• Progress in Superconductivity and Cryogenics
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• v.11 no.4
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• pp.25-28
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• 2009

In order to apply superconducting electric machineries such as a Superconducting Fault Current Limiter (SFCL) to the power grid, the single module should be connected in series to have reasonable size. Superconducting tapes in the module also should be stacked to satisfy requirements such as large operation current of the power grid. This is because a single superconducting tape has restricted applicable current capacity. Moreover especially in SFCL at the fault, there should be equal voltage distribution in series-connected SFCL modules. In this paper, we investigated the voltage distribution in fault current of series-connected YBCO coated conductors (CC). Depending on characteristics of the CC samples such as critical current, even voltage distribution could be achieved or not. In addition, the effect of stacked CC on the change of voltage distribution comparing to non-stack cases in series connection was confirmed by experiments. As the CC stacked, voltage difference could be reduced.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• Journal of Power Electronics
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• v.10 no.1
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• pp.97-105
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• 2010

This paper presents the modeling, control and simulation of an interconnection system (ICS) of cascaded distributed generation (DG) modules for both grid-tied and stand-alone operations. The overall configuration of the interconnection system is given. The interconnection system consists of a cascaded DC/DC boost converters and a DC/AC inverter. Detailed modeling of the interconnection system incorporating a cascaded architecture has not been considered in previous research. In this paper, suitable control systems for the cascaded architecture of power electronic converters in an interconnection system have been studied and modeled in detail. A novel control system for DC/DC boost converters is presented based on a droop voltage controller. Also, a novel control strategy for DC/AC inverters based on the average large signal model to control the aggregated DG modules under both grid-tied and stand-alone modes is demonstrated. Simulation results indicate the effectiveness of the proposed control systems.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.4 no.4
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• pp.264-271
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• 2011

ILS(Instrument Landing System) is the international standard system for approach and landing guidance. ILS was adopted by ICAO(International Civil Aviation Organization) in 1947 and is currently being used in commercial systems. To design the digital transmitter and receiver modules that can be mounted in the integrated ILS, we propose the digital design methods of digital double AM modulator and demodulator using FPGA chip, DDS(Direct Digital Synthesizer) for generation of sampling clock, demodulator of DDC(Digital Down Converter) structure, and spectrum analyzer using DSP chip. We demonstrate the efficiency of the proposed design method through experiments using developed transmitter and receiver modules. This system can be used as a high-performance commercial system.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.41 no.8
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• pp.986-994
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• 2016

In this paper, we proposed ultrasonic radar module and fixed module for the 2D indoor map building and from each of the modules, we can see the possibilities, limitations and considerations. And finally show the result of building actual 2D indoor map from the modules. Recently there are lots of works for the building indoor map by spotlight on the simultaneous localization and mapping (SLAM). And the LiDAR, ultrasonic, camera sensors are usually used for this work. Especially the LiDAR sensor have a higher resolution and wider detection range more than the ultrasonic sensor, but also there are limitation in the size of module, higher cost, much more throughput of processing data, and weaker to use in various indoor environment noises. So from these reasons, in this paper we could verify that proposed modules and schemes have a enough performance to build the 2D indoor map instead of using LiDAR and camera sensor with minimum number of ultrasonic sensors and less throughput of processing data.

• ETRI Journal
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• v.35 no.3
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• pp.386-396
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• 2013

A 10-Gbit/s wireless communication system operating at a carrier frequency of 300 GHz is presented. The modulation scheme is amplitude shift keying in incoherent mode with a high intermediate frequency (IF) of 30 GHz and a bandwidth of 20 GHz for transmitting a 10-Gbit/s baseband (BB) data signal. A single sideband transmission is implemented using a waveguide-tapered 270-GHz high-pass filter with a lower sideband rejection of around 60 dB. This paper presents an all-electronic design of a terahertz communication system, including the major modules of the BB and IF band as well as the RF modules. The wireless link shows that, aided by a clock and data recovery circuit, it can receive $2^7$-1 pseudorandom binary sequence data without error at up to 10 Gbit/s for over 1.2 m using collimating lenses, where the transmitted power is 10 ${\mu}W$.

• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.703-707
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• 2001

The demand for protection of power electronic applications has during the last couple of years increased regarding the high-power IGBT modules. Even with an active protection, a high power IGBT still has a risk of exhibiting a violent rupture in the case of a fault if IGBT Fuses do not protect it. By introducing fuses into the circuit this will increase the circuit inductance and slight increase the over-voltage during the turn-off of the diode and the IGBT. It is therefore vital when using fuses that the added inductance is kept at a minimum. This paper discuss three issues regarding the IGBT Fuse protection. First, the problem of adding inductance of existing High-Speed and new Typower fuses in DC-link circuit is treated, second a short discussion of the protection of the IGBT module is done, and finally, the impact of the high frequency loading on the current carrying capability of the fuses is presented.

• Journal of IKEEE
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• v.18 no.4
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• pp.603-611
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• 2014

When image sensor and lens are fixed on the module, mechanical errors often induce tilt, rotation, or narrow field-of-view of the acquired image. Therefore, the optical characteristics of image sensor modules should be tested by test equipments. This paper explains how to test the optical characteristics of images sensors. It also proposes the standardized description methods of optical characteristics tests which are similar with those of image acquisition characteristics tests. The proposed method helps the test equipments to perform image acquisition characteristics tests and optical characteristics tests together.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.245-249
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• 2004

This paper describes the vibration characteristics of Nd:YAG laser welding plates analyzed time-average Electronic Speckle Pattern Interferometry(ESPI). In laser welding, the travel speed has influence on a mechanical properties, such as elastic modules, response frequencies and so on, which is resulted on a residual stress of the welding zone. the response frequencies related to elastic modules are determined by time-average ESPI and the results, as compared to each condition, are used to estimate optimal condition of travel speed.