• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2014.10a
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• pp.273-276
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• 2014

The development of a vehicle-mounted radar to detect the location of enemy artillery is mainly mounted during operation to the mobility of the equipment and efficiency of utilization range. It is equipped with an electronic device responsible for the operation of the radar system. Electronic equipments is performed functionality imparted without an error-specific in spite of disturbances such as vibration / shock caused by vehicle movement. Therefore, vibration / shock resistance is held to prevent damaging from vibration / shock generated from the outside environment during operation. In addition, a standardized and specified cabinet structure equipped with electronic equipment is placed in shelter to ensure additional safety for vibration / shock. In this study, it is evaluated by analytical method with vibration / shock resistance of the cabinet structures for ensuring structural safety factor is applied to the aluminum. It is verified the reliability of the structure and structural dynamics to verify by calculated natural frequencies adding the weight of the cabinet structure and the structural displacement and stress results confirmed with vibration / shock caused by the vehicle movement.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.7
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• pp.2356-2366
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• 1996

High-power electronic chips have been advanced to such an extent that the heat dissipation capability of a system design has become one of the primary limiting factors. Therefore, thermal design must be considered in the early stage of the electronic system development. In present paper, the results of an experimental study on the forced convection cooling are presented to evaluate cooling performance of an electronic cabinet which in generally used for telecommunication system. Temperatures and thermal resistances are applied to compare the heat transfer characteristics for various locations of a fan unit as well as various configuration of non-uniform powering modules. As a result, the optimal configuration of a fan unit and powering configuration is suggested for the effective thermal design of telecommunication system.

• Nuclear Engineering and Technology
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• v.55 no.7
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• pp.2407-2418
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• 2023

Internal replaceable electronic module substitutions can impact EMC (ElectroMagnetic Compatibility) qualification testing and results if EMC testing is conducted at the cabinet level. The impact of component substitutions on EMC qualification results therefore should be evaluated. If a qualitative evaluation is not adequate to ensure that the modified product will not impact the cabinet level EMC qualification results, a new qualification testing should be conducted. Component level retesting should be conducted under electromagnetically equivalent conditions with the cabinet level test. This paper analyzes the propagation of conducted susceptibility test waveforms in a representative cabinet and evaluates the impact of component substitutions on cabinet level EMC qualification results according to the location of the replacement items. A guideline for a qualitative evaluation of the impact of component substitutions is described based on the propagation of the conducted susceptibility test waveforms. A module level test method is also described based on an analysis of the shielding effectiveness of the cabinet.

• The Journal of the Korea institute of electronic communication sciences
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• v.16 no.1
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• pp.1-8
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• 2021

In this paper, the cabinet shielding effectiveness (SE) including digital modules for nuclear power plants is analyzed depending on the internal structure and electromagnetic (EM) wave incidence angle. To analyze the SE, the cabinet and modules are modeled using the FEKO EM simulation tool. The SE is then obtained by comparing the electric field with and without the cabinet. In addition, the cabinet SE is observed by changing various conditions such as the spacing of each digital module, incidence angle, and the polarization of the EM wave at the 2.4 G[Hz frequency. To verify the results, the dipole antenna for SE measurements is fabricated, and the SE is measured in a semi-anechoic chamber. The result demonstrates that the SE by the cabinet structure can be expected to be higher when the polarization of the incident EM wave is horizontal to the ground and the distance between the digital modules is wide.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.48 no.4
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• pp.10-16
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• 2011

A cabinet is an outer frame of a TV, which is usually made of poly-carbonate. Cabinets are apt to be deformed because of applied heat during injection molding process and UV joining process. Severely deformed cabinets cause a falling-off in quality of the final product. Therefore cabinets should be inspected and only the good ones should be delivered to the following process. We implemented an experimental system for shape recognition of a cabinet and proposed several indices to characterize the shape of a cabinet. We also proposed algorithms to eliminate the possible bias present in measured data and to check the goodness of a cabinet. Experimental results show the feasibility of the propose algorithms.

