• Title/Summary/Keyword: Electronic printing

검색결과 485건 처리시간 0.027초

LED를 이용한 플렉시블 면 조명의 신 제조 공정기술 개발 (New Manufacture Process Technology of Flexible Flat Lighting used LED)

  • 윤신용
    • 전기학회논문지P
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    • 제65권2호
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    • pp.142-150
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    • 2016
  • This paper developed new manufacture process technology of slim type flexible flat lighting product used lower power white LED. Flexible flat lighting is applied to letter sign lighting, traffic lighting, interior wall lighting, flat lighting, aquarium back lighting, wreath light etc. Main manufacture process technology were developed drawing software for electronics circuit, inkjet electronic circuit pattern and inkjet white ink coating. For pattern printing it was utilized for piezoelectonic inkjet head printing technology. Also high vacuum pressure laminating technology was waterproofing for LED flat lighting protection. Hence, form process technology we were manufactured for flexible flat lighting product of the power 12 W, input voltage 48 V and plane size $480{\times}480mm$. It acquired a these validity from experiment results.

Innovations in Materials Deposition for Plastic Electronics

  • Creagh, Linda T.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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    • pp.673-675
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    • 2005
  • Ink jet printheads are now widely used in manufacturing processes that require precise dispensing of materials. Today, Dimatix manufactures a variety of drop-on-demand ink jet printheads for the industrial printing market, but emerging opportunities present fresh challenges to our technology. In response to requirements for digitally printing on flexible substrates and dispensing novel electronic fluids, we are developing next generation jetting technology based on our three-dimensional silicon MEMS technology with a piezo-driven pumping chamber integrated into the chip structure. This presentation will address the functional and physical design features and properties of Dimatix's MEMS process, its characteristics, reliability and usability. Examples of opportunities and applications for digitally printing electronic fluids on flexible substrates with MEMS-based ink jet technology will be presented.

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부분용융법을 이용한 Bi-2212 초전도 후막 제작 (Fabrication of Bi-2212 Superconducting thick Films by MPMG process)

  • 강형곤;임성훈;임성우;한병성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.77-79
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    • 1999
  • Bi$_2$Sr$_2$CaCu$_2$O(Bi-2212) thick films were fabricated on Y211 substrate by screen printing method. The aim of the study was to fabricate superconducting thick films on Y211 substrate by MPMG process. For this study, patterned samples by screen printing method were heated with MPMG process. The thickness of Bi2212 on substrate was about 20 ${\mu}{\textrm}{m}$ and these samples showed many Bi- 2212 phases.

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동테이프 위의 Bi-계 초전도 후막에서 전구체분말 조성의 영향 (The Effect of the precursor powder composition for Bi-system superconducting thick films on Cu tapes)

  • 한상철;성태현;한영희;이준성;김상준
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.65-68
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    • 1999
  • A well oriented Bi2212 superconductor thick films were fabricated by screen printing with a Cu-free Bi-Sr-Ca-O mixture powder on a copper plate and heat-treating at 820-88$0^{\circ}C$ for several minute in air. During the heat-treatment, the printing layer partially melted by reaction between the Cu-free precursor and CuO of the oxidizing copper plate. In the partial melting state, it is believed that the solid phase is Bi-free phase and Cu-rich phase and the composition of the liquid is around Bi : Sr : Ca : Cu = 2 : 2 : 0 : 1. Following the partial melting, the Bi2212 superconducting phase is formed at Bi-free phase/liquid interface by nucleation and grows. With decreasing the Bi composition in the precursor powder, the critical temperature(T$_{c}$) of the fabricated Bi2212 thick film increased to about 79 K.K.

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인쇄 전자 용지의 특성 구현을 위한 치수 안정성 향상에 대한 연구 (Improvement of Paper Dimensional Stability for The Printed Electronics Base Paper)

  • 김병현;유희태;강영립
    • 한국인쇄학회지
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    • 제29권1호
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    • pp.35-44
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    • 2011
  • For printed electronic paper making which is high leveled dimensional stability. The furnish which is hard wood pulp and soft wood pulp, mixed with hard and soft wood pulp is added sea algae pulp. If sea algae pulp was added 15% contents, paper which is made with hard wood pulp is increased about 28% dimensional stability and soft wood pulp is increased about 32%, dimensional stability and hard wood 30% and soft wood 70% mixed pulp is increased about 40% dimensional stability.

롤프린트(Roll-print) 방식을 이용한 디스플레이의 특허동향(한국, 일본) (Patent Trend Report for Display using Roll-print manufacturing method(KR, JP))

  • 정인성;박지훈
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.35-35
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    • 2007
  • The roll printing technique is the updated technology which will substitute a existing lithography technique for a field of the display such as LCD, PDP, OLED and FED etc. Currently, the patent trend analysis about research and development of the different enterprises are demanded, because it is forecast that the dominion of display market will be exchanged by research and development result of roll-printing technique. In this presentation, it is analyzed on patent trends applied the roll printing technique for a field of the display such as LCD, PDP, OLED and FED etc in Korea and Japan by the various methods.

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저가형 금속 전극이 적용된 양산형 결정질 실리콘 태양전지 특성 평가 (Investigation of low cost contact formation for crystalline Si solar cells)

  • 최준영;김범호;이은주;이수홍
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.142-143
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    • 2007
  • 현재 양산용 태앙전지 제조에 가장 널리 쓰이는 전극형성 기술인 Screen printing 기법은 진공 증착법과 무전해 도금에 의한 방법과, 비교할 때 공정장비가 간단하고 자동화에 적합하여 70 년대 이후로 널리 사용되어 왔다. 본 실험에서는 Screen printing기법과 Porous Si을 이용한 양산형 실리콘 태양전지를 제작하여 그 특성을 평가하였으며 13.2%의 변환효율을 나타내었다.

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잉크젯 프린팅을 이용한 CNT-FED의 전계 방출 특성 (Field emission characteristics of CNT-FED using ink-jet printing)

  • 송진원;윤여환;한창수
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.426-426
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    • 2007
  • We report the field emission characteristics of transparent single-walled carbon nanotube (SWNT) film printed using an inkjet. Pure SWNTs dispersed in dimethylformamide were printed in a transparent layer on indium-tin oxide-coated glass and annealed at $350^{\circ}C$. After taping treatment, SWNTs were oriented vertically on the substrate. The front and the back of the fabricated device produced simultaneous emissions of identical quality. In addition, inkjet printing directly achieved a patterned emission, without a secondary pattern process. This method allows simple fabrication using only SWNTs, without the use of other additives.

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제작조건에 따른 PZT후막의 구조적 특성 (The Structural properties of PZT thick film with preparation condition states)

  • 강정민;조현무;이성갑;이상헌;이영희;배선기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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    • pp.142-145
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    • 2004
  • [ $Pb(Zr_{0.8}Ti_{0.2})TiO_3$ ] powder were prepared by the sol-gel method using a solution of Pb-acetate, Zr n-propoxide and Ti iso-propoxide. PZT thick film were fabricated by the screen printing method. and then the structural properties as a function of the sintering temperature were studied. PZT film thickness, obtained by four screen printing, was approximately $70{\sim}90{\mu}m$. The PZT thick film, sintered at $1050^{\circ}C$, showed deuse and uniform grain stractures and percent porosity of the thick film was 25.43%.

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경화 온도와 인쇄 공정 및 기판에 따른 폴리머 후막 저항체의 특성 변화에 대한 연구 (Study on variation of electrical properties of polymer thick film resistor regarding curing temperature, printing process and substrate)

  • 유명재;이상명;박성대;이우성;강남기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.311-312
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    • 2005
  • Applying a designed test coupon pattern for fabricating resistors various resistors were formed using PTF(polymer thick film) pastes. Aspect ratio from 0.25 to 4 were selected for fabricating resistors. Formed resistors were cured at $170^{\circ}C$ and $240^{\circ}C$. Electrical properties of fabricated resistors were measured and their values analyzed in relation to cure temperature and formed geometry via printing. Also effects of substrates used for fabricating resistors were observed.

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