• Title/Summary/Keyword: Electronic components

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Research and Analysis of Difference Hybrid DC Circuit Breaker Topologies for MVDC Distribution System (MVDC 배전시스템에서 다양한 복합형 직류 차단기의 토폴로지 연구 및 분석)

  • Go, Yu-Ran;Min, Myung-Hwan;An, Tae-Pung
    • The Transactions of the Korean Institute of Power Electronics
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    • v.25 no.6
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    • pp.503-510
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    • 2020
  • The importance of DC breakers as key protection equipment is increasing in accordance with growing concerns on MVDC distribution network systems without DC/AC conversion. Different from the situation in AC systems, no natural zero-crossing point exists in DC systems. Thus, DC breaker technology is more difficult than AC breaker technology. The solutions for DC breakers can be divided into three types: mechanical, power electronics, and hybrid. In this study, the operating principles of several topologies of hybrid circuit breakers and that of the proposed DC breaker are analyzed and simulated by sorting two types. The breakers are compared in terms of the type and number of semiconductors, volume, power loss, auxiliary components, isolation, and other aspects. The advantages and disadvantages of the breakers are also analyzed.

The Effect of Magnetic Field Direction on the Imaging Quality of Scanning Electron Microscope

  • Ai, Libo;Bao, Shengxiang;Hu, Yongda;Wang, Xueke;Luo, Chuan
    • Journal of Magnetics
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    • v.22 no.1
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    • pp.49-54
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    • 2017
  • The significant reduction of the image quality caused by the magnetic field of samples is a major problem affecting the application of SEM (scanning electron microscopy) in the analysis of electronic devices. The main reason for this is that the electron trajectory is deflected by the Lorentz force. The usual solution to this problem is degaussing the sample at high temperatures. However, due to the poor heat resistance of some electronic components, it is imperative to find a method that can reduce the impact of magnetic field on the image quality and is straightforward and easy to operate without destroying the sample. In this paper, the influence of different magnetic field directions on the imaging quality was discussed by combining the experiment and software simulation. The principle of the method was studied, and the best observation direction was obtained.

Review of Failure Mechanisms on the Semiconductor Devices under Electromagnetic Pulses (고출력전자기파에 의한 반도체부품의 고장메커니즘 고찰)

  • Kim, Dongshin;Koo, Yong-Sung;Kim, Ju-Hee;Kang, Soyeon;Oh, Wonwook;Chan, Sung-Il
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.18 no.6
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    • pp.37-43
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    • 2017
  • This review investigates the basic principle of physical interactions and failure mechanisms introduced in the materials and inner parts of semiconducting components under electromagnetic pulses (EMPs). The transfer process of EMPs at the semiconducting component level can be explained based on three layer structures (air, dielectric, and conductor layers). The theoretically absorbed energy can be predicted by the complex reflection coefficient. The main failure mechanisms of semiconductor components are also described based on the Joule heating energy generated by the coupling between materials and the applied EMPs. Breakdown of the P-N junction, burnout of the circuit pattern in the semiconductor chip, and damage to connecting wires between the lead frame and semiconducting chips can result from dielectric heating and eddy current loss due to electric and magnetic fields. To summarize, the EMPs transferred to the semiconductor components interact with the chip material in a semiconductor, and dipolar polarization and ionic conduction happen at the same time. Destruction of the P-N junction can result from excessive reverse voltage. Further EMP research at the semiconducting component level is needed to improve the reliability and susceptibility of electric and electronic systems.

Performance Analysis of a Novel Reduced Switch Cascaded Multilevel Inverter

  • Nagarajan, R.;Saravanan, M.
    • Journal of Power Electronics
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    • v.14 no.1
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    • pp.48-60
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    • 2014
  • Multilevel inverters have been widely used for high-voltage and high-power applications. Their performance is greatly superior to that of conventional two-level inverters due to their reduced total harmonic distortion (THD), lower switch ratings, lower electromagnetic interference, and higher dc link voltages. However, they have some disadvantages such as an increased number of components, a complex pulse width modulation control method, and a voltage-balancing problem. In this paper, a novel nine-level reduced switch cascaded multilevel inverter based on a multilevel DC link (MLDCL) inverter topology with reduced switching components is proposed to improve the multilevel inverter performance by compensating the above mentioned disadvantages. This topology requires fewer components when compared to diode clamped, flying capacitor and cascaded inverters and it requires fewer carrier signals and gate drives. Therefore, the overall cost and circuit complexity are greatly reduced. This paper presents modulation methods by a novel reference and multicarrier based PWM schemes for reduced switch cascaded multilevel inverters (RSCMLI). It also compares the performance of the proposed scheme with that of conventional cascaded multilevel inverters (CCMLI). Simulation results from MATLAB/SIMULINK are presented to verify the performance of the nine-level RSCMLI. Finally, a prototype of the nine-level RSCMLI topology is built and tested to show the performance of the inverter through experimental results.

Utilization of Phase Information for Speech Recognition (음성 인식에서 위상 정보의 활용)

  • Lee, Chang-Young
    • The Journal of the Korea institute of electronic communication sciences
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    • v.10 no.9
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    • pp.993-1000
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    • 2015
  • Mel-Frequency Cepstral Coefficients(: MFCC) is one of the noble feature vectors for speech signal processing. An evident drawback in MFCC is that the phase information is lost by taking the magnitude of the Fourier transform. In this paper, we consider a method of utilizing the phase information by treating the magnitudes of real and imaginary components of FFT separately. By applying this method to speech recognition with FVQ/HMM, the speech recognition error rate is found to decrease compared to the conventional MFCC. By numerical analysis, we show also that the optimal value of MFCC components is 12 which come from 6 real and imaginary components of FFT each.

