• 한국재료학회지
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• 제23권11호
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• pp.661-665
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• 2013

We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.

• 한국표면공학회지
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• 제40권2호
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• pp.70-76
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• 2007

Ni-P-SiC composite coating layers were prepared by electroless plating method and their deposition rate, codeposition of SiC, morphology, surface roughness, hardness, wear and friction properties were investigated. The deposition rate was kept almost constant independent of the concentration of SiC in the plating solution and the codeposition of SiC in the composite coating layer increased with increased concentration of SiC in the plating solution except the early stage. Vickers microhardness increased with respect to the increased codeposition of SiC and the heat treatment at $300^{\circ}C$ in air for 1 hour. It was found that the wear volume decreased with increased up to 50 wt.% