• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.63.1-63.1
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• 2012

In recent years, the functional inks for printed electronics that can be combined with a variety of printing techniques have attracted increasingly significant interest for use in low cost, large area, high performance integrated electronics and microelectronics. In particular, the development of solution-processable conductor, semiconductor and insulator materials is of great importance as such materials have decisive impacts on the electrical performance of various electronic devices, and, therefore, need to meet various requirements including solution processability, high electrical performance, and environmental stability. Semiconductor inks such as IGO, CIGS are synthesized by chemical solution method and microwave reaction method for TFT and solar cell application. Fine circuit pattern with high conductivity, which is valuable for flexible electrode for PCB and TSP devices, can be printed with highly concentrated and stabilized conductor inks such as silver and copper. Solution processed insulator such as polyimide derivatives can be use to all printed TFT device. Our research results of functional inks for printed electronics provide a recent trends and issues on this area.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1703-1704
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• 2006

In this paper, PZT(20/80) thick films were fabricated by the screen-printing method. And the PZT(80/20) coating solution was synthesized by the sol-gel method. PZT(20/80) thick films were screen-printed on the alumina substrates. PZT(80/20) thin film was spin-coated on the PZT(20/80) thick films to obtain densification. And the structural and electrical properties of PZT thick films were investigated with variation of sintering temperature. The PZT specimen sintered at $650^{\circ}C$ showed good relative dielectric constant of 219 and dielectric loss of 2.45%. Also the remanent polarization and the coercive field were $16.48{\mu}C/cm^2$ and 35.48kV/cm, respectively.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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• pp.416-416
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• 2016

Organic-inorganic metal halide perovskite solar cells have received attention because it has a number of advantages with excellent light harvesting, high carrier mobility, and facile solution processability and also recorded recently power conversion efficiency (PCEs) of over 20%. The major issue on perovskite solar cells have been reached the limit of small area laboratory scale devices produced using fabrication techniques such as spin coating and physical vapor deposition which are incompatible with low-cost and large area fabrication of perovskite solar cells using printing and coating techniques. To solution these problems, we have investigated the feasibility of achieving fully printable perovskite solar cells by the blade-coating technique. The blade-coating fabrication has been widely used to fabricate organic solar cells (OSCs) and is proven to be a simple, environment-friendly, and low-cost method for the solution-processed photovoltaic. Moreover, the film morphology control in the blade-coating method is much easier than the spray coating and roll-to-roll printing; high-quality photoactive layers with controllable thickness can be performed by using a precisely polished blade with low surface roughness and coating gap control between blade and coating substrate[1]. In order to fabricate perovskite devices with good efficiency, one of the main factors in printed electronic processing is the fabrication of thin films with controlled morphology, high surface coverage and minimum pinholes for high performance, printed thin film perovskite solar cells. Charge dissociation efficiency, charge transport and diffusion length of charge species are dependent on the crystallinity of the film [2]. We fabricated the printed perovskite solar cells with large area and flexible by the bar-coating. The morphology of printed film could be closely related with the condition of the bar-coating technique such as coating speed, concentration and amount of solution, drying condition, and suitable film thickness was also studied by using the optical analysis with SEM. Electrical performance of printed devices is gives hysteresis and efficiency distribution.

• 대한전자공학회논문지SP
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• 제38권2호
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• pp.208-217
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• 2001

본 논문에서는 칼라 영상의 프린팅을 위하여 도트 패턴 데이터 베이스를 이용하는 모델 기반 칼라 영상 중간조 알고리즘을 제안한다. 제안된 알고리즘에서 사용된 도트 패턴 데이터 베이스는 블루 노이즈 마스크에 기반하여 칼라 영상을 이루는 RGB 세 도메인의 칼라 값에 따른 원형 도트 중첩 모델을 이용하여 생성된다. 중간조 처리 과정에서는 입력되는 RGB 칼라 값을 재현하기 위하여 입력 칼라 값과 만들어진 도트 패턴 데이터 베이스의 칼라 값을 비교하여 최소가 되는 패턴을 그 칼라 값의 중간조 패턴으로 선택하는데, 이 선택과정에서는 인간 시각의 대조 민감도 함수를 적용함으로써 원영상에 대한 사람의 인식도와 출력을 위해 선택하려는 도트 패턴에 대한 사람의 인식도를 비교하여 좋은 화질의 영상을 출력할 수 있게 한다. 실험에서는 칼라 패치를 만들어 모니터와 프린터데서 출력한 후 칼라 스펙트럼 측정기를 이용하여 측정한 후 칼라 오차인 ΔΕ/Sub ab/를 비교함으로써 본 논문에서 제안한 방법에 의한 결과가 기존의 방법들보다 더 정확히 입력된 칼라를 재현할 수 있음을 보인다.

