• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.97-104
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• 2006

ELID(Electrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study is describing an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould. It also presents some techniques for achieving the nanometer roughness of the hard metals, such as WC-Co, which are extensively used in precision tooling material.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.629-632
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• 2005

ELID(ELectrolytic In-process Dressing) grinding is an excellent technique for mirror grinding of various advanced metallic or nonmetallic materials. A polishing process is also required for elimination of scratches present on ELID grinded surfaces. MAP(Magnetic Assisted Polishing) has been used as a polishing method due to its high polishing efficiency and to its resulting in a superior surface quality. This study describes an effective fabrication method combining ELID and MAP of nano-precision mirror grinding for glass-lens molding mould, such as WC-Co, which are extensively used in precision tooling material. And for the optics glass-ceramic named Zerodure, which is extensively used in precision optics components too. The experimental results show that the combined method is very effective in reducing the time required for final polishing. The best surface roughness of the polished glass-ceramic was within 1.7nm Ra in this study.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.4 no.3
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• pp.31-38
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• 1995

Magnetic-electrolytic-abrasive polishing(MEAP) system was newly developed and the finishing characteristics of Cr-coated roller was analyzed. The paper describes the operational principle of MEAP system and magnetic field effect on the MEAP process by experimental results. The finishing characteristics and optimal finishing condition for Cr-coated roller was experimented and analyzed.

• Corrosion Science and Technology
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• v.21 no.4
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• pp.314-324
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• 2022

The objective of this investigation was to indentify major factors affecting surface roughness among various parameters of electropolishing process using the design of an experiment method (full factorial design) for UNS S31603. Factors selected included electrolyte composition ratio, applied current density, and electrolytic polishing time. They were compared through analysis of variance (ANOVA). Results of ANOVA revealed that all parameters could affect surface roughness, with the influence of electrolyte composition ratio being the highest. As a result of surface analysis after electropolishing, the specimen with the deepest surface damage was about 35 times greater than the condition with the smallest surface damage. The largest value of surface roughness after electropolishing was higher than that of mechanical polishing due to excessive processing. On the other hand, the smallest value of surface roughness after electropolishing was 0.159 ㎛, which was improved by more than 80% compared to the previous mechanical polishing. Taken all results together, it is the most appropriate to perform electrolytic polishing with a sulfuric acid and phosphoric acid ratio of 3:7, an applied current density of 300 mA/cm², and anelectrolytic polishing time of 5 minutes.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1997.10a
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• pp.190-195
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• 1997

The requirement of precision products about difficult-to-cut materials such as Cu and Aluminum alloy is becoming more and more. Because of soft materials, the exist narrow groves on surface are difficult to gotten off even on the polishing stage. It has been proved that Magnetic-Electrolytic-Abrasive Polishing (MEAP) is a efficient method to resolve this problem by using the nonwoven-abrasive pads together [1, 2]. In this study, through the experiments, their machining properties of newly developer polishing material of SiC, Al2O3 and diamond nonwoven abrasive pads have been proved. Through the experiments, the optimal machining conditions on larger cylinder shape workpiece of Cu and Aluminium alloy have been found, through the Taguchi[3] method the optimal machining conditions can be selected.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2008.11a
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• pp.137-137
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• 2008

This paper presents the ability of plasma electrolytic polishing technology to polish surface of stainless steel materials. The results show that the surface of its can be polished clearly using potentiostatic regimes in various concentration of $(NH_4)_2SO_4$ solution that had been warmed to a certain initial temperature. The equipment and deposition produces for polishing process are described and the effect of processing parameters on the characterizations polishedsamples has been has been investigated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.191-192
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• 2013

• Tribology and Lubricants
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• v.37 no.6
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• pp.208-212
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• 2021

Chemical mechanical polishing (CMP) is a key technology used for the global planarization of thin films in semiconductor production and smoothing the surface of substrate materials. CMP is a type of hybrid process using a material removal mechanism that forms a chemically reacted layer on the surface of a material owing to chemical elements included in a slurry and mechanically removes the chemically reacted layer using abrasive particles. Sapphire is known as a material that requires considerable time to remove materials through CMP owing to its high hardness and chemical stability. This study introduces a technology using electrolytic ionization and ultraviolet (UV) light in sapphire CMP and compares it with the existing CMP method from the perspective of the material removal rate (MRR). The technology proposed in the study experimentally confirms that the MRR of sapphire CMP can be increased by approximately 29.9, which is judged as a result of the generation of hydroxyl radicals (·OH) in the slurry. In the future, studies from various perspectives, such as the material removal mechanism and surface chemical reaction analysis of CMP technology using electrolytic ionization and UV, are required, and a tribological approach is also required to understand the mechanical removal of chemically reacted layers.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1995.03a
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• pp.118-132
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• 1995

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1998.10a
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• pp.38-43
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• 1998

Magneto Electrolytic Polishing (MEP) is a process in which metal ions are removed from a abrasive through a combination of magnetic electric current and chemical solution. The substrate is immersed into the magnetic effect, chemical solution, and DC crunt is applied. Several factors affect the rate at which the metal ions are removed from the substrate. Three of the most significant are the amount of time in which the substrate is immersed I the solution, and the amount of direct current applied in magnetic field. In this study, the surface finishing characteristics and optical finishing condition for the stainless steel were experimented upon and analyzed.