• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2011년도 춘계학술발표대회
• /
• pp.2.2-2.2
• /
• 2011

In this talk, the general concept of roll-to-roll printing technologies will be introduced with basic fundamentals of ink formulations for printing electronic devices as the first part of the talk. As the second part, based on the R2R printing process, key factors for printing TFTs, IC, PV and display would be presented using the information from the case study of R2R gravure and offset.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
• /
• pp.545-548
• /
• 2002

$(Ba_{0.6-x}Sr_{0.4}Ca_x)TiO_3$(BSCT) (x=0.10, 0.15, 0.20) powders were prepared by the sol-gel method and BSCT thick films were fabricated by the screen-printing method. The structural properties as a faction of the composition ratio were studied. As a result of the differential thermal analysis (DTA), exothermic perk was observed at around $860^{\circ}C$ dne to the formation of the polycrystalline perovskite phase. The BSCT thick films sintered at $1350^{\circ}C$ for 2h showed the average grain size of $2{\sim}7{\mu}m$. The average thickness of BSCT thick films, obtained by 3 times of screen-printing, was approximately $85{\mu}m$.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
• /
• pp.384-385
• /
• 2006

We studied about conductive pastes of the source-drain contacts for OTFTs(organic thin-film transistors) fabricated by direct printing(screen printing) method. We used Ag and conductive carbon black powder as the conductive fillers of pastes. The conductive pastes were manufactured by various dispersing agents and dispersing conditions and source-drain contacts with $100{\mu}m$ of channel length were fabricated. We could obtain the OTFTs which exhibited different field-effect behaviors over a range of source-dram and gate voltages depending on a kind of conductive fillers used conductive pastes.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 추계학술대회 논문집
• /
• pp.689-693
• /
• 2005

Inkjet printing is a non-contact and direct writing associated with a computer. In the industrial field, there have been many efforts to utilize the inkjet printing as a new way of manufacturing, especially for electronic devices. For the application of inkjet printing to electronic field, one of the key factors is exact realization of designed images into printed patterns. In this work, micro patterning for conducting line has been studied using the piezoelectric print head and silver nano ink. Dimensions of printed images have been predicted in terms of print resolution and diameter of a single dot. The predicted and the measured values showed consistent results. Using the results, the design capability for industrial inkjet printing could be achieved.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
• /
• pp.354-357
• /
• 2002

박막과 후막을 구분하고 현재에는 막의 형성 구분에 따라 박막에는 진공증착 후막에는 Screen Printing, Dipping, Brashing, Rolling으로 구분한다. 기술에는 여러 가져가 있는데, 금속 분말 제조기술, 유리분말제조기술, 유기바인더제조기술, 첨가제배합기술, 전자측정기술, 분체제어기술이 있다. 본 연구의 목표는 용도에 알맞은 최적화된 새로운 제조기술을 제시하고자 한다.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
• /
• pp.502-502
• /
• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 대한기계학회논문집A
• /
• 제34권3호
• /
• pp.263-271
• /
• 2010

e-Printing은 전통 인쇄 기술을 기반으로 하는 전자소자를 생산하기위한 새로운 기술이다. 이러한 인쇄 전자 소자들은 가격을 낮추기 위하여 대면적 인쇄가 요구된다. 이렇듯 원가를 절감하며 전자 소자에 요구되는 정밀도를 충족하기 위하여 롤투롤(Roll to Roll) 방식의 그라비아(Gravure) 인쇄 시스템이 하나의 대안으로 제시된다. 그라비아 인쇄에는 인쇄 전자 소자의 성능에 영향을 미치는 요소들이 매우 많다 : 건조 방식, 건조 온도, 운전 장력, 인쇄 속도, 잉크 점도, 잉크의 전도성, 망점 및 패턴의 정밀도. 이상에서 언급한 요소들은 각각 매우 밀접한 관계를 가지고 있다. 따라서 인쇄 전자소자의 성능을 향상시키기 위해서는 반듯이 인쇄 적합조건을 찾아야만 한다. 본 논문에서는, 전도성 잉크 및 그라이아 인쇄기를 사용하여 다양한 요소의 조건을 변화하여 패턴(선 및 면)을 인쇄하였으며, 각 인쇄 요소의 변화가 인쇄 전자소자의 성능에 미치는 영향에 관하여 분석 및 연구를 수행하였다.

• 한국정밀공학회지
• /
• 제31권11호
• /
• pp.969-974
• /
• 2014

Previously fabricated electronic devices were used for vacuum manufacturing processes such as conventional semiconductor manufacturing. However, they are difficult to apply to continuous processes such as roll-to-roll printing, which results in very high device manufacturing and processing costs. Therefore, many developers have been interested in applying continuous processes to contact printing or noncontact printing technologies and they proposed various continuous printing techniques instead of conventional batch coating. In this paper, we proposed improved gravure offset printing process as one of the contact printing technique. We used etching pattern geometry with soft core blanket roll for printing of ultra fine line below the 10um.Using this technique we obtained flexible metal grid mesh film as transparent conductive film.

• 한국전기전자재료학회논문지
• /
• 제37권4호
• /
• pp.382-393
• /
• 2024

유체 디스펜싱(fluid dispensing) 방식인 Microplotter 시스템은 압전 소자를 통한 초음파 펌핑(pumpin)을 기반으로 유체를 분사한다. 이 기법은 넓은 범위의 점도를 가진 다양한 물질들이 마이크로 사이즈로 프린팅 되는 것을 가능하게 한다. 본 논문에서는 디스펜서 프린팅 기술에 대해 소개하고 장비를 이용한 다양한 공정을 이해 및 응용에 목적을 두고 있다. 또한, 분사 강도, 분사 시 팁의 높이, 분사 속도와 같은 매개변수들을 조절하여 장비의 최적화 방법에 대해 설명하고자 한다. 금속 나노 입자, 탄소나노튜브, DNA, 단백질 등 광범위한 유체와 호환된다는 Microplotter의 장점을 이용함으로써 인쇄전자, 생명공학, 화학공학 등 다양한 분야에서 활용될 것으로 기대된다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2007년도 춘계학술대회 논문집
• /
• pp.645-646
• /
• 2007