• Korean Journal of Materials Research
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• v.28 no.10
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• pp.601-609
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• 2018

To study the effects of graphite shape and the composite fabricating method on the mechanical properties of graphite/copper (Gr/Cu) composites, a copper composite using graphite flakes or graphite granules as reinforcing phases is fabricated using mechanical mixing or electroless plating method. The mechanical properties of the Gr/Cu composites are evaluated by compression tests, and the compressive strength and elongation of the Gr/Cu composites using graphite granules as a reinforcing phase are compared with those of Cu composites with graphite flakes as a reinforcing phase. The compressive yield strength or maximum strength of the Gr/Cu composites with graphite granules as a reinforcing phase is higher than that of the composites using graphite flakes as a reinforcing phase regardless of the alignment of graphite. The strength of the composite produced by the electroless plating method is higher than that of the composite material produced by the conventional mechanical mixing method regardless of the shape of the graphite. Using graphite granules as a reinforcing phase instead of graphite flakes improves the strength and elongation of the Gr/Cu composites in all directions, and reduces the difference in strength or elongation according to the direction.

• Journal of Surface Science and Engineering
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• v.42 no.1
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• pp.47-52
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• 2009

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

• Korean Chemical Engineering Research
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• v.46 no.5
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• pp.863-867
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• 2008

Pitch based activated carbon fiber(ACF) was prepared from reformed naphtha cracking bottom oil(NCB oil) by melt spinning. The fibers obtained were stabilized, carbonized, and then steam activated. The ACF was sensitized with Pd-Sn catalytic nuclei via a single-step activation approach. This sensitized ACF was used as precursors for obtaining copper plated ACFs via electroless plating. ACFs uniformly decorated with metal particles were obtained with reduced copper plating in the reaction solution. Effects of the amount of copper on characteristics of ACF/Cu catalysts were investigated through BET surface area, X-ray diffraction, scanning emission microscopy, and ICP. The amount of copper increased with plating time, but the surface area as well as the pore volume decreased. NO conversion increased with reaction temperature. NO conversion decreased with increasing the amount of copper, which is seemed to be due to the reduction of surface area as well as the dispersion of copper.

• Korean Journal of Materials Research
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• v.23 no.11
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.39-42
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• 2004

Carbon nanofiber/Cu composite powder has been fabricated by electroless plating process. Microstructural evolution of the composite powder after heat treatment under vacuum, hydrogen and air environment was investigated. A dispersed carbon nanofiber coated by copper was produced at the as-plated condition. Carbon nanofiber is coated uniformly and densely with the plate shaped copper particles. The copper plates on the carbon nanofiber aggregate during the thermal exposure at elevated temperature in vacuum and hydrogen in order to reduce surface energy. The thermal exposure of the composite powder in air at $400^{\circ}C$ for 3 hours leads to the spherodization of the composite powder owing to oxidation of copper.

• Journal of Surface Science and Engineering
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• v.25 no.4
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• pp.173-180
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• 1992

The effects of the stabilizing additives such as NaCN, 2-MBT and Thiourea on bath decom-position, plating rate and surface morphology have been studied. Bath stability was increased in the order of an additive-free bath, and NaCN-, 2-MBT-, and Thiourea-stabilized baths. The sta-bilizing effects may be attributed to the stability of Cu(II) -complexes. The plating rate is the re-verse order of the bath stability. Accelerative effect of 2-MBT in proper quantity(0.3mg/$\ell$) may be explained by visualizing it absorbed through benzene ring or sulfur atom on portions of the sub-strates. The strong bond of the complexing part of the molecule to nearby chelated copper ions would tend to accelerate plating by making it easier for the Cu2+ -ligand bond to be broken. Sur-face morphologies of copper deposits depend on the bath additives. Electroless copper deposits from the 2-MBT stabilized baths are finer than the deposits from the NaCN- and Thiourea- stabi-lized baths due to the strong adsorption on the substrates.

• Polymer(Korea)
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• v.25 no.2
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• pp.302-310
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• 2001

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless Cu plated layer and polyester (PET) film, the effect of pretreatment conditions such as etching method and mixed catalyst composition, and accelerator was investigated. Compared to NaOH etching medium, PET film was more finely etched by HCl solution, resulting in an improvement in adhesion between Cu layer and PET film. However, there were no significant differences in electromagnetic interference shielding effectiveness as a function of etching medium. The surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$ : SnCl$_2$ from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, the adhesion and the shielding effectiveness of Cu plated PET film were increased. Furthermore, HCl was turned out to be a better accelerator than NaOH in order to enhance the activity of the mixed PdCl$_2$/SnCl$_2$ catalyst, which facilitated the formation of more uniform copper deposit on the PET film.

• 한국전기화학회:학술대회논문집
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• 2000.10a
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• pp.20-20
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• 2000

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.54-55
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• 2000

• Korean Chemical Engineering Research
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• v.43 no.4
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• pp.495-502
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• 2005

Copper was plated on the tungsten substrate by use of a direct copper electroless plating. The optimum deposition conditions were found to be with a concentration of $CuSO_4$ 7.615 g/L, EDTA of 10.258 g/L, and glyoxylic acid of 7 g/L, respectively. The solution temperature was maintained at $60^{\circ}C$. The pH was varied from 11.0 to 12.8. After the deposition, the properties of the copper film were investigated with X-ray diffractometer (XRD), Field emission secondary electron microscope (FESEM), Atomic force microscope (AFM), X-ray photoelectron spectroscope (XPS), and Rutherford backscattering spectroscope (RBS). The best deposition condition was founded to be the solution pH of 11.8. In the case of 10 min deposition at the pH of 11.8, the grain shape was spherical, Cu phase was pure without impurity peak ($Cu_2O$ peak), and the surface root mean square roughness was about 11 nm. The thickness of the film turned out to be 140 nm after deposition for 12 min and the deposition rate was found to be about 12 nm/min. Increase in pH induced a formation of $Cu_2O$ phase with a long rectangular grain shape. The pH control seems to play an important role for the orientation of Cu in electroless deposition. The deposited copper concentration was 99 atomic percent according to RBS. The resulting Cu/W film yielded a good adhesive strength, because Cu/W alloy forms during electroless deposition.