• Title/Summary/Keyword: Electronic transition

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Effect of Preparation Conditions on Tc, Jc in the ($Bi_{1-x}Pb_{x}$)$_2$$Sr_2$$Ca_2$$Cu_{3.6}$$O_{y}$ Superconductors (($Bi_{1-x}Pb_{x}$)$_2$$Sr_2$$Ca_2$$Cu_{3.6}$$O_{y}$ 초전도체의 제작조건에 따른 Tc, Jc의 영향)

  • 황교영;조한대;이서웅;박용필;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1990.10a
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    • pp.31-35
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    • 1990
  • In the ($Bi_{1-x}Pb_{x}$)$_2$$Sr_2$$Ca_2$$Cu_{3.6}$$O_{y}$ (x=0∼0.5) superconductors, DTA and XRD-pattern analyses were performed to obviousely define optimal calcining and sintering temperature. And, understanding behaviors of High-Tc phase with preparation condition of superconductors, that is, calcining and sintering temperature, sintering time, and variation of Pb contents, in order to make single phase of superconductor, microstructure and its composition were analyzed with SEM, XRD, and EDAX. continuously, the cause of phase transition was define with synthetically studying mutural relation between measured electrical resistivity and current density. Also, in order to design enhancement of critical current density, Jc required for realization, samples varied with pressing condition were made, and measured its, Jc.

Hall Effect of $FeSi_2$ Thin Film by Temperature ($FeSi_2$박막 홀 효과의 온도의존성)

  • 이우선;김형곤;김남오;정헌상
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11a
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    • pp.230-233
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    • 2001
  • FeSi$_2$ Layer were grown using FeSi$_2$, Si wafer by the chemical transport reaction method. The directoptical energy gap was found to be 0.87leV at 300 K. The Hall effect is a Physical effect arising in matter carrying electric current in the presence of a magnetic field. The effect is named after the American physicist E.H. Hall, who discovered it in 1879. In this paper, we study electrical properties of FeSi$_2$/Si layer. And then we measured Hall coefficient Hall mobility, carrier density and Hall voltage according to variation magnetic field and temperature, Because of important part for it application various phase of silicide is formed at the metal-Si interface when transition metal contacts to Si. Silicides belong to metallic or semiconducting according to their electrical and optical properties. Metallic silicides are used as gate electrodes or interconnections in VLSI devices. Semiconducting silicides can be used as a new material for IR detectors because of their narrow energy band gap.

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Photoluminescence study in GaAs/AlGaAs multi-quantum well structure by hydrogen passivation (수소화 처리에 의한 GaAs/AIGaAs 다중양자우물의 PL 연구)

  • Park, Se-Ki;Lee, Cheon;Jung, Min
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1997.11a
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    • pp.468-472
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    • 1997
  • The effect of the surface state on the quantum efficiency of underlying GaAs/AlGaAs multi-quantum well(MQW) structures consisting of three GaAs quantum wells with different thickness, is studied by low temperature photoluminescence(PL). The structure was grown by molecular beam epitaxy(MBE) on (100) GaAs substrate. The thickness of three GaAs quantum wells was 3, 6 and 9 nm, respectively. The MQWs were placed apart from 50 nm AlGaAs edge-barriers including two inner-barriers with 15 nm in thickness. The samples used in this study were prepared with different growth temperatures. Particularly, the hydrogen passivation effect to the 9 nm quantum well located at near surface appeared much stronger than any others. Transition energy and optical gain related to the hydrogen passivation effects on the multi-quantum well structure was calculated by transfer matrix method.

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Effects of acid-anhydride hardener and postcuring heat-treatments on dielectric properties of epoxy composites (에폭시 복합체의 유전특성에 미치는 산무수물 경화제와 후경화 열처리의 영향)

  • 왕종배;이성일;이준웅
    • Electrical & Electronic Materials
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    • v.7 no.3
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    • pp.187-199
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    • 1994
  • In order to find an effect of structural changes due to variation of addition ratio of anhydride hardener and postcuring herat-treatments upon electrical properties of epoxy composites, the dielectric properties over a frequency range from 30[Hz] to l[MHz] were investigated in the temperature range of 20-180[.deg. C]. From the dielectric properties, the a peaks related with glass-transition phenomena of epoxy network appeared near 130[.deg. C], the conduction loss in high temperature region above 150[.deg. C] due to thermal dissociation of hardener started off with the low frequency side and the .betha. peak concerned with contribution of movable unreacted terminal epoxy groups and curing agents in the glass states concurred with the high-frequency side below 20[.deg. C]. And an effect of an hydride hardener upon structural changes and of postcuring heat treatments upon structural stability in epoxy composites would be explained through the estimation of the distribution of relaxation times and the activation energy for a .alpha. peak according to the WLF equations.

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The Development of Deep Silicon Etch Process with Conventional Inductively Coupled Plasma (ICP) Etcher (범용성 유도결합 플라즈마 식각장비를 이용한 깊은 실리콘 식각)

  • 조수범;박세근;오범환
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.17 no.7
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    • pp.701-707
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    • 2004
  • High aspect ratio silicon structure through deep silicon etching process have become indispensable for advanced MEMS applications. In this paper, we present the results of modified Bosch process to obtain anisotropic silicon structure with conventional Inductively Coupled Plasma (ICP) etcher instead of the expensive Bosch process systems. In modified Bosch process, etching step ($SFsub6$) / sidewall passivation ($Csub4Fsub8$) step time is much longer than commercialized Bosch scheme and process transition time is introduced between process steps to improve gas switching and RF power delivery efficiency. To optimize process parameters, etching ($SFsub6$) / sidewall passivation ($Csub4Fsub8$) time and ion energy effects on etching profile was investigated. Etch profile strongly depends on the period of etch / passivation and ion energy. Furthermore, substrate temperature during etching process was found to be an important parameter determining etching profile. Test structures with different pattern size have been etched for the comparison of the aspect ratio dependent etch rate and the formation of silicon grass. At optimized process condition, micropatterns etched with modified Bosch process showed nearly vertical sidewall and no silicon grass formation with etch rate of 1.2 ${\mu}{\textrm}{m}$/ min and the size of scallop of 250 nm.

