• 방사선산업학회지
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• 제11권3호
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• pp.173-179
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• 2017

The small-scale electroplating device was designed and fabricated for Ni-63 sealed source (foil type) with a high specific activity needed for production of betavoltaic battery. The condition of Ni electroplating was optimized by using fabricated electroplating device to establish a Ni-63 electroplating condition on the Ni foil. The results showed that the optimum surface morphology and thickness of Ni deposit was obtained for 1,758 seconds at a current density of $15mA{\cdot}cm^{-2}$ with 0.5% tween 20. Radioisotope Ni-63 electroplating was implemented under established condition. The radioactivity of Ni-63 sealed source was calculated to $28mCi{\cdot}cm^{-2}$, and the thickness of Ni-63 deposit was about $2.4{\mu}m$.

• 한국표면공학회지
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• 제8권1호
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• pp.11-14
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• 1975

• 마이크로전자및패키징학회지
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• 제19권3호
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• pp.1-7
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• 2012

Electroplating technology is widely used in semiconductor microelectronic industry. With the development of semiconductor integrated circuit to high density and light-small scale, Extremely high quality and plated uniformity of the deposited metals are needed. Simulation technique can help to obtain better plating results. Although a few plating simulation softwares have been commercialized, plating simulation is not widely prevalent in Korea. In this paper, principle of electroplating and mathematical modeling of plating simulation are discussed. Also introduced are some cases enhancing plating thickness uniformity on leadframe, PCB and wafer by using plating simulation.

• 반도체디스플레이기술학회지
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• 제14권1호
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• pp.67-71
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• 2015

Pulse electroplating was studied to form nanocrystal structure effectively by changing plating current density and duty cycle. When both of plating current density and duty cycle were decreased from $100mA/cm^2$ and 70% to $50mA/cm^2$ and 30%, the P content in the Ni matrix was increased almost up to the composition of $Ni_3P$ compound and the grain growth after annealing was retarded as well. The as-plated hardness values ranging from 660 to 753 HV are mainly based on the formation of nanocrystal structure. On the other hand, the post-anneal hardness values ranging from 898 to 1045 HV, which are comparable to the hardness of hard Cr, are coming from how competition worked between the precipitation of $Ni_3P$ and the grain coarsening. According to the ANOVA and regression analysis, the plating current density showed more strong effect on nanocrystal size and film hardness than the duty cycle.

• 한국산업보건학회지
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• 제25권1호
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• pp.89-94
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• 2015

Objectives: The objective of this study was to determine characteristics of workers' exposures to airborne total and hexavalent chromium by job title in electroplating processes. Methods: Total Cr was determined through a modified method based on NIOSH Method 7024. Airborne hexavalent Cr, Cr(VI), was sampled and extracted according to NIOSH Method 7600 and analyzed at 520 nm using an ion chromatograph/visible detector. Results: The geometric mean(GM) of total Cr concentrations from all factories was $11.2{\mu}g/m^3$(GSD=4.9). The GM of Cr(VI) concentrations from all factories was $2.84{\mu}g/m$ (GSD=5.2), and the concentrations among factories were significantly different (p<0.05). The Cr(VI) levels were lower than total Cr levels. Total Cr exposure levels were highest among buffing workers ($21.6{\mu}g/m^3$), but Cr(VI) levels were highest among plating workers($4.15{\mu}g/m^3$). The concentrations of Cr(VI) and total Cr from plating tasks was highly correlated(r=0.91). Conclusions: In the electroplating industry, plating workers were mainly exposed to Cr(VI), but others were not. Oxidation-reduction states of Cr and job titles should be considered in the exposure or risk assessments of chrome electroplating factories.

• 자원리싸이클링
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• 제22권3호
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• pp.91-99
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• 2013

우리나라 경제의 근간을 이루고 있는 철강산업, 자동차산업이나 전자산업에서 전기도금은 중요한 역할을 담당하고 있다. 전기도금 폐액은 전처리, 도금 및 후처리과정에서 발생하는 폐액이고 다양한 금속염을 포함한 유해한 폐수이다. 현재 일반적인 폐수는 환경법상 배수 규제치 이하로 중화처리한 후 각종 금속이 혼합된 슬러지는 매립하거나 위탁처리하고 있는데, 처리에 따른 막대한 비용이 들뿐만 아니라 매립지 부족과 유가금속 자원 낭비를 초래하고 있다. 따라서 이러한 폐수에서 유가금속을 회수하는 연구가 활발하게 진행되고 있다. 전기도금 폐액에서 금속을 선택적으로 회수하는 새로운 방법은 철산화세균을 이용하는 방법, 황화제를 이용한 황화물(MS) 회수법 및 유기용매를 이용한 용매추출법 등에 관한 연구가 진행되고 있다. 이들의 폐수처리방법을 이용하여 Fe, Cu, Zn, Ni 등의 금속이온이 혼합된 폐수에서 유가금속을 95%이상 회수하는 성과를 거두었다. 이는 전기도금공정에서 배출되는 폐수를 폐기할 것이 아니라 도시광산의 중요한 금속자원으로 활용될 것으로 기대된다.

