• 설비공학논문집
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• 제22권9호
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• pp.614-619
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• 2010

Recently, a problem related to the thermal management in portable electronic and telecommunication devices is becoming issued. That is due to the trend of a slimness of the devices, so it is not easy to find the optimal thermal management solution for the devices. From now on, a pressed circular type cooling device has been mainly used, however the cooling device with thin thickness is becoming needed by the inner space constraint of the applications. In the present study, the silicon flat plate type cooling device with the separated vapor and liquid flow path was designed and fabricated. The normal isothermal characteristics created by vapor-liquid phase change was confirmed through the experimental study. The cooling device with 70 mm of total length showed 6.8 W of the heat transfer rate within the range of $4{\sim}5^{\circ}C/W$ of thermal resistance. In the future, it will be possible to develop the commercialized cooling device by revising the fabrication process and enhancing the thermal performance of the silicon and glass cooling device.

• 한국지능시스템학회논문지
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• 제25권2호
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• pp.147-154
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• 2015

본 논문에서는 승강기용 냉각장치의 에너지 절감을 위한 사람 검출과 퍼지 온도 제어 시스템을 제안한다. 기존의 냉매를 사용하는 냉각장치의 문제점들을 개선하기 위해 사람 검출과 퍼지 온도 제어 시스템으로 열전냉각장치를 구동시켜 에너지 절감을 하고 자동적으로 효율적인 온도 관리를 한다. 제안된 시스템은 사람 검출을 통해 승강기 탑승 인원수를 확인하고 나서 퍼지 시스템에서 탑승 인원수와 계절 평균 기온을 기반으로 온도 제어를 한다. 사람 검출 방법은 승강기에서 조감도 카메라를 기반으로 사람의 머리 부분을 특징으로 사용하여 탑승 인원수를 검지한다. 퍼지 시스템은 look-up table 방법으로서 검지된 인원수와 기온을 고려하여 승강기의 내부 온도를 결정한다. 제안된 시스템은 사람 검출과 온도 제어를 통해 냉각장치의 에너지를 절감시킨다. 실험을 통해 에너지 절감을 확인하고 제안된 시스템의 성능을 검증한다.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2005년도 동계학술발표대회 논문집
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• pp.329-334
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• 2005

As more high power wide band gap devices are being utilized. the thermal management issues associated with these devices need to be resolved. High power small devices dissipate excessive heat that must be cooled, but traditional cooling methods are insufficient to provide such a cooling means. This paper will evaluate a micro-capillary pumped loop thermal management system that is incorporated into the shim of the device, taking advantage of phase-change to increase the thermal conductivity of the system. The results of the modeling of the thermal management system will be discussed.

• 한국산업융합학회 논문집
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• 제20권4호
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• pp.325-332
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• 2017

The engine cooling system is a device that maintains the temperature in the engine room at an appropriate level by driving a cooling fan when the temperature in the engine room generated during the vehicle operation occurs over a certain temperature. In recent years, the vehicle cooling system has changed to an electronic system. Therefore, in this paper, we design and develop a hall sensor based electronic engine cooling system. In this paper, a hall sensor module and an actuator module for engine cooling control system are designed. In order to verify the performance of the designed module, the magnetic field control was verified through the simulation of the diameter and the head of the coil.

• 유체기계공업학회:학술대회논문집
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• 유체기계공업학회 2006년 제4회 한국유체공학학술대회 논문집
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• pp.483-486
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• 2006

The fan is widely used to cool high heat flux generated as of the electronic communication device consoles. It, however, makes a lot of noises that interfere considerably with the operation environment. This study was conducted to obtain the cooling design technology of the consoles through being equipped with the Heat Pipe Heat Exchangers (HPHE) together with low revolution fans in place of existing fans for the cooling technology of the forced convection. Not only the sealed type consoles but the HPHE were also designed so as to cool effectively the heat generated from the inside of the console. The simulation was conducted by computational numerical analysis along with its experiments. The results of the numerical analysis and experiments were compared in order to improve the cooling technology of the consoles mounted with the HPHE. Consequently, instead of loud fan noise generated as of existing forced convection methods, the cooling technology of HPHE can remarkably improve many problems such as the operation environment, indoor dust, malfunction caused by pollution sources and so on.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.16.2-16.2
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• 2005

• 대한기계학회:학술대회논문집
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• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
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• pp.4.2-4.2
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• 2005

• 한국산업융합학회 논문집
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• 제21권5호
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• pp.241-246
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• 2018

The engine cooling system is a device that keeps the temperature of the engine room at a proper level by driving the cooling fan when the engine room temperature that occurs during driving is above a certain temperature. Recently, the vehicle cooling system has been changed to electronic system. Therefore, in this paper, we will analyze the clutch operation characteristics for designing a superior electronic fan clutch. For this purpose, an electronic fan clutch was designed and a test bed for performance evaluation was constructed and analyzed.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2002년도 학술대회지
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• pp.725-728
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• 2002

A separate type thermosyphon can be utilized as a cooling device of electronic equipments (such as CPU of a personal computer or notebook). This study was carried out to investigate the cooling effect of separate type thermosyphon and to find the adequate parameters affecting the separate type thermosyphon. The heat transfer characteristics of separate type thermosyphon were obtained from experimental results. A $50{\times}50{\times}2 mm$ heat source was copied after CPU for the experiments. The results indicate that the device is capable of dissipating 60W of thermal energy and keeping the heat plate surface temperature under 50'E and the device can transfer heat from the evaporator to the condenser through natural circulation (without any external driving forces). Some transport phenomena of the working fluid and the heat transfer characteristics of the loop were observed in the experiments and are discussed in detail below.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.110-114
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• 2020

In this paper, a heat pump using a Peltier device was developed for heat dissipation in a sealed electric box. The heat pump was designed with a cooling fin attached to both sides of the Peltier device, and a fan was mounted on the cooling fin on the hot side to increase the efficiency. The heat dissipation efficiency could be improved by directly connecting the electronic component having high heat to the cooling fin using a heat conducting wire. The fabricated heat pump was designed to operate only in the temperature range set by the temperature control system to improve the problem of high power consumption of the Peltier element.