• Journal of Convergence for Information Technology
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• v.11 no.9
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• pp.138-144
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• 2021

In the electronic component assembly business, when product defects occur, it is important to track incoming raw material defects or work defects, and it is important to improve suppliers or work sites according to the results. The core task of the smart factory is to build an integrated data hub to process storage, management, and analysis in real time, and to manage cluster processes, energy, environment, and safety. In order to improve reliability through accurate analysis and collection of production data by real-time monitoring of production site management for electronic parts-related small and medium-sized enterprises (SMEs), the establishment of a smart factory is essential. This paper was developed to be utilized in the construction by defining the system configuration method, smart factory-related technology and application cases, considering the characteristics of SMEs related to electronic components that want to introduce a smart factory.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2007.11a
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• pp.43-57
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• 2007

This paper considers the technological competitiveness of aircraft infra industries that are bases of the aircraft industry development in Korea. We performed focus group interviews to aircraft industry specialists and classified the aircraft infra industries by eight fields: metallurgical assembly, general machinery, precision instruments, materials & parts, communication appliances, computer, semi-conductor/ electronic component, electronics. Through the United States patents analysis for the G7 countries and Korea during 1995-2006, we identified the technological specificities and competences of each country. RTA(Revealed Technology Advantage) index and CII(Current Impact Index) are used to examine the technological specificity and technological competence respectively. Finally, we introduced TCI(Technological Competitiveness Index) which could reflect quantitative level as well as qualitative level of patents for each aircraft infra industry. The results show that Korea has occupied the technological competitiveness in the semi-conductor and electronic component industry out of eight aircraft infra industries, and achieved a competitive edge in communication appliance industry in the mid 2000s.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2003.05a
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• pp.741-743
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• 2003

A surface mount machine operation policy to assemble printed circuit boards is being developed in this research. The policy includes how to assign electronic components to slots on a component rack, and how to determine placement sequences on printed circuit board. The suggested heuristic uses information about component types and closeness relationships in each component on the board to assemble. First, the size of components and closeness ratings are used to divide them into two different size groups. Then rack assignment and placement routes are developed using component type and quantity information for a small size group, and followed by a large size group. Simulation models are developed using Visual C++ for performance evaluation of the heuristic. Necessary statistical analyses are provided to show the effectiveness of the suggested heuristic.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.459-460
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• 2006

• Aerospace Engineering and Technology
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• v.4 no.2
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• pp.203-208
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• 2005

Electronic components for space launch vehicles are exposed to a severe vibrational environment at launch and flight. The structural reliability of each component can be verified using mathematical approaches. In order to verify the structural reliability, an important parameter is the natural frequency of PCB(Printed Circuit Board) assembly mounted electronic components on and housing mounted PCB assembly in. In this paper, in order to find natural frequencies of PCB assemblies and the housing of hydrazine TCU(Thruster Control Unit), FEM(Finite Element Method) is adapted. The analytical result of FEM is verified by experimental method.

• Journal of Korean Society for Quality Management
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• v.33 no.4
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• pp.88-95
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• 2005

Multistage screening is a common practice when a component has a critical effect on the function of the assembly. A defect in a component might incur malfunction of an electronic device, resulting in a great amount of loss. Multistage screening, including duplicated screening inspections, may provide a good solution for this problem when inspection errors are present. In the company studied here, the manufacturing process of the multiple layer chip capacitor includes two-stage screening. In the first stage, screening inspection is performed repeatedly until no defects are found in the lot. In the second stage, sampling inspection is performed by a group of experts prior to shipment. In this article, we review the procedure used in the field and suggest a revised model of the multiple screening procedure and solution method for this situation. The usefulness of the proposed model is discussed through a practical example.

• Proceedings of the KSME Conference
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• 2001.06d
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• pp.390-395
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• 2001

Cooling characteristics using convection and conduction heat transfer in a parallel channel with extruding heat sources are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The considered assembly consists of two channels formed by two covers and one PCB which has three uniform heat source blocks. Five different cooling methods are considered to find efficient cooling method in a given geometry and heat source. The velocity and temperature fields, local temperature distribution along surface of blocks, and the maximum temperature in each block are obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.4
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• pp.386-390
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• 2006

Global consumption of aspheric lens will expand rapidly due to golbal transformation of the electronics based industry to optics based mechatronics. Especially, F-Theta lens is one of important parts in Laser Scanning Unit(LSU) because it affects the optical performance of LSU dominantly. Non axisymmetric machine based processing techologies are required to obtain high accuracy in utlra-precision aspheric core, the most important component in plastic injection molded F-Theta lens assembly. In this study, the core with non-axisymmetric aspheric shape which is used to emit the F-Theta lens was processed using the ultra precision processing technology and the shape accuracy of the core was measured. And the results there of were evaluated and compared with the emitted shape accuracy of F-Theta lens.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.108-111
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• 2003

Currently, molecular devices are reported utilizing active self-assembled monolayers containing the nitro group as the active component, which has active redox centers[1]. We confirm the electrical properties of 4,4-di(ethynylphenyl)-2'-nitro-1-benzenethiolate. To deposit the SAM layer onto gold electrode, we transfer the prefabricated Au(111) substrates into a 1mM self-assembly molecules in THF solution. Au(111) substrates were prepared by ion beam sputtering method of gold onto the silicon wafer. As a result, we measured current-voltage curve using ultra high vacuum scanning tunneling microscopy (UHV STM), I-V curve also clearly shows several current peaks between the negative bias region (-0.3958V) and the positive bias region (0.4658V), respectively.

• International Journal of Fuzzy Logic and Intelligent Systems
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• v.6 no.2
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• pp.95-99
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• 2006

A tape feeder of a SMD(Surface Mount Device) mounter is a device that sequentially feeds electronic components on a tape reel to the pick-up system of the mounter. As components are getting much smaller, feeding accuracy of a feeder becomes one of the most important factors for successful component pick-up. Therefore, it is critical to keep the feeding accuracy to a specified level in the assembly and production of tape feeders. This paper describes a tape feeder inspection system that was developed to automatically measure and to inspect feeding accuracy using machine vision. It consists of a feeder base, an image acquisition system, and a personal computer. The image acquisition system is composed of CCD cameras with lens, LED illumination systems, and a frame grabber inside the PC. This system loads up to six feeders at a time and inspects them automatically and sequentially. The inspection software was implemented using Visual C++ on Windows with easily usable GUI. Using this system, we can automatically measure and inspect the quality of ail feeders in production process by analyzing the measurement results statistically.