• Applied Microscopy
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• v.48 no.4
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• pp.122-125
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• 2018

The focused ion beam (FIB) method is widely used to prepare specimens for observation by transmission electron microscopy (TEM), which offers a wide variety of imaging and analytical techniques. TEM has played a significant role in material investigation. However, the FIB method induces amorphization due to bombardment with the high-energy gallium ($Ga^+$) ion beam. To solve this problem, electron beam induced deposition (EBID) is used to form a protective layer to prevent damage to the specimen surface. In this study, we introduce an optimized TEM specimen preparation procedure by comparing the EBID of carbon and tungsten as protective layers in FIB. The selection of appropriate EBID conditions for preparing specimens for TEM analysis is described in detail.

• Nuclear Engineering and Technology
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• v.53 no.1
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• pp.266-272
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• 2021

In the pulsed electron beam generators, such as plasma focus devices and linear induction accelerators whose electron pulse width is in the range of nanosecond and less, as well as in cases where there is no direct access to electron beam, like runaway electrons in Tokamaks, measurement of the electron energy spectrum is a technical challenge. In such cases, the indirect measurement of the electron spectrum by using the bremsstrahlung radiation spectrum associated with it, is an appropriate solution. The problem with this method is that the matrix equation between the two spectrums is an ill-conditioned equation, which results in errors of the measured X-ray spectrum to be propagated with a large coefficient in the estimated electron spectrum. In this study, a method based on the neural network and the MCNP code is presented and evaluated to recover the electron spectrum from the X-ray generated by collision of the electron beam with a target. Multilayer perceptron network showed good accuracy in electron spectrum recovery, so that for the X-ray spectrum with errors of 3% and 10%, the network estimated the electron spectrum with an average standard error of 8% and 11%, on all of the energy intervals.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.44 no.11
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• pp.43-50
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• 2007

We have investigated the electro-optical characteristics and reliability of LEDs with the Indium-Tin-Oxide (ITO) electrodes formed by different deposition methods: electron beam evaporation, sputtering, and hybrid method of electron beam evaporation and subsequent sputtering. The deposition method of the ITO electrode has significant influence on the electro-optical characteristics and reliability of LEDs. The LEDs with the ITO electrodes formed by sputtering and electron beam evaporation have problems caused by sputtering damage and increased electrical resistance, respectively, and the problems have been solved by the hybrid method.

• Journal of Information Display
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• v.3 no.1
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• pp.17-21
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• 2002

Measurement of the ion-induced secondary electron emission coefficient (${\gamma}_i$) for insulating films is hampered by an unavoidable charging problem. Here, we demonstrate that a pulsed ion beam technique is a viable solution to the problem, allowing for accurate measurement of ${\gamma}_i$ for insulating materials. To test the feasibility of the pulsed ion beam method, the secondary electron emission coefficient from n-Si(100) is measured and compared with the result from the conventional continuous beam method. It is found that the ${\gamma}_i$ from n-Si(100) by the ion pulsed beam measured to be 0.34, which is the same as that obtained by continuous ion beam. However, for the 1000 A $SiO_2$ films thermally deposited on Si substrate, the measurement of ${\gamma}_i$ could be carred out by the pulsed ion method, even though the continuous beam method faced charging problem. Thus, the pulsed ion beam is regarded to be one of the most suitable methods for measuring secondary electron coefficient for the surface of insulator materials without experiencing charging problem. In this report, the dependence of ${\gamma}_i$ on the kinetic energy of $He^+$ is presented for 1000 ${\AA}$ $SiO_2$ films. And the secondary electron emission coefficient of 1000 ${\AA}$ MgO e-beam-evaporated on $SiO_2/Si$ is obtained using the pulsing method for $He^+$ and $Ar^+$ with energy ranging from 50 to 200 eV, and then compared with those from the conventional continuous method.

• Textile Coloration and Finishing
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• v.15 no.2
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• pp.102-108
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• 2003

Before studying graft polymerization of PP(polypropylene) nonwoven fabrics by electron beam preirradiation method, mechanical properties, thermal properties and degree of crystallinity of original and electron beam irradiated PP nonwoven fabrics were investigated. Morphological surface changes of electron beam irradiated PP nonwoven fabrics were not observed. And the melting temperature and crystallinity of electron beam irradiated PP nonwoven fabrics also did not change as compared with untreated PP nonwoven fabrics. But the breaking strength of electron beam irradiated PP nonwoven fabrics decreased with increasing electron beam absorbed dose due to breakdown of some parts of polymer main chain.