Phase Transition of Biology Thin Film and Molecule Arrangement Properties (생체박막의 상전이와 분자배열특성)

  • Kim, Byung-Geun;Chon, Dong-Kyu;Kim, Young-Keun;Gu, Hal-Bon;Lee, Woo-Sun;Lee, Kyung-Sup
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.103-106
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    • 2003
  • It is well known that the state of existence of molecules on the surface of water changes during compression of the molecules. Electric methods, such as measurement of the surface potential or displacement current are also useful for investigating dynamic changes of molecular state on the water surface during compression. In this paper, We studied on the Bio thin film by Langmuir-Biodgett(LB) method. The Experiment method used displacement current, $\pi-A$ isotherm and BAM (Brewster Angle Microscopy). using the BAM, we can to the molecular orientation of monolayer on the water surface and directly see the morphology of the films on water subphase as well as that of the films.

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Thermal and Mechanical Properties of Insulation Materials for Underground Power Cable (지중 전력케이블용 절연재료의 열적 특성 및 기계적 특성)

  • Lee, Kyoung-Yong;Lee, Kwan-Woo;Choi, Yong-Sung;Park, Dae-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.05b
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    • pp.138-141
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    • 2004
  • In this paper, we Investigated effects on impurities and water of semiconductive shield through a thermal, mechanical, and absorption experiment to estimate performance of insulating materials in power cable. Specimens had been prepared 22[kV], 154[kV] XLPE power cables and then were made of sheet form with XLPE and semiconductive shield with dimension of 0.4[mm] ~1.2[mm] of thickness from power cable. Heat capacity $({\Delta}H)$ and glass trasition temperature (Tg) of XLPE sheet were measured by DSC (Differential Scanning Calorimetry). We could know that thermal stabilities of 154[kV] are more excellent than 22[kV] from this experimental result. The strain of mechanical properties in 22[kV] and 154[kV] XLPE was 486[%], 507[%] and stress was 1.74$[kgf/mm^2]$, 1.80$[kgf/mm^2]$. The absorption contents of existing semiconductive shield were measured 710[ppm] to 1,090[ppm], and semiconductive shield of 22[kV] cable was measured 14,750[ppm] to 24,780[ppm]. We thermal and mechanical properties of 154[kV] could know more excellent than 22[kV] from this experimental result.

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Synthesis of P2O5-V2O5-ZnO Glass Frit for Laser Sealing of OLED by the Addition of Filler (필러 첨가에 의한 OLED의 레이저 실링용 P2O5-V2O5-ZnO 유리프릿의 제조)

  • Bang, Jae-Chul
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.28 no.9
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    • pp.571-576
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    • 2015
  • In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.

Research for Solder Paste in Metallic Glass System for Thermoelectric Modules (고온열전모듈용 금속유리계 페이스트 연구)

  • Seo, Seung-Ho;Son, Geun Sik;Seo, Kang Hyun;Choi, Soon-Mok
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.4
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    • pp.249-254
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    • 2018
  • We researched about a bulk metallic glass system as an additive to an Ag paste for high temperature thermoelectric modules. Bulk metallic glass (BMG) ribbons were produced by using a rapid solidification process (RSP) under a cooling rate condition higher than $10^{\circ}C/sec$. We investigated BMG characteristics of the ribbons by means of x-ray diffraction (XRD) and differential scanning calorimetry (DSC) in order to evaluate the glass transition temperature ($T_g$) and the recrystallization temperature ($T_x$) lower than $400^{\circ}C$. A milling process was also developed to apply the BMG ribbons to a commercial Al paste as an additive for lower sintering temperature.

Fabrication of YBCO Superconducting Film with $CeO_2$/$BaTiO_3$Double Buffer Layer ($CeO_2$/$BaTiO_3$이중완충막을 이용한 YBCO 박막 제작)

  • 김성민;이상렬
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.11
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    • pp.959-962
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    • 2000
  • We have fabricated good quality superconducting YBa$_2$Cu$_3$$O_{7-x}$(YBCO) thin films on Hastelloy(Ni-Cr-Mo alloys) metallic substrates with CeO$_2$and BaTiO$_3$buffer layers in-situ by pulsed laser deposition in a multi-target processing chamber. YBCO film with CeO$_2$single buffer layer shows T$_{c}$ of 71.64 K and the grain size less than 0.1${\mu}{\textrm}{m}$. When BaTiO$_3$ is used as a single buffer layer, the grain size of YBCO is observed to be larger than that of YBCO/CeO$_2$by 200 times and the transition temperature of the film is enhanced to be about 84 K. CeO$_2$/BaTiO$_3$double buffer layer has been adopted to enhance the superconducting properties, which results in the enhancement of the critical temperature and the critical current density to be about 85 K and 8.4$\times$10$^4$ A/$\textrm{cm}^2$ at 77 K, respectively mainly due to the enlargement of the grain size of YBCO film.ilm.

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