• Fashion & Textile Research Journal
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• v.20 no.1
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• pp.101-107
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• 2018

The purpose of this study is to develop the electroconductive textiles based on polyurethane(PU) nanoweb and to explore that it is applicable to smart clothing. The electroconductive textiles developed by coating 2.0 wt% aqueous dispersed non-oxidized graphene paste on the surface of PU nanoweb. The fabricated electroconductive nanoweb was applied as a transmission line to connect the LED lamp, and the brightness of the LED lamp was measured to confirm its performance. The nanoweb transmission line was fixed by two methods(seam sealing tape, embroidering) to connect the LED lamp and AA batteries. The results as follows, the brightness of the LED lamp fixed with seam sealing tape was about 82 lux, and which fixed with embroidering was about 57 lux. It represents that the nanoweb transmission line which fixed with the seam sealing tape has better electrical signal transmitting because the lux value higher than the one fixed by embroidering. In order to compare the performance of the nanoweb transmission line and the metal wire, we connected the LED lamp with copper wire. The brightness of copper wire connected LED lamp was about 193 lux. Although the electrical signal strength of the nanoweb transmission line was weaker than the copper wire, it was reachable to operate LED lamp. The results of this study will provide a basic data to develop the textile based electronic devices, and conducting wire for smart clothing.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1096_1097
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• 2009

Aluminium doped zinc oxide(ZnO:Al) thin film, which is mainly used as a transparent conducting electrode in electronic devices, has many advantages compared with conventional indium tin oxide(ITO). In this paper in order to investigate the possible application of ZnO:Al thin films as a transparent conducting electrode for flexible film-typed dye sensitized solar cell (FT-DSCs), ZnO:Al and ITO thin films were prepared on the polyethylene terephthalate (PET) substrate by r. f. magnetron sputtering method. Specially one-inched FT-DSCs using either a ZnO:Al or ITO electrode were also fabricated separately under the same manufacturing conditions. Some properties of both the FT-DSCs with ZnO:Al and ITO transparent electrodes, such as conversion efficiency, fill factor, and photocurrent were measured and compared with each other. The results showed that by doping the ZnO target with 2 wt% of $Al_2O_3$, the film deposited at discharge power of 200W resulted in the minimum resistivity of $2.2\times10^{-3}\Omega/cm$ and at ransmittance of 91.7%, which are comparable with those of commercially available ITO. Two types of FT-DSCs showed nearly the same tendency of I-V characteristics and the same value of conversion efficiencies. Efficiency of FT-DSCs using ZnO:Al electrode was around 2.6% and that of fabricated FT-DSCs using ITO was 2.5%. This means that ZnO:Al thin film can be used in FT-DSCs as a transparent conducting layer.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1425_1426
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• 2009

In this study, commercially available polyethylene terephthalate(PET), which is widely used as a substrate of flexible electronic devices, was modified by dielectric barrier discharge(DBD) method in an air condition at atmospheric pressure, and aluminium - doped zinc oxide (ZnO:Al) transparent conducting film was deposited on PET substrate by r. f. magnetron sputtering method. Surface analysis and characterization of the plasma-treated PET substrate was carried out using contact angle measurements, X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscopy (AFM). Especially the effect of surface state of PET substrate on some important properties of ZnO:Al transparent conducting film such as electrical and morphological properties and deposition rate of the film, was studied experimentally. The results showed that the contact angle of water on PET film was reduced significantly from $62^{\circ}$ to $43^{\circ}$ by DBD surface treatment at 20 min. of treatment time. The plasma treatment also improved the deposition rate and electrical properties. The deposition rate was increased almost linearly with surface treatment time. The lowest electrical resistivity as low as $4.97{\times}10^{-3}[\Omega-cm]$ and the highest deposition rate of 234[${\AA}m$/min] were obtained in ZnO:Al film with surface treatment time of 5min. and 20min., respectively.

• Journal of Electrical Engineering and Technology
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• v.4 no.4
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• pp.546-551
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• 2009

In this paper, we describe a self-aligned fabrication method for a nano-patterned bottom electrode using flood exposure from the backside. Misalignments between layers could cause the final devices to fail after the fabrication of the nano-scale bottom electrodes. A self-alignment was exploited to embed the bottom electrode inside the glass substrate. Aluminum patterns act as a dry etching mask to fabricate glass trenches as well as a self-aligned photomask during the flood exposure from the backside. The patterned photoresist (PR) has a negative sidewall slope using the flood exposure. The sidewall slopes of the glass trench and the patterned PR were $54.00^{\circ}$ and $63.47^{\circ}$, respectively. The negative sidewall enables an embedment of a gold layer inside $0.7{\mu}m$ wide glass trenches. Gold residues on the trench edges were removed by the additional flood exposure with wet etching. The sidewall slopes of the patterned PR are related to the slopes of the glass trenches. Nano-scale bottom electrodes inside the glass trenches will be used in beam resonators operating at high resonant frequencies.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.5 no.2
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• pp.61-67
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• 2012

In this paper, In this paper, we consider a dynamic range in the frequency converter to obtain a high conversion gain and linearity while operating area proposed to broaden the design. Super-heterodyne RF Front-End style was applied to the active mixer stage, GaAs devices were used. Circuit design easy and simple forms benefit circuit is constructed in the drain mixer, passive mixer with the operating area were compared and analyzed. The simulation results of the conversion gain of 2.4dB and 0.2dBm about a gain-compression point, and showed the dynamic range of 71.9dB, when compared with passive mixers, dynamic range of approximately 6dB improvement was identified. Measurements of an approximately 2dB conversion gain and-1.0dBm of the gain-compression point, and confirmed that the active area of 71.1dB. When compared with passive mixers, dynamic range of is reduced by approximately 8dB has been improved.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.6 no.4
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• pp.201-207
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• 2013

Voice Recognition technique has been developed and it has been actively applied to various information devices such as smart phones and car navigation system. But the basic research technique related the speech recognition is based on research results in English. Since the lip sync producing generally requires tedious hand work of animators and it serious affects the animation producing cost and development period to get a high quality lip animation. In this research, a real time processed automatic lip sync algorithm for virtual characters in digital contents is studied by considering Korean vocal sound system. This suggested algorithm contributes to produce a natural lip animation with the lower producing cost and the shorter development period.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.16 no.2
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• pp.113-120
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• 2002

This paper describes characteristics of transient voltage waveforms caused by human electrostatic discharges(ESDs). For purpose of achieving the statistics on the meaningful amplitude and initial slope for transient ESD voltage waveforms, transient voltages due to human ESDs in various conditions were observed. A voltage measuring system with a wide bandwidth from DC to 400[MHz] was employed. ESD voltage waveforms are approximately the same as ESD current waveforms. Also the simulated results, which are calculated by the reposed equivalent circuit, are closely similar to the measured voltage waveforms. ESD voltage waveforms are strongly dependent on the approach speed and material of intruder, a fast approach causes ESD voltage waveform with a steep rise time than for a slow approach. The voltage waveforms from dialect finger ESDs have a relatively long rise time of 10∼30[ns], but their peaks are low. On the other side ESD voltage waveforms causer by screwdriver with insulating handle have a steep slope with a very short, less than 1[ns] rise time, but their initial spikes are extremely high The obtained results in this work would be applied to solve ESD problems for low voltage and small current electronic devices.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.2
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• pp.408-413
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• 1996

A self-diagnostic, air-damped, piezoresitive, cantilever-beam microaccelerometer has been designed, fabricated and tested for applications to automotive electronic airbag systems. A skew-symmetric proof-mass has been designed for self-diagnostic capability and zero transverse sensitivity. Two kinds of multi-step anisotropic etching processes are developed for beam thickness control and fillet-rounding formation, UV-curing paste has been used for sillicon-to-glass bounding. The resonant frequency of 2.07kHz has been measured from the fabricated devices. The sensitivity of 195 $\mu{V}$/g is obtained with a nonlinearity of 4% over $\pm$50g ranges. Flat amplitude response and frequency-proportional phase response have been obserbed, It is shown that the design and fabricaiton methods developed in the present study yield a simple, practical and effective mean for improving the performance, reliability as well as the reproducibility of the accelerometers.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.4
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• pp.351-357
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• 2013

In flip chip packaging, underfill process is used to fill epoxy bonder into the gap between a chip and a substrate in order to improve the reliability of electronic devices. Underfill process by capillary motion can give rise to unwanted air void formations since the arrangement of solder bumps affects the interfacial dynamics of flow meniscus. In this paper, the unsteady flows in the capillary underfill process are visualized and then the racing effect and merging of the meniscus are investigated according to the arrangement of solder bumps. The result is shown that at higher bump density, the fluid flow perpendicular to the main direction of flow becomes stronger so that more air voids are formed. This phenomenon is more conspicuous at a staggered bump array than at a rectangular bump array.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.17 no.3
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• pp.51-58
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• 2018

In this paper, the organic material Poly(methyl methacrylate) PMMA is used with inorganic $Al_2O_3$ to fabricate organic-inorganic multilayer barrier thin films. The organic thin films are developed using a roll-to-roll electrohydrodynamic atomization system, whereas the inorganic are grown using a roll-to-roll low-temperature atmospheric pressure atomic layer deposition system. For the first time, these two technologies are used together to develop organic-inorganic multilayer barrier thin films in atmospheric condition. The films are grown under optimized parameters and classified into three classes based on the layer structures, when the total thickness of the barrier is maintained at ~ 160 nm. All classes of barriers show good morphological, optical and chemical properties. The $Al_2O_3$ films with a low average arithmetic roughness of 1.58 nm conceal the non-uniformity and irregularities in PMMA thin films with a roughness of 5.20 nm. All classes of barriers show a notably good optical transmission of ~ 85 %. The hybrid organic-inorganic barriers show water vapor and oxygen permeation in the range of ${\sim}3.2{\times}10^{-2}g/m^2/day$ and $0.015cc/m^2/day$ at $23^{\circ}C$ and 100% relative humidity. It has been confirmed that it can be mass-produced and used as a low-cost barrier thin film in various printing electronic devices.