• 한국전자파학회논문지
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• 제28권12호
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• pp.1007-1010
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• 2017

본 논문에서는 건물 내에서 통신성능 저하의 원인이 되는 인접 채널의 신호를 제어하기 위해 대역 저지 특성을 갖는 주파수 선택 표면구조를 설계하였다. 제안된 구조는 입사파의 편파 및 입사각에 안정적인 주파수 특성 구현을 위해 프랙탈 형상 기반의 소형화된 단위구조를 사용하였으며, 실제 적용성을 고려, 적은 제작비용으로 대량생산이 용이한 인쇄전자 기술을 이용하여 얇은 필름형 주파수 선택 표면구조를 제작하였다. 전통적인 회로제작 방식인 PCB 공정이 아닌 전도성 Ag 잉크를 이용한 스크린 프린팅 공정을 통해 생산성 및 환경성을 개선하였으며, 설계한 결과를 바탕으로 자유공간 측정을 통해 입사파의 편파 및 입사각에 대한 안정적인 특성을 검증하고, 실제 건물 내벽에 적용 후, 수신 신호강도 측정을 통해 주파수 선택 성능을 확인하였다.

• 한국기계가공학회지
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• 제14권3호
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• pp.15-20
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• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• 대한기계학회논문집A
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• 제36권2호
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• pp.173-178
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• 2012

최근 RFID, 유연디스플레이, 태양전지, 전자 종이 등의 소자를 프린팅 방식을 이용하여 생산하려는 연구가 활발하게 진행 되고 있다. 이런 방식이 기존의 노광기술과 식각기술에 의존하는 반도체 공정에 비해 가격 경쟁력에서 우수하기 때문이다. 특히 RFID, 유연디스플레이, 태양전지, 전자 종이 등은 유연성과 대량생산을 필요로 하기 때문에 롤투롤(roll to roll)공정과 같은 저가격화, 대형생산화에 관심이 집중되고 있다. 이 롤투롤 기술을 사용하기 위해서는 인쇄 패턴의 빠른 구현, 표면 균일도, 두께 등의 높은 인쇄 품질이 보장 되어야 한다. 본 연구는 실험계획법(Design of Experiment)을 적용하여 인자들의 주효과와 교호작용 효과를 분석하고, 롤투롤 전자인쇄 시스템에서 닙 롤의 특성에 따른 인쇄 품질의 영향과 인쇄 품질의 향상 방안을 찾기 위한 매칭기술을 제안 하였다.

• 한국세라믹학회지
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• 제51권4호
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• pp.362-366
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• 2014

Dye-sensitized solar cells (DSSCs) were synthesized using a $0.25cm^2$ area of a $TiO_2$ nanoparticle layer as the electrode and platinum (Pt) as the counter electrode. The $TiO_2$ nanoparticle layers (12 to 22 ${\mu}m$) were screen-printed on fluorine-doped tin oxide glass. Glancing angle X-ray diffraction results indicated that the $TiO_2$ layer is composed of pure anatase with no traces of rutile $TiO_2$. The Pt counter electrode and the ruthenium dye anchored $TiO_2$ electrode were then assembled. The best photovoltaic performance of DSSC, which consists of a $18{\mu}m$ thick $TiO_2$ nanoparticle layer, was observed at a short circuit current density ($J_{sc}$) of $14.68mA{\cdot}cm^{-2}$, an open circuit voltage ($V_{oc}$) of 0.72V, a fill factor (FF) of 63.0%, and an energy conversion efficiency (${\eta}$) of 6.65%. It can be concluded that the electrode thickness is attributed to the energy conversion efficiency of DSSCs.

• 센서학회지
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• 제28권3호
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• pp.198-204
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• 2019

In this study, we propose a wearable force sensor using 3D printed mold and liquid metal. Liquid metal, such as Galinstan, is one of the promising functional materials in stretchable electronics known for its intrinsic mechanical and electronic properties. The proposed soft force sensor measures the external force by the resistance change caused by the cross-sectional area change. Fused deposition modeling-based 3D printing is a simple and cost-effective fabrication of resilient elastomers using liquid metal. Using a 3D printed microchannel mold, 3D multichannel Galinstan microchannels were fabricated with a serpentine structure for signal stability because it is important to maintain the sensitivity of the sensor even in various mechanical deformations. We performed various electro-mechanical tests for performance characterization and verified the signal stability while stretching and bending. The proposed sensor exhibited good signal stability under 100% longitudinal strain, and the resistance change ranged within 5% of the initial value. We attached the proposed sensor on the finger joint and evaluated the signal change during various finger movements and the application of external forces.