• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.12 no.1
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• pp.275-281
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• 2012

Community network is a communication environment where heterogeneous devices can access and communicate with each other at any time and at any space to share information. To do so, mobile devices are required to be self-configured even in absence of communication infrastructures. Semi-infrastructured wireless ad-hoc network is a promising solution to meet with such a requirement. This paper proposes the VTC(virtual topology coordinator) system as an evaluation tool for examining network protocols that are intended to be deployed in the semi-infrastructured ad-hoc networks. VTC emulates multi-hops wireless network topology virtually using a mechanism of selective receiving MAC frame in a small area, where only a single hop communication is available. VTC system cannot consider all properties introduced in real wireless network, but do more wireless properties than verification through simulation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.10
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• pp.1-10
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• 2000

A rigorous modeling of ultra-low energy implantation is becoming increasingly more important as devices shrink to deep submicron dimensions. In this paper, we have developed an efficient three-dimensional Monte Carlo ion implantation model based on a modified Binary Collision Approximation(BCA). To this purpose, the modified electronic stopping model and the multi-body collision model have been taken into account in this simulator. The dopant and damage profiles show very good agreement with SIMS(Secondary Ion Mass Spectroscopy) data and RBS(Rutherford Backscattering Spectroscopy) data, respectively. Moreover, the ion distribution replica method has been implemented into the model to get a computational efficiency in a 3D simulation, and we have calculated the 3D Monte Carlo simulation into the topographically complex structure.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.49 no.1
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• pp.80-87
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• 2012

We have developed the ATE(Automatic Test Equipment) system for the performance test of pre-amplifier of thermal imaging devices. The device regenerates the electronic signals of photon detection module which is normally in weak energy, for the image signals processing. Previous ATE system was primarily and actively developed in the field of semiconductor devices quality parts inspection. Recently, it has been studied in the field of performance testing of equipment. In the field of thermal performance test equipment, however, it lacks the study of ATE compared to other areas, which causes the maintenance related to the core of military thermal imaging system maintenance to be limited. In this paper, a new study of ATE in the field of thermal imaging system is done. It is designed to be used universally for the ATE system with different types of circuit card of thermal imaging system by adopting matrix relays. Using the developed ATE measuring the pre-amplifier amplitude, an average amplified amplitude of 2.71Vpp was measured which confirms that it is within the range of theoretical analysis and also verifies the good performance of the developed ATE.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.2
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• pp.220-227
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• 2011

With the rapid development of mobile communication technology, the technologies based on the diverse digital modulation schemes have been used for the frequency range of over 800 MHz. The only radiation immunity has been tested using only AM signal based on IEC 61000-4-3 without any consideration of the influence of electromagnetic radiation in Korea. However, it has not been tested by wideband digital modulation signals such as cdmaone(IS-95), WCDMA and PM signal. The purpose of this study was to review the standards. In addition, the input signals were analyzed and tested considering the environments in Korea. The results showed that the devices were influenced by digital modulation signal or PM signal more than by AM signal.

• Korean Chemical Engineering Research
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• v.55 no.2
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• pp.253-257
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• 2017

Graphene is a monolayer carbon material which consists of $sp^2$ bonding between carbon atoms. Its excellent intrinsic properties allow graphene to be used in various research fields. Many researchers believe that graphene is suitable for electronic device materials due to its high electrical conductivity and carrier mobility. Through chemical doping, n- or p-type graphene can be obtained, and consequently graphene-based devices which have more comparable structure to common semiconductor-based devices can be fabricated. In our research, we introduced the dielectrophoresis process to the chemical doping step in order to improve the effect of chemical doping of graphene selectively. Under 10 kHz and $5V_{pp}$ (peak-to-peak voltage), doping was conducted and the Au nanoparticles were effectively formed, as well as aligned along the edges of graphene. Effects of the selective chemical doping on graphene were investigated through Raman spectroscopy and the change of its electrical properties were explored. We proposed the method to enhance the doping effect in local region of a graphene layer.

• Journal of IKEEE
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• v.21 no.3
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• pp.195-201
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• 2017

High-power wireless transmission system becomes a key technology for the advance of battery-powered devices. The wireless power transfer devices are currently dominated by the inductive and capacitive wireless power transfer systems, which have relatively low power transmission capacity and low efficiency rather than the wired power transmission. The work presented in this paper proposes an alternative method of high-power transmission system, based on a variable speed motor system with a magnetic coupling. It enables high-capacity power transmission, high efficiency, and low possibility of failures, and the performance of the proposed scheme is verified by simulation and experiments.

• Journal of Digital Contents Society
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• v.8 no.4
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• pp.491-497
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• 2007

RPersonal area networking technology is becoming increasingly important in enabling useful wireless home applications. For example, Bluetooth and IEEE 802.11b standards are the most commonly deployed technologies for wireless home applications. However, because both standards share the same unlicensed ISM (Industrial, Scientific, Medical) radio spectrum, severe interference is inevitable and performance can be impaired significantly when heterogeneous devices using the two technologies come into close proximity. In this paper, we research Gaussian FSK Bluetooth system, which is an open specification technology for short-range wireless connectivity between electronic devices. In this paper, we analyzes the effects of co-channel interference on the performance of a Gaussian FSK Bluetooth system. Performance criteria used in the study are the signal to interference power ratio (SIR), interference index, and the bit error rate (BER) in the wireless channel. The effect of co-channel interference from various sources on the performance of a Gaussian FSK Bluetooth system is analyzed using an IGA(Impulsive Gaussian Approximation) method, and these quantities are plotted against Eb/No, $\rho$ and SIR for various channel conditions in figures.

• Journal of the Korean Magnetics Society
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• v.8 no.4
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• pp.241-248
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• 1998

In accordance with tendency to miniaturization and high frequency operation of electronic products, extensive efforts of miniaturizing magnetic devices such as inductors, transformers and magnetic sensors are being made. In order to study on fabrication and characteristic of micro-magnetic devices, we carried out two sets of experiments. One is to develop a magnetic film that is suitable for high frequency operation, and the other is to develop the fabrication processes for realizing the micro-coil with meander shape. Magnetic films were composed of FeTa(N,C) fabricated by DC magnetron sputtering system. Their microstructures were nanocrystalline structure and magnetic properties showed Bs:13~17 kG, Hc:0.1~0.2 Oe and $\mu$':2000~4000. Cu coil pattern fabricated by selective electroplating process showed good electrical conductivity. In the case of air core inductors, inductance (L) of 50 nH, resonance frequency $(f_R)$ of 700 MHz, and quality factor (Q) of 30 at 200 MHz could be obtained. In the case of close type magnetic inductors, inductance (L) of 150 nH, resonance frequency $(f_R)$ of 100 MHz, and quality factor (Q) of 4 at 10~30 MHz could be obtained.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.33 no.12C
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• pp.1014-1020
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• 2008

Storage devices such as memories are widely used in various electronic products. They require high-density memory and currently the data has been stored in multi-level format, that results in high error rate. In this paper, we apply error correction schemes that are widely used in communication system to the storage devices for satisfying low bit error rate and high code rate. In A WGN channel with average BER $10^{-5}$ and $5{\times}10^{-6}$, we study error correction schemes for 4-1evel cell to achieve target code rate 0.99 and target BER $10^{-11}$ and $10^{-13}$, respectively. Since block codes may perform better than the concatenated codes for high code rate, and it is important to use less degraded inner code even when many bits are punctured. The performance of concatenated codes using general feedforward systematic convolutional codes are worse than the block code only scheme. The simulation results show that RSC codes must be used as inner codes to achieve good performance of punctured convolutional codes for high code rate.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.1-6
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• 2016

The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.