• 대한기계학회논문집B
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• 제25권6호
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.259-260
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• 2006

This study was progressed to value of Bi2212 tubes uniformity depend on cooling conditions. The tube from 150 mm in length, 30 mm in O.D., 20 mm in I.D., 5 mm in thickness was combined with electrodes by 3 sections. The tube from 60, 70 mm in length, 30, 50 mm in O.D., 20.4, 40.4 mm in I.D., 4.8 mm in thickness was in controled of cooling rate by a heat exchanger. Bi2212 tubes were fabricated by Centrifugal Forming Process (CFP) and they were annealed at $840^{\circ}C$ for 80 h in oxygen atmosphere. The tube from 150 mm in length was analyzed by EFDLab of NIKA to show cooling rate and temperature distributions. When the tube was cooled for 100s, the temperature distributions was $663^{\circ}C$ in the middle, $500{\sim}647^{\circ}C$ in inlet, $598{\sim}647^{\circ}C$ in the other side. Electric characteristics from $I_c$ was 450 A in the middle, 650 A in inlet, 600 A in the other side. Electric characteristics by a heat exchanger showed the more fast cooling rate, the more high $I_c$.

• 대한기계학회논문집B
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• 제32권6호
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• pp.454-462
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• 2008

Since operating conditions are significantly different for heating and cooling mode operations in a $CO_2$ heat pump system, it is difficult to optimize the performance of the $CO_2$ cycle. In addition, the performance of a $CO_2$ heat pump is very sensitive to outdoor temperature and gascooler pressure. In this study, the cooling and heating performances of a variable speed $CO_2$ heat pump with a twin-rotary compressor were measured and analyzed with the variations of EEV opening and compressor frequency. As a result, the cooling and heating COPs were 2.3 and 3.0, respectively, when the EEV opening was 22%. When the optimal EEV openings for heating and cooling were 28% and 16%, the cooling and heating COPs increased by 3.3% and 3.9%, respectively, over the COPs at the EEV opening of 22%. Beside, the heating performance was more sensitive to EEV opening than the cooling performance. As the compressor speed decreased by 5 Hz, the cooling COP increased by 2%, while the heating COP decreased by 8%.

• Journal of Electrical Engineering and Technology
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• 제9권3호
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• pp.893-898
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• 2014

Recently, the interior permanent synchronous motor (IPMSM) has been applied to an integrated starter and generator (ISG) for hybrid electric vehicles. In the design of such a motor, thermal analysis is necessary to maximize the power density because the loss is proportional to the power of a motor. Therefore, a cooling device as a heat sink is required internally. Generally, a cooling system designed with a water jacket structure is widely used for electric motors because it has advantages of simple structure and cooling effectiveness. An effective approach to analyze an electric machine with a water jacket is a thermal equivalent network. This network is composed of thermal resistance, a heat source, and thermal capacitance that consider the conduction, convection, and radiation. In particular, modeling of the cooling channel in a network is challenging owing to the flow of the coolant. In this paper, temperature prediction using a thermal equivalent network is performed in an ISG that has a water cooled system. Then, an experiment is conducted to verify the thermal equivalent network.

• 한국전자통신학회논문지
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• 제14권2호
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• pp.361-368
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• 2019

본 논문은 전기차 기반의 1톤급 상용차용 통합공조 시스템에 관한 연구이다. 전기 상용차의 경우 화물의 승하차를 위해 문의 개폐가 빈번하게 이루어지기 때문에 열손실이 크게 발생한다. 따라서 냉난방 부하가 승용 전기차에 비해 더 크게 요구된다. 결과적으로 승객이 요구하는 열 쾌적성을 만족하기 위해서 냉난방 시스템이 소비하는 에너지가 승용 전기차 보다 크다. 이러한 단점을 극복하기 위해 효율적인 통합공조 시스템을 적용한 연구를 수행했다. 최종적으로 1톤급의 경상용 전기트럭의 상품성 개선과 전기트럭 분야의 산업 생태계 기반 확충을 위한 고효율 공조 시스템 개발을 위해 냉방을 위한 전동식 압축기와 난방을 위한 히트펌프 시스템의 구상 설계와 해석적 검증을 수행한다.

