• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.150-150
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• 2012

진공증착을 이용하여 제조된 알루미늄 박막은 증착 조건에 따라 그 특성이 현저히 달라지는 것으로 알려져 있다. 특히, 진공도와 증착율에 따라 비저항과 반사율, 표면 색상 등이 크게 달라지며 이에 따라 적절한 증발원 및 증착 방법의 선택이 박막의 특성을 좌우하게 된다. 알루미늄은 융점이 낮은 반면 증기화되는 온도가 높을 뿐만 아니라 고온에서는 대부분의 내화물 금속과 반응하기 때문에 저항가열 증발원을 이용하여 증발시키기가 매우 까다로운 물질중의 하나이다. 또한 전자빔으로 증발시킬 경우에는 열전도도가 커서 수냉 도가니를 통해 열이 빠져나가기 때문에 효과적인 증발을 위해서는 고전력을 투입해야 하는 어려움이 있다. 한편, 스퍼터링 증발원을 이용하여 알루미늄을 증착하면 낮은 증착율로 인해 반사율과 같은 제반 특성이 현저히 떨어지는 단점이 있다. 본 논문에서는 알루미늄 박막의 제조를 위한 최적의 증발원과 증착 방법을 소개하고 증착 조건과 박막 특성의 상관성 자료를 소개하였다. 이를 위해 각종 저항가열 및 전자빔 증발원 그리고 스퍼터링을 이용한 증발 실험 결과를 소개하고 증발원에 따른 알루미늄 박막의 특성 변화 그리고 제반 증착 조건이 박막의 특성에 미치는 영향을 소개하였다.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.202-203
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• 2006

In the AC PDP, the MgO film is used as electrode protective film. This film must provide excellent ion bombardment protection, high secondary electron emission, and should be high transparent to visible radiation. In this study, we investigated the relations between the crystal orientation and e-beam evaporation process parameters. The crystal orientation of the MgO layer depends on the conditions of deposition. The parameters are the thickness of the MgO film $1000{\AA}-6500{\AA}$, the deposition rate $200{\AA}/min{\sim}440{\AA}/min$, the temperature $150^{\circ}C{\sim}250^{\circ}C$, and the distance between crucible and substrate 11cm ${\sim}$ 14cm. The temperature of substrate and evaporation rate of source material, or deposition rate of the film, are definitely related to the crystal orientation of the MgO thin film. The crystal orientation can be changed by the distance between the target(MgO tablet) and the substrate. However, the crystal orientation is not much affected by the thickness of MgO thin film.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.6
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• pp.308-316
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• 2019

Electron beam physical vapor deposition (EBPVD) is a conventional method to fabricate thermal barrier coating (TBC) of high temperature airfoil engine parts, such as blade etc. for its high temperature structural stability from the nature of columnar growth behavior. For the high quality of TBC by EBPVD, the structural factors, such as growth behavior, thickness uniformity and so on, should be managed to obtain the coating which satisfied the required specifications of usable level of mechanical and thermal properties. In this study, the growth behavior and structure variations of 7YSZ (7 wt% yttria stabilized zirconia) coatings with different configurational deposition parameters for the specimens which have turbine blade shape mock-up were investigated. Growth behavior of coatings were studied by comparing computational modeling of evaporation behavior with actual deposition process using e-beam source.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.73-80
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• 2007

For the sub-65 nm CMOS process, it is necessary to develop a new silicide material and an accompanying process that allows the silicide to maintain a low sheet resistance and to have an enhanced thermal stability, thus providing for a wider process window. In this study, we have evaluated the property and unit process compatibility of newly proposed composite silicides. We fabricated composite silicide layers on single crystal silicon from $10nm-Ni_{1-x}Co_x/single-crystalline-Si(100),\;10nm-Ni_{1-x}Co_x/poly-crystalline-\;Si(100)$ wafers (x=0.2, 0.5, and 0.8) with the purpose of mimicking the silicides on source and drain actives and gates. Both the film structures were prepared by thermal evaporation and silicidized by rapid thermal annealing (RTA) from $700^{\circ}C\;to\;1100^{\circ}C$ for 40 seconds. The sheet resistance, cross-sectional microstructure, surface composition, were investigated using a four-point probe, a field emission scanning probe microscope, a field ion beam, an X-ray diffractometer, and an Auger electron depth profi1ing spectroscopy, respectively. Finally, our newly proposed composite silicides had a stable resistance up to $1100^{\circ}C$ and maintained it below $20{\Omega}/Sg$., while the conventional NiSi was limited to $700^{\circ}C$. All our results imply that the composite silicide made from NiCo alloy films may be a possible candidate for 65 nm-CMOS devices.

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.612-619
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• 2002

The dynamic behavior of Al-Mg alloys plasma was very unstable and this instability was closely related to the unstable motion of keyhole during laser irradiation. The keyhole fluctuated both in size and shape and its fluctuation period was about 440 ${\mu}{\textrm}{m}$. This instability has been estimated to be caused by the evaporation phenomena of metals with different boiling point and latent heats of vaporization. Therefore, the authors have conducted the spectroscopic diagnostics of plasma induced in the pulsed YAG laser welding of Al-Mg alloys in air and argon atmospheres. In the air environment, the identified spectra were atomic lines of Al, Mg, Cr, Mn, Cu, Fe and Zn, and singly ionized Mg line, as well as strong molecular spectrum of AlO, MgO and AIH. It was confirmed that the resonant lines of Al and Mg were strongly self-absorbed, in particular in the vicinity of pool surface. The self-absorption of atomic Mg line was more eminent in alloys containing higher Mg. These facts showed that the laser-induced plasma was relatively a low temperature and high density metallic vapor. The intensities of molecular spectra of AlO and MgO were different each other depending on the power density of laser beam. Under the low power density irradiation condition, the MgO band spectra were predominant in intensity, while the AlO spectra became much stronger in higher power density. In argon atmosphere the band spectra of MgO and AlO completely vanished, but AlH molecular spectra was detected clearly. The hydrogen source was presumably the hydrogen solved in the base Metal, absorbed water on the surface oxide layer or H$_2$ and $H_2O$ in the shielding gas. The temporal change in spectral line intensities was quite similar to the fluctuation of keyhole. The time average plasma temperature at 1 mm high above the surface of A5083 alloy was determined by the Boltzmann plot method of atomic Cr lines of different excitation energy. The obtained electron temperature was 3, 280$\pm$150 K which was about 500 K higher than the boiling point of pure aluminum. The electron number density was determined by measuring the relative intensities of the spectra1lines of atomic and singly ionized Magnesium, and the obtained value was 1.85 x 1019 1/㎥.