험을 진행하였다. Silane 표면 코팅 량에 따른 $BaTiO_3$ 슬러리와 $BaTiO_3$/epoxy 복합 슬러리의 분산 특성은 서로 다른 경향으로 나타남을 확인하였으며, silanae 최적 첨가량은 $BaTiO_3$/solvent 슬러리의 경우 0.3~0.5 wt%, $BaTiO_3$/epoxy/solvent 슬러리의 경우 1wt% 이상 첨가한 조건이었다. 또한 분산성 측정의 방법으로 점도 측정 방법과 함께 표면 거칠기 측정 방법의 가능성을 확인하였다.

• Journal of Advanced Navigation Technology
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• v.14 no.1
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• pp.11-19
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• 2010

In this paper, H-plane filtering-horn antenna operating at millimeter frequency band is proposed with embedded filter and three-layered dielectric lens for frequency selection and maintenance of main beam direction, respectively. The waveguide-typed filter and H-plane sectoral horn antenna are replaced with considerably size-reduced PCB substrate-typed filtering antenna using via fences and several posts. The waveguide-typed filter and H-plane sectoral horn antenna were designed in air-filled waveguide and then combined into size-reduced PCB substrate. For the control of the thickness of dielectric lens, single and multi dielectric lens have been employed. As a result of antenna gain, 8 and 13.5 dBi have been obtained at 41.5 GHz, respectively, from the simulations of single and multi-lens antennas.