• Proceedings of the SAREK Conference
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• 2009.06a
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• pp.1385-1390
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• 2009

In this study the purpose is development of passive cooling system for telecommunication cabinet used by latent heat material. This cooling system is not required for electronic power. It was tested for the performance of the telecommunication combined latent heat material with $48^{\circ}C$ of phase changed temperature and heat pipe. At $45^{\circ}C$ of outside temperature, when heater power was 1,000 W and 1,500 W, the inside temperature of the cabinet was $55^{\circ}C$ and $62^{\circ}C$. This system was showed better performance than the other systems.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.3524-3528
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• 2007

In this study, the Peltier effect was applied to eliminate moistures in the air enclosed by a cabinet. We have developed the new electronic dehumidifier which has a new function of automatically evaporating the condensed water inner cabinet into the outside air. To obtain this function, the processes of dehumidification is that it condensed the moistures on the cold side heat sink and drained it into the hot side heat sink by the both gravitational and capillary forces and the droplets on the hot side heat sink surface was evaporated into the air outside the cabinet by the heat conducted through the hot side heat sink surface and the forced heat convection through the fan for cooling hot side heat sink. Compared to existing electronic dehumidifiers, this manufactured one showed a good performance that the electric power consumption for the same dehumidifying quantity was reduced by 50% compared with that of existing ones.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.29 no.6
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• pp.279-288
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• 2017

Heat generation rate in a telecommunication cabinet increases due to the continued usage of mobile devices. Insufficient removal of heat intensifies the cabinet temperature, resulting in the malfunction of electronic devices. In this study, we assessed both aluminum and plastic heat exchangers used for cooling of the telecommunication cabinet, and compared the results against theoretical predictions. The aluminum heat exchanger was composed of counter flow parallel channels of 4.5 mm pitch, and the plastic heat exchangers were composed of cross flow triangular channels of 2.0 mm pitch. Samples were made by installing two plastic heat exchangers in both series and parallel. Results showed that the heat transfer rate was highest for the series cross flow heat exchanger, and was least for the aluminum heat exchanger. The temperature efficiency of the series cross flow heat exchanger was 59% greater than that of the aluminum heat exchanger, and was 4.3% greater than that of the parallel cross flow heat exchanger. In contrast, the pressure drop of the parallel cross flow heat exchanger was significantly lower than other samples. The heat exchange efficiency was also the largest for the parallel cross flow heat exchanger. The theoretical analysis predicted the temperature efficiency to be within 3.3%, and the pressure drop within 6.1%.

• Korean Journal of Computational Design and Engineering
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• v.4 no.4
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• pp.318-326
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• 1999

Recently, electronic systems including computers have been rapidly shrinking in size while at the same time the complexity and the capability of these systems continue to grow/sup [1]/. Thus, system volumes have decreased as system power has increased, resulting in dramatic increases in system heat density. The high temperature of the computer system is considered as the major reason for low performance and shortening life of the product. It is necessary to solve this problem due to the heat density increased and to develop the design skill of the computer cabinet according to miniaturization. M4500 desk-top computer was selected for analyzing the thermal management inside cabinet. The cabinet volume, the configuration of the heating devices, the size and location of air ventilation, and the fan selection have been investigated as the important parameters to find out an optimal cabinet design. The objectives of this project were to analyze which design parameters would affect cooling performance by thermal strategy, to design an optimal model, and to measure the temperatures of the main parts to confirm the effect of the thermal design. The temperatures of each part of the optimal model were compared with those of the existing model. As a result. the volume of this miniaturized model was about 16% smaller than that of M4500 without any change in operating performance.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.4
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• pp.771-779
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• 1989

Numerical analysis by SIMPLE algorithm has been performed to predict the characteristics of flow and heat transfer in channels between the printed circuit boards of an electronic cabinet. It is assumed that the electronic parts release uniform heat flux per unit axial length to the cooling air. The air flow between channels is assumed fully developed laminar, incompressible, and mixed convective. In this study, the electronic parts are mounted on both sides of the prinked circuit boards by two kinds of configuration such as the zig-zag and the symmetric one. The Rayleigh numbers ranging from 0 to 10$^{6}$ are considered to predict the characteristics of the main flow and the secondary flow occurred by natural convection, the temperature distribution in channel, the heat transfer rate from heated electronic parts and the increase of friction factor by natural convection. As the results of numerical calculation, several conclusions are drawn as follows. The influence of natural convection on the flow characteristics appears strong when the Rayleigh number is above 10$^{4}$. The main axial flow rate decreases by a half or more at the Rayleigh number of 10$^{6}$ . Although the friction factor increases as Rayleigh number increases, the increasing rate of heat transfer is higher than that of the friction factor. The cooling efficiency of the zig-zig-configuration is superior to that of the symmetric configuration at same Rayleigh number.