• Journal of Mechanical Science and Technology
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• v.14 no.2
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• pp.251-258
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• 2000

Thermal deformation in an electronic package due to thermal strain mismatch is investigated. The warpage and the in-plane deformation of the package after encapsulation is analyzed using the laminated plate theory. An exact solution for the thermal deformation of an electronic package with circular shape is derived. Theoretical results are presented on the effects of the layer geometries and material properties on the thermal deformation. Several applications of the exact solution to electronic packaging product development are illustrated. The applications include lead on chip package, encapsulated chip on board and chip on substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.03b
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• pp.31-31
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• 2010

Nano particles (10nm $SiO_2$) were silane-treated in order to modify the surface characteristics in a epoxy nanocomposite. Then, micro particles ($3{\mu}m$ SiO2) were poured into the epoxy nanocomposite using various mixing process and epoxy/micro-and-nanomixed composites (EMNC) were prepared. The thermal (Tg) and mechanical (tensile and flexural strength) properties were measured by DSC, DMA and UTM and the data was estimated by Weibull plot.

• Transactions on Electrical and Electronic Materials
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• v.13 no.3
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• pp.153-156
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• 2012

In order to develop electrical insulation materials, epoxy/micro-silica composite (EMC) and epoxy/micro-silica/nano-silicate composite (EMNC) were prepared, and their tensile and flexural strength, AC insulation breakdown strength and thermal conductivity and thermal expansion coefficient were compared. Nano-silicate was prepared in an epoxy matrix by our AC electric field process. All properties of the neat epoxy were improved by the addition of micro-silica, which was improved much further by the addition of nano-silicate to the EMC system.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.04a
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• pp.190-194
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• 2000

The fabrication process and thermal properties of 50∼76vo1% SiCp/Al metal matrix composites (MMCs) were investigated. The 50∼76vo1% SiCp/Al MMCs fabricated by pressure infiltration casting process showed that thermal conductivities were 85∼170W/mK and coefficient of thermal expansion (CTE) were ranged 10∼6ppm/K. Specially, the thermal conductivity and CTE of 71vo1%SiCp/Al MMCs were ranged l15∼156W/mK and 6∼7ppm/K, respectively, which showed a improved thermal properties than the conventional electronic packaging materials such as ceramics and metals.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.11
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• pp.693-698
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• 2017

In this study, the thermal degradation properties of polyethylene terephthalate film has been examined by the capacitance, Tan ${\delta}$, thermography, FTIR, and SEM results at temperatures of $90{\sim}170^{\circ}C$ and frequencies of 0.3~3,000 kHz. It was found that the capacitance decreased with increasing thermal imaging temperature, probably caused by weakening of chemical bond with increasing temperature. Tan ${\delta}$ decreased upon increasing temperature from $90^{\circ}C$ to $170^{\circ}C$, probably due to the molecular motion of COOH radical or OH radical. The FT-IR measurement reveals that no structural change of the material occurs upon thermal radiation. The SEM measurement shows that the material is stabilized by thermal decomposition with increasing temperature; however, excessive thermal degradation obstructs the stabilization of the material.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1410-1411
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• 2011

Tip-type carbon nanotube(CNT) based electron emitters were fabricated by forming a hafnium(Hf) interlayer between the CNT and the substrate. The CNTs were deposited by using the electrophoretic deposition method and thermally treated. No significant change in the microscopic structure of the CNTs, such as the ratio of length to diameter, was observed after the deposition of Hf interlayer and thermal treatment. As compared with the CNT emitter without the Hf-interlayer and thermal treatment, the CNT emitter with the Hf-interlayer and thermal treatment showed noticeably improved electron-emission properties due to the enhanced adhesion.

• Journal of international Conference on Electrical Machines and Systems
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• v.2 no.4
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• pp.441-446
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• 2013

A thermal model of power modules based on the physical dimension and thermal properties is proposed in this paper. The heat path in the power module is considered as a one-dimensional heat transfer in the model. The method of the parameters extraction for the model is given in the paper. With high speed and accuracy, the thermal model is suit for electrothermal simulation. The proposed model is verified by experimental results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.8
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• pp.893-897
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• 2004

In this paper, we studied the mechanical and thermal properties on slice XLPE sheet from 22 kV and 154 kV power cables. Interface structures are XLPE/semiconductor and XLPE/water/semiconductor. We evaluated mechanical property, thermal analysis, moisture analysis. Based on mechanical and thermal properties of the 22 kV XLPE sheet, elongation, mechanical strength, and melting point were evaluated to be 485.48 %, 1.74 kgf/$\textrm{mm}^2$ and $102.48^{\circ}C$, respectively. It was also evaluated from the mechanical and thermal properties of 154 kV XLPE sheet that elongation, mechanical strength, and melting point are 507.81 %, 1.8 kgf/$\textrm{mm}^2$, $106.9^{\circ}C$, respectively. A region shows a rapid increase in tension strength, and B region only shows increase in elongation under 1.0 kgf/$\textrm{mm}^2$, C region shows increase in both elongation and tension strength. Difference of melting point came from the chain of XLPE polymer and the difference of crystallization. Moisture density of semiconductor showed 800 ∼ 1200 ppm before extrude, 14000 ∼24000 ppm after extrude. These values were higher than the moisture density of XLPE (300∼560) ppm.

• Journal of Photoscience
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• v.8 no.3_4
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• pp.113-117
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• 2001

Several styrylquinolium salts were synthesized to investigate their absorption and thermal properties, which had five different p-aminobenzene units and three different counter ions (iodide, perchlorate, and hexafluorophosphorate anion), respectively. Hydroxy, methoxy, and methyl group in the meta position to the amino group led to bathochromic shift, while Ν-ethyl-Ν-chloroethylamino unit instead of Ν,Ν-diethylamino unit resulted in hypsochromic shift. A dye having a methoxy group in the meta position to the amino group had the highest molar extinction coefficient ($\xi$), while a dye carrying chloro group in Ν-alkyl chains had the lowest $\xi$. The type of counter ions had no effect on spectral properties like the maximum absorption wavelength and $\xi$. All styryl dyes had exothermic peaks at decomposition in DSC curves. Among these styryl dyes, S2 series with perchlorate anions showed the strongest exothermic decomposition. From TGA spectra, S3 series with hexafluorophosphorate anions had the best thermal stability and the sharpest threshold at thermal decomposition.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.12
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• pp.1062-1067
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• 2007

In this paper, we have investigated thermal properties of semiconductive shield materials for power cables. EEA (Ethylene Ethyl Acrylate) was used for base polymer and TGA (Thermal Gravimetric Analysis) and AFM (Atomic Force Microscope) were investigated with various carbon black and CNT (carbon nanotube) contents. When CNT reinforced composites and conventional composite were investigated with TGA, we knew that thermal properties of CNT reinforced composite were better than them of conventional composite. To investigate roughness, we used AFM. Before and after aging, AFM was applied and after aging, roughness was increased. As a result, suitable CNT and CB(carbon black) content is CNT:CB=50:50.