• 한국정밀공학회지
• /
• 제15권12호
• /
• pp.113-119
• /
• 1998

Recently Electronic Speckle Pattern Interferometry(ESPI) has been studied because it has the advantages to be able to measure the whole-field surface deformations of engineering components and materials in industrial areas with noncontact. The speckle patterns to be formed with interference phenomena of scattering light from rough surfaces illuminated by laser light have phase informations of surface deformations. In this study we used this interference phenomena and the phase shifting method to measure the inplane deformations, together with the use of digital image equipment to process the informations contained in the speckle pattern and to display consequent interferograms on TV monitor. FEA was performed before experiments and we obtained good agreement between the experimental results and FEA.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집A
• /
• pp.108-113
• /
• 2001

Recently, the mechanical structures applied to many industrial products, especially in electronic products, appear to be miniaturized and complicated. This trend makes it difficult to analyze the stress distribution of those mechanical structures and generates new challenges for precise measurement of strain. Therefore, generally most of those cases largely depend on the finite element analysis. But the development of optical metrology which has the capability of non-contact, full-field and precise measurement makes it possible to solve these measuring problems. Among the optical measurement techniques, the electronic speckle pattern interferometry (ESPI) has been developed and considered as one of the most useful tools for measuring displacement and deformation. But the shortage of recognition and difficulties of measurement have limited its industrial applications in spite of its excellent capabilities. Therefore in this study, in order to enhance the industrial application of ESPI, the measurement of in-plane displacement of mechanical structure with ESPI, which is applied to washing machine and cannot be measured by strain gauges, was performed. And the verification of validity of FEA results was also done.

• Journal of Mechanical Science and Technology
• /
• 제19권3호
• /
• pp.820-825
• /
• 2005

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

• 한국생산제조학회지
• /
• 제8권6호
• /
• pp.78-83
• /
• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interformetry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. However, the existing ESPI methods that are based on dual-exposure, real-time and time-average method have difficulties for accurate measurement of structure, due to irregular intensity and shake of phase. Therefore, phase shifting method has been proposed in order to solve this problem. About the method, the path of reference light in interferometry is shifted and added to least square fitting method to make the improvement in distinction and precision. This proposed method is applied to measure in -plane displacement that is compared with the previous method. Also, Used as specimen AS4/PE따 [30/=30/90]s was analyzed by ESPI based on real-time to determine the characteristics of vibration under no-load and tension. These results are quantitatively compared with those of FEM analysis inmode shapes.

• 한국자동차공학회논문집
• /
• 제1권2호
• /
• pp.125-133
• /
• 1993

Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

• 비파괴검사학회지
• /
• 제24권3호
• /
• pp.246-252
• /
• 2004

복합재료는 이방성의 특징으로 매우 복잡한 역학거동을 하며, 해석 및 신뢰성 검사에 많은 어려움이 있다. 특히, 기존의 비파괴검사기법으로 내부손상을 검출하는 것은 매우 어려운 실정이다. 이에 본 연구에서는 복합재구조물의 가장 취약한 분야인 충격에 의한 손상이 발생할 경우 효과적인 검출기법을 개발하고, 충격에 따른 내부결함의 정량평가에 ESPI를 활용하였다. 인공결함을 이용하여 ESPI기법의 신뢰성을 확보하고 실제 충격손상 시험편에 대해 적용하여 5%이내의 오차율로 결함을 정량평가하였다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2006년도 춘계학술대회 논문집
• /
• pp.259-260
• /
• 2006

The ESPI(Electronic Speckle Pattern Interferometry) is a real time, full-field, non-destructive optical measurement technique. In this study, ESPI is proposed for the purpose of vibration analysis for new material, composite material. Composite materials have various complicated characteristics according to the ply materials, ply orientations, ply stacking sequences and boundary conditions. Therefore, it is difficult to analysis composite materials. For efficient use of composite materials in engineering applications the dynamic behavior, that is, natural frequencies, nodal patterns should be informed. If use Time-Average ESPI, can analyze vibration characteristic of composite material by real time easily. This study manufactured laminated composite of symmetry, asymmetry two kinds that is consisted of CFRP(Carbon Fiber Reinforced Plastics) and shape of test piece is rectangular form.

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2005년도 창립60주년 기념 추계 학술대회
• /
• pp.136.1-136.1
• /
• 2005

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 1999년도 추계학술대회 논문집 - 한국공작기계학회
• /
• pp.69-73
• /
• 1999

This study discusses a non-contact optical technique, electronic speckle pattern interferometry(ESPI), that is well suited for in-plane and out-of-plane deformation measurement. AS4/PEEK[30/-30/90]s, composite laminate plate was analyzed by ESPI to determine the vibration characteristics with tensile loading and without it. vibration mode shapes are quantitatively compared with the result of numerical analysis. The experimental results agree well with those of numerical analysis. we found that when the composite laminate plate is under the tensile loading, vibration modes can be measured with high accuracy by ESPI.

• Journal of the Optical Society of Korea
• /
• 제17권1호
• /
• pp.50-56
• /
• 2013

Optical-fiber electronic speckle pattern interferometry (ESPI) is a non-contact, non-destructive examination technique with the advantages of rapid measurement, high accuracy, and full-field measurement. The optical-fiber ESPI system used in this study was compact and portable with the advantages of easy set-up and signal acquisition. By suitably configuring the optical-fiber ESPI system, producing an image signal in a charge-coupled device camera, and periodically modulating beam phases, we obtained phase information from the speckle pattern using a four-step phase shifting algorithm. Moreover, we compared the actual defect size with that of interference fringes which appeared on a screen after calculating the pixel value according to the distance between the object and the CCD camera. Conventional methods of measuring defects are time-consuming and resource-intensive because the estimated values are relative. However, our simple method could quantitatively estimate the defect length by carrying out numerical analysis for obtaining values on the X-axis in a line profile. The results showed reliable values for average error rates and a decrease in the error rate with increasing defect length or pressure.