• 설비공학논문집
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• 제18권6호
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• pp.459-467
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• 2006

Rapid development of electronic technology requires small size, high density packaging and high power in the electronic devices, which results in more heat generation. Suitable heat dissipation is required to ensure the guaranteed performance and reliable operation of the current state-of-the-art electronic equipment. The aim of the present study is to find out the forced-convective thermal-hydraulic characteristics of a pin-fin heat exchanger as a candidate for cooling system of the electronic devices through the analysis and experiment. Various configuration of the pin-fin array is selected in order to find out the effect of spacing and diameter of the pin-fin on the heat transfer and pressure drop characteristics. Experimental results are compared with the analyses and correlations of several researchers. Finally, the design guide are provided for the required pressure drop and/or the heat transfer characteristics of the heat exchanger.

• 한국신뢰성학회지:신뢰성응용연구
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• 제9권2호
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• pp.149-163
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• 2009

This paper intends to suggest a design to reduce the thermal load of a hand-carried ultrasound (HCU) system, with the aim of increasing the product life. To design ways to reduce the heat load, the surface temperatures of key parts of an HCU system were measured as the 4 system cooling fans, which have a direct relation to the system life, were operated normally. When the derating rate of 80% was applied while the fans of the HCU system were operated abnormally, it was observed that the key image processing parts exceeded the surface temperature (TC) with consideration to derating. Since the part surface temperature did not exceed the derated level when the regulated voltage was derated from 12V to 9V, it is expected to lower the operating voltage of the fans to 9V to increase the fan and HCU system lifetime by 1.8 times.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2408-2413
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• 2007

Since the heat generation in a chip increases as the components are miniaturized and the computing speed becomes faster, suitable heat dissipation has become one of the primary limiting factors to ensure the reliable operation of the electronic devices. A pin-fin array could be used as an alterative cooling system of the electronic equipment. In this study, convective heat transfer through the pin-fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristics is investigated and compared with the previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.

• 한국전자통신학회논문지
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• 제15권2호
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• pp.253-258
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• 2020

우리나라의 석유화학산업단지는 폭발성 가스와 가연성 가스로 인하여 언제나 폭발 위험성이 높다. 이러한 폭발을 방지하기 위한 방법으로 석유화학산업단지의 대부분 설비에 방폭 성능을 요구하고 있다. 방폭용으로 현재 사용하고 있는 제어기 패널은 패널의 내부와 외부의 압력(양압)과 온도를 일정하게 유지를 위해 외부에서 수동으로 공기를 주입하는 방식을 사용하고 있다. 이에 본 논문은 자동으로 온도를 제어할 수 있도록 패널 내부의 온도에 따라 가열과 냉각을 자동으로 수행하는 자동 온도조절기를 제안한다.

• 설비공학논문집
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• 제19권5호
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• pp.418-425
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• 2007

The power consumption and heat generation in a chip increase as the components are miniaturized and the computing speed becomes faster. Therefore, suitable heat dissipation has become one of the primary limiting factors to ensure the guaranteed performance and reliable operation of the electronic devices. A pin-fin array which may be considered as a porous medium could be used as an alterative cooling system of the electronic equipment. The aim of the present study is to investigate the forced-convective heat transfer characteristics of pin-fin heat exchangers. Convective heat transfer through the pin~fin array is analyzed experimentally based on porous medium approach. The influence of the structure of the pin-fin array including the pin-fin spacing, the pin diameter and plate length on heat transfer characteristic is investigated and compared with the Previous analytical results and existing correlation equations. Nowadays, electronic and mechanical devices become smaller and smaller. In this sense, the main purpose of this study is to decide the optimum pin-fin arrangement to get similar heat transfer performance when the length of the existing cooling system is reduced as a half.