• Journal of Welding and Joining
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• v.15 no.3
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• pp.79-87
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• 1997

This study was performed to evaluate basic characteristics of electron beam welding process for a 9% Ni steel plate. The principal welding process parameters, such as working distance, accelerating voltage, beam current and welding speed were investigated. The AB (Arata Beam) test method was also applied to characterize beam size and energy density of the electron beam welding process. The electron beam size was found to decrease with the increase of accelerating voltage and the decrease of working distance. So, in case of high voltage (150kV), spot size and energy density of electron beam were revealed to be 0.9mm and $6.5\times10^5W/\textrm{cm}^2$ respectively. The accelerating voltage among the welding parameters was found to be the most important factor governing the penetration depth. When the accelerating voltage of electron beam was low ($\leq$90kV), beam current and welding speed did not affect on the penetration depth significantly. However, in case of high voltage ($\geq$120kV), the depth of penetration increased very sensitively with the increase of beam current and the decrease of welding speed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.2
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• pp.24-29
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• 2006

The use electron-beam(E-beam) manufacturing system provides a means to alleviate optic exposure equipment's problems. We are developing an E-beam manufacturing system with scanning electron microscope(SEM) function. The E-beam manufacturing system consist of high voltage generator, beam blanker, condenser lenses, object lenses, stigmator and stage. The development of E-beam manufacturing system is used on the method of remaking SEM's structure. The functions of SEM are developed. It is important for the test of E-beam performance. In E-beam manufacturing system and SEM, beam focus is important function. In this paper, we propose intelligent remote control function for beam focus in E-beam manufacturing system. The function extends the user's function and gives convenience.

• ETRI Journal
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• v.29 no.6
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• pp.814-816
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• 2007

Conventional lithography methods of gold patterning are based on deposition and lift-off or deposition and etching. In this letter, we demonstrate a novel method of gold patterning using spin-coatable gold electron-beam resist which is functionalized gold nanocrystals with amine ligands. Amine-stabilized gold electron beam resist exhibits good sensitivity, 3.0 mC/$cm^2$, compared to that of thiol-stabilized gold electron beam resists. The proposed method reduces the number of processing steps and provides greater freedom in the patterning of complex nanostructures.

• Transactions on Electrical and Electronic Materials
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• v.6 no.6
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• pp.272-275
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• 2005

We studied the control of pretilt angles for homeotropic aligned nematic liquid crystal (NLC) on SiOx thin film surface by $45^{\circ}$ evaporation method with electron beam system. The uniform vertical LC alignment on. the SiOx thin film surfaces with electron beam evaporation was achieved. It is considered that the LC alignment on SiOx thin film by $45^{\circ}$ electron beam evaporation is attributed to elastic interaction between LC molecules and micro-grooves at the SiOx thin film surface created by evaporation. The pretilt angles of about $3.5^{\circ}$ in aligned NLC on SiOx thin film surfaces by electron beam evaporation of $45^{\circ}$ were measured. Consequently, the high pretilt angles of the NLC on the SiOx thin film by $45^{\circ}$ oblique electron beam evaporation method can be achieved.

• Macromolecular Research
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• v.13 no.5
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• pp.435-440
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• 2005

This study describes a method where the match of two different length scales, i.e., the patterns from self-assembled block copolymer (<50 nm) and electron beam writing (>50 nm), allow the nanometer scale pattern mask. The method is based on using block copolymers containing a poly(methyl methacrylate) (PMMA) block, which is subject to be decomposed under an electron beam, as a pattern resist for electron beam lithography. Electron beam on self assembled block copolymer thin film selectively etches PMMA microdomains, giving rise to a polymeric nano-pattern mask on which subsequent evaporation of chromium produces the arrays of Cr nanoparticles followed by lifting off the mask. Furthermore, electron beam lithography was performed on the micropatterned block copolymer film fabricated by micro-imprinting, leading to a hierarchical self assembled pattern where a broad range of length scales was effectively assembled, ranging from several tens of nanometers, through submicrons, to a few microns.