Life Prediction of Automotive Vehicle's W/H System Using Finite Element Analysis (차량용 와이어하네스의 유한요소해석을 이용한 대변형 내구수명 예측)

  • Kim, Byeong-Sam;Kang, Ki-Jun;Park, Kyoung-Woo;Noh, Kwang-Doo
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.1
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    • pp.139-144
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    • 2010
  • In the automotive electronic industry, the development of vehicle's door wiring harness (W/H) system for new applications is driven continuously for the low-cost and the high strength performance for electronic components. The problem of the fatigue strength estimation for materials and components containing natural defects, inclusions, or inhomogeneities is of great importance both scientifically and industrially. This article gives some insight into the dimensioning process with special focus on the fatigue analysis of wiring harness (W/H) in vehicle's door structures. The results from endurance tests using slim test specimens were compared with the results from FEM for predicted fatigue life. The expectation for the life of components is affected by the microstructural features with complex stress state arising from the combined service loading and residual stresses.

Development of Optimum Shape Forming Technology of Angle Ring and Cap for 154 kV Transformer Insulation (154 kV급 변압기 절연물 앵글링과 캡의 최적성형 기술 개발)

  • Suh, Wang-Byuck;Kim, Jong-Won;Ryu, Jung-Soo;Bae, Dong-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.11
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    • pp.880-885
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    • 2010
  • The Angle Ring and Cap which is called pressboard are settled at the primary and secondary coil winding of 154 kV transformer that can reduce effectively distance of insulation. As it has not manufactured pressboard of Angle Ring and Cap for high voltage grade, insulation components industry especially high voltage transformer has not participate in a competition with worldwide yet. That's why is difficult to make an specialized shape of insulation components of high voltage grade. Therefore it has finally completed to make an deformation manufacturing utility using an bellowed special analysis tools. This study that uses various analysis program determining optimum shape about insulation of Angle Ring and Cap which is related life of high voltage transformer. In addition to develop forming equipment with an specialized five steps pressing. That is also based on the mechanical strength evaluation and test, it is investigated optimized processing components.

The system performance analysis and implementation of Digital Communication Satellite (디지털위성중계기 시스템 성능 분석 및 구현)

  • Kim, Ki-Jung;Seo, Hak Geum
    • The Journal of the Korea institute of electronic communication sciences
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    • v.9 no.4
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    • pp.439-446
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    • 2014
  • This study introduces about the analysis, verification and implementation of Digital Communication Satellite transponder. Through the pre-performance analysis of each component by the circuit level simulation, each component's performance was checked whether satisfying the specifications. When each of the components was connected in order, System's performances were evaluated through system harmonic balanced simulation whether satisfying the specifications. Through pre-analysis of the system performance, specification of each component was defined. On the basis of that specification, Components which comprise the Digital Communication Satellite repeater were manufactured, and finally, the overall system performance check was made by integrating the components of Digital Communication Satellite transponder.

Characterization of Conducting Polymer/CdTe Nanoparticles/Carbon Nanotube Composites in Thin Films (전도성 고분자/CdTe 나노입자/탄소 나노튜브 복합박막의 특성 연구)

  • Kim, Do-Hoon;Shim, Seong Eun;Kim, Jungsoo;Nam, Dae-Geun;Oh, Weontea
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.4
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    • pp.315-320
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    • 2013
  • The composites composed of conducting polymer (MEH-PPV), CdTe nanoparticles, and multiwalled carbon nanotubes (MWNTs) were spectroscopically and electrically characterized in their thin films. The composite films were prepared by spray coating. These composites were prepared from the mixture solution of MEH-PPV and CdTe-embedded MWNTs, in which CdTe nanoparticles were electrostatically bound to MWNTs. UV/vis and PL spectra were analyzed to investigate the optical absorbance and emission of the composite films. In addition, their structural, electrochemical, and electrical properties were studied by transmission electron microscopy, cyclic voltammetry, and I-V measurement.

Design and Implementation of a CAN Data Analysis Test Bench based on Raspberry Pi

  • Pant, Sudarshan;Lee, Sangdon
    • Journal of Multimedia Information System
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    • v.6 no.4
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    • pp.239-244
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    • 2019
  • With the development of Cyber-Physical Systems(CPS), several technologies such as automation control, automotive and intelligent house systems have been developed. To enable communication among various components of such systems, several wired and wireless communication protocols are used. The Controller Area Network(CAN) is one of such wired communication protocols that is popularly used for communication in automobiles and other machinery in the industry. In this paper, we designed and implemented a response time analysis system for CAN communication. The reliable data transfer among various electronic components in a significant time is crucial for the smooth operation of an electric vehicle. Therefore, this system is designed to conveniently analyze the response time of various electronic components of a CAN enabled system. The priority for transmission of the messages in the CAN bus is determined by the message identifier. As the number of nodes increases the transmission of low priority messages is delayed due to the existence of higher priority messages on the bus. We used Raspberry Pi3 and PiCAN2 board to simulate the data transfer for studying the comparative delay in low priority nodes.