• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1807-1812
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• 2007

A bulge testing system was developed to measure mechanical properties of thin film materials. A bulge pressure test system for pressurizing the bulge window of the film and a micro out-of-plane ESPI(Electronic Speckle Pattern Interferometric) system for measuring deflection of the film were included in the testing system developed. For the out-of-plane ESPI system, whole field speckle fringe pattern, corresponding to the out-of-plane deflection of the bulged film, was 3-dimensionally visualized using 4-bucket phase shifting algorithm and least square phase unwrapping algorithm. The bulge pressure for loading and unloading was controlled at a constant rate. From the pressure-deflection curve measured by this testing system, ain-plane stress-strain curve could be determined. In this study, elastic modulus of an electrolytic copper film 18 ${\mu}m$ was determined. The modulus was calculated from determining the plain-strain biaxial elastic modulus at the respective unloading slopes of the stress-strain curve and for the Poisson's ratio of 0.34.