• Journal of Photoscience
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• v.9 no.1
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• pp.23-28
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• 2002

In order to obtain thermal-stable, low birefringent, and low optical loss waveguiding materials, we synthesized several fluorinated poly (maleimide-co-glycidylmethacrylate)s using a pentafluorophenylmaleimide (PEM) and two kinds of methacrylate derivatives as comonomers and glycidylmethacrylate as a crosslinker. One comonomer is a linear fluorinated methacrylate (HFBM) and another is a bulky norbornane-derived methacrylate (NMMA). These copolymers could be self-crosslinked by heating due to epoxy groups of glycidylmethacrylates. As a maleimide contents increased to 50 mol%, these copolymers showed high decomposition temperatures of above 300$^{\circ}C$. The refractive index could be precisely controlled by the variation of PFM/HFBA or PFM/NMMA feed ratio in the range of 1.410∼1.508 at 643 nm. The copolymers had very low birefringence in the range of 1∼5${\times}$10$\^$-4/.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.814-819
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• 2000

The progress in the field of electronic materials has been especially significant for applications involving a range of electrical properties. Its importance is increasing with the increasing demand for integrated circuits. The sol-gel technique has been used for many years, and the metal alkoxides have featured prominently as source materials. The method consist of making a homogeneous solution of the component metal alkoxides in a suitable solvent, usually the parent alcohol; and then causing the hydrolysis under controlled conditions to produce a gel containing the hydrated metal oxide. The gel is then dried, and fired to produce a ceramic or glassy material at a temperature much lower than that required by the conventional melting process. This project consists of important theoretical considerations, processing techniques and applications related to electrophoresis derived thin films. In the electrophoretic process a metal alkoxide solution is gelled through hydrolysis-polymerization and converted the gel thin layer to an oxide by heating at relatively low temperatures.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.6
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• pp.37-43
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• 2017

This review investigates the basic principle of physical interactions and failure mechanisms introduced in the materials and inner parts of semiconducting components under electromagnetic pulses (EMPs). The transfer process of EMPs at the semiconducting component level can be explained based on three layer structures (air, dielectric, and conductor layers). The theoretically absorbed energy can be predicted by the complex reflection coefficient. The main failure mechanisms of semiconductor components are also described based on the Joule heating energy generated by the coupling between materials and the applied EMPs. Breakdown of the P-N junction, burnout of the circuit pattern in the semiconductor chip, and damage to connecting wires between the lead frame and semiconducting chips can result from dielectric heating and eddy current loss due to electric and magnetic fields. To summarize, the EMPs transferred to the semiconductor components interact with the chip material in a semiconductor, and dipolar polarization and ionic conduction happen at the same time. Destruction of the P-N junction can result from excessive reverse voltage. Further EMP research at the semiconducting component level is needed to improve the reliability and susceptibility of electric and electronic systems.

• 제어로봇시스템학회:학술대회논문집
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• 2004.08a
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• pp.1201-1204
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• 2004

This paper suggests a DCS (Distributed Control System) model for steam temperature system of the thermal power plant. The model calculated within sectional range is linear. In order to calculate mathematical models, the system is partitioned into two or three sectors according to its thermal conditions, that is, saturated water/steam and superheating state. It is divided into three sections; water supply, steam generation and steam heating loop. The steam heating loop is called 'superheater' or steam temperature system. Water spray supply is the control input. A first order linear model is extracted. For linear approach, sectional linearization is achieved. Modeling methodology is a decomposition-synthetic technique. Superheater is composed of several tube-blocks. For this block, linear input-output model is to be calculated. Each tiny model has its transfer function. By expanding these block models to total system, synthetic DCS linear models are derived. Control instrument include/exclude models are also considered. The resultant models include thermal combustion conditions, and applicable to practical plant engineering field.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.119-126
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• 2001

Chip-on-glass(COG) mounting of area array electronic packages was attempted by heating the rear surface of a contact pad film deposited on a glass substrate. The pads consisted of an adhesion(i.e. Cr or Ti) and a top coating layer(i.e. Ni or Cu) was heated by an UV laser beam transmitted through the glass substrate. The laser energy absorbed on the pad raised the temperature of a solder ball which is in physical contact with the pad, forming a reflowed solder bump. The effects of the adhesion and top coating layer on the laser reflow soldering were studied by measuring temperature profile of the ball during the laser heating process. The results were discussed based on the measurement of reflectivity of the adhesion layer. In addition, the microstructures of solder bumps and their mechanical properties were examined.

• Journal of the korean Society of Automotive Engineers
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• v.13 no.2
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• pp.88-102
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• 1991

In this study, thermophysical properties of the ceramic dielectrics such as BaOTiO$_{2}$, SrOTiO$_{2}$, MgOTiO$_{2}$, were measured by a single rectangular pulse heating method. The values of thermal diffusivities, specific heats, and thermal conductivities were measured as a function of temperature range from room temperature to 1300k. The measured thermal properties of one group of ceramic material were compared with those of other group and discussed in detail in connection with the chemical composition. Thus, some criteria for thermal design with the electric-electronic ceramic material were proposed.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.2
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• pp.109-116
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• 1999

ZnO Varistor is an electronic ceramic device to absorb the surge voltage from low voltage to high. To investigate the puncture mechanism occurring in NnO varistor, the Voronoi simulation for formulating the relation between the applied voltage and the increase of the temperature inside grain is applied. The Voronoi network can realize the structure of the practical varistor better than the established simple network. Using the current through each grain and the voltage applied to the grain, Joule heating energy is calculated and the phenomenon that the puncture occurs can be analyzed quantitatively by simulating the electric and thermal characteristics according to the externally applied pulsed voltage.

• Proceedings of the KIPE Conference
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• 2003.07b
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• pp.908-912
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• 2003

The waste heat recovery system using heat pipe was tested for the consideration of developing the high-efficiency waste heat recovery technology. Heat pipe, a effective device that can quickly transfer large amounts of heat energy using the phase change of the working fluid and the characteristics of Electric Heater Bars used for alternative heating system are introduced In this paper. In order to increase energy efficiency, the system which controls the status of electric heater bars and the temperature of heat pipe installed has developed.

• International Journal of Aeronautical and Space Sciences
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• v.1 no.2
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• pp.30-42
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• 2000

On-orbit thermal environment test of KOMPSAT was performed in early 1999. An analysis of the test data are addressed in this paper. For the thermal-environmental simulation of spacecraft bus, an artificial heating through the radiator zones and onto some critical heat-dissipating electronic boxes was made by Absorbed-heat Flux Method. Test data obtained in terms of temperature history were reduced into flight heater duty cycles and converted into the total electrical power required for spacecraft thermal control. Verification result of flight heaters dedicated to the bus thermal control is presented. Additionally, an exhaustive heating-control process for maintaining the spacecraft thermally safe and for realistic simulation of the orbital-thermal environment during the test are graphically shown. Qualitative suggestions to post-test model correlation are given in consequency of the analysis.

• Proceedings of the KWS Conference
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• 2005.11a
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• pp.231-233
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• 2005

Laser have been utilized as a heat source for the soldering of electronic components for the their capability of localized heating and faster heating rate. Laser soldering process, especially the diode laser soldering of BGA solderball was investigated. In this study, an attempt was made to investigate the possibility of laser soldering using Sn-37Pb and Sn-3Ag-0.5Cu solderball. The laser energy absorbed on the pad raised the temperature of the solderball forming a reflowed solder bump. The result were discussed based on the measurement of pull and shear strength of the bond.