• Transactions on Electrical and Electronic Materials
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• 제10권3호
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• pp.71-74
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• 2009

Electroplated Cu is a cost efficient metallization method in microelectronic packaging applications. Typically in 3-D chip staking technology, utilizing through silicon via (TSV), electroplated Cu metallization is inevitable for the throughput as well as reducing the cost of ownership (COO).To achieve a comparable film quality to sputtering or CVD, a pre-cleaning process as well as plating process is crucial. In this research, atmospheric plasma is employed to reduce the usage of chemicals, such as trichloroethylene (TCE) and sodium hydroxide (NaHO), by substituting the chemical assisted organic cleaning process with plasma surface treatment for Cu electroplating. By employing atmospheric plasma treatment, marginally acceptable electroplating and cleaning results are achieved without the use of hazardous chemicals. The experimental results show that the substitution of the chemical process with plasma treatment is plausible from an environmentally friendly aspect. In addition, plasma treatment on immersion Sn/Cu was also performed to find out the solderability of plasma treated Sn/Cu for practical industrial applications.

• 자원리싸이클링
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• 제30권3호
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• pp.55-62
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• 2021

국내에서는 1997년 우수 재활용제품(good recycled product, GR) 인증 제도를 도입하여 자원과 에너지 사용효율 개선을 증진하고 있으나 산업계 및 사회 전반적으로 재활용 소재에 대한 인식 부족으로 인해 재활용 제품 사용이 잘되지 않고 있다. 따라서 본 연구에서는 니켈 소재의 국내·외 품질 기준 현황을 조사하였고, 광석으로부터 제조된 황산니켈과 폐리튬이온전지로부터 재소재화 된 황산니켈에 대하여 전해도금 공정에서의 순도 및 전기화학적 특성을 평가하였다. 평가 결과, 전해도금 산업에서 사용 시 재활용 황산니켈과 고순도 황산니켈 시약의 품질은 차이가 없는 것으로 판단된다.

• 한국수소및신에너지학회논문집
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• 제31권1호
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• pp.23-32
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• 2020

The intermittent characteristics of renewable energy complicates the process of balancing supply with demand. Electrolysis technology can provide flexibility to grid management by converting electricity to hydrogen. Alkaline electrolysis has been recognized as established technology and utilized in industry for over 100 years. However, high overpotential of oxygen evolution reaction in alkaline water electrolysis reduces the overall efficiency and therefore requires the development of anode catalyst. In this study, Raney Ni-Zn-Fe electrode was prepared by electroplating and the electrode characteristics was studied by varying electroplating parameters like electrodeposition time, current density and substrate. The prepared Raney Ni-Zn-Fe electrode was electrochemically evaluated using linear sweep voltammetry. Physical and chemical analysis were conducted by scanning electron microscope, energy dispersive spectrometer, and X-ray diffraction. The plating time did not changed the morphology and composition of the electrode surface and showed a little effect on overpotential reduction. As the plating current density increased, Fe content on the surface increased and cauliflower-like structure appeared on the electrode surface. In particular, the overpotential of the electrode, which was prepared at the plating current density of 320 mA/㎠, has showed the lowest value of 268 mV at 50 mA/㎠. There was no distinguishable overpotential difference between the type of substrate for the electrodes prepared at 80 mA/㎠.

• 방사선산업학회지
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• 제9권4호
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• pp.167-170
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• 2015

Radioisotope (Nuclear) battery using $^{63}Ni$ was prepared as beta cell. The electroplated $^{63}Ni$ on Ni foil is fabricated, and beta cell and photovoltaic hybrid battery was designed to use at both day and night in space project. A Ni-plating solution is prepared by dissolving metal particles including $^{62}Ni$ and $^{63}Ni$ from neutron irradiation of ($n,{\gamma}$). Electroplating solution of a chloride bath consists on nickel ions in HCl, $H_3BO_3$, and KOH. The deposition was carried out at current density of $10mA\;cm^{-2}$. The prepared beta source was attached on a PN junction and measured I-V properties. The power output at activity of 0.07 mCi and 0.45 mCi were 0.55 pW and 2.69 nW, respectively.