• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.120-128
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• 2004

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, the electronic equipment of a satellite consists of an aluminum case containing PCB. Each PCB has resistors and IC. Noise and vibration of the wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation, random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when the frequency of random vibration meets with natural frequency of PCB, fatigue fracture may occur in the part of solder joint. The launching environment, thus, needs to be carefully considered when designing the electronic equipment of a satellite. In general, the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM or vibration test. In this study, the natural frequency and dynamic deflection of PCB are measured by FEM, and the safety of the electronic components of PCB is evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs ranging from the electronic equipments of a satellite to home electronics.

• Advances in nano research
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• v.12 no.2
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• pp.151-165
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• 2022

Micro-scale serpentine structure fibers are widely used as flexible sensor in the manufacturing of micro-nano flexible electronic devices because of their outstanding non-linear mechanical properties and organizational flexibility. The use of melt electrowriting (MEW) technology, combined with the axial bending effect of the Taylor cone jet in the process, can achieve the micro-scale serpentine structure fibers. Due to the interference of the process parameters, it is still challenging to achieve the precise deposition of micro-scale and high-consistency serpentine structure fibers. In this paper, the micro-scale serpentine structure fiber is produced by MEW combined with axial bending effect. Based on the controlled deposition of MEW, applied voltage, collector speed, nozzle height and nozzle diameter are adjusted to achieve the precise deposition of micro-scale serpentine structure fibers with different morphologies in a single motion dimension. Finally, the influence mechanism of the above four parameters on the precise deposition of micro-scale serpentine fibers is explored.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.768-771
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• 2003

The impulse between launch vehicle and atmosphere can generate a lot of noise and vibration during the process of launching a satellite. Structurally, electronic equipment (KOMPSAT 2, RDU : Remote Drive Unit) of a satellite consists of aluminum case containing PCB (Printed circuit boards). Each PCB has resistors and IC (Integrated circuits). Noise and vibration of wide frequency band are transferred to the inside of fairing, subsequently creating vibration of the electronic equipment of the satellite. In this situation. random vibration can cause malfunctioning of the electronic equipment of the device. Furthermore, when tile frequency of random vibration meets with natural frequency of PCB. fatigue fracture nay occur in the part of solder joint. The launching environment, thus. needs to be carefully considered when designing the electronic equipment of a satellite. In general. the safety of the electronic equipment is supposed to be related to the natural frequency, shapes of mode and dynamic deflection of PCB in the electronic equipment. Structural vibration analysis of PCB and its electronic components can be performed using either FEM(Finite Element Method) or vibration test. In this study. the natural frequency and dynamic deflection of PCB are measured by FEM, aud the safety of the electronic components of PCB is being evaluated according to the results. This study presents a unique method for finite element modeling and analysis of PCB and its electronic components. The results of FEA are verified by vibration test. The method proposed herein may be applicable to various designs from the electronic equipments of a satellite to home electronics.

• Journal of KSNVE
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• v.10 no.6
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• pp.971-976
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• 2000

High level random vibration environments induced while launching of spacecraft can damage sensitive electronic equipment, unless the equipment is properly packaged. Thus careful consideration on the launch environment, especially for high level random vibration, is required in the design stage of electronic equipment of spacecraft. This paper describes the development process of Solar Array Regulator for KOMPAT-2, which is designed and tested by Korean engineers. Both analytical and experimental techniques are introduced in this paper.

• Journal of Aerospace System Engineering
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• v.10 no.2
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• Journal of the Semiconductor & Display Technology
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• v.14 no.4
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• pp.67-71
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• 2015

Product of technology developed in this study is an external interface for controlling the equipment of pendant key remote control system circuit board, and it is used in the electronic component test equipment system. Main control system module is in the role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer engineers to control the inspection equipment. The pentane-key interface module to its role as a device for controlling the various control devices that make up the integrated system for microscopic examination at the request of the host computer for the engineer to control the inspection equipment. Development of the control system can be expected in the configuration of a system for efficient and accurate inspection of high-precision parts.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.22 no.9
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• pp.1220-1227
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• 2018

Avionics electronic equipment refers to the electronic equipment installed on an aircraft. Failure of avionics equipment can have a significant impact on aircraft operations as well as threaten the safety of pilots and passengers. Therefore, avionics electronic equipment is required to have higher reliability and safety than electronic equipment used for other purposes. Avionics equipment must consider various component selection and system design to meet reliability and safety-related requirements from the initial design stage. In this paper, we describe safety, reliability performance analysis method of avionics equipment, and introduce various design improvement methods that can be performed to meet safety requirement performance. Finally, the safety performance of the improved avionics equipment was reanalyzed and compared with the value before the improvement, the validity of the proposed design change was verified.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.49 no.2
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• pp.147-154
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• 2021

In this paper, the configuration and design of the test equipment are presented to examine the impact of rapid temperature change in cooling-air that may occur during the operation of the fixed wing aircraft Environmental Control System (ECS) on avionic electronic equipment. At the start of the ECS, the temperature of the air supplied by the aircraft ECS may be increased to 5.0℃ per second. In order to ensure operating of the avionic electronic equipment that is mounted on the aircraft and receives cooling-air from the ECS, testing equipment that can implement the cooling-air characteristic test environment is required. During design of test equipment was verified cooling-air rapid rate of temperature change by performing a thermal/flow analysis, performance of the test equipment implemented was verified by applying an avionic electronic equipment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05c
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• pp.178-181
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• 2001

This paper presents the development of electromagnetic wave detecting equipment for diagnosis of enclosed switchboard. High voltage power equipments are very important equipment of the key industries and the private enterprise. Power line accidents are national plans because of those set off casualties lose of power equipments and communication networks. Therefore the necessity of the development of detecting for power equipment diagnosis is demand for prevention of high voltage equipment accidents. This paper is the development of electromagnetic wave detecting equipment for diagnosis of high voltage equipment. This paper establishes the diagnosis method for high voltage power equipments, that secures original technique and possesses detecting technique for electromagnetic wave. By the study we developed electromagnetic wave detector, and we applied this equipment application tests at the place constructed high voltage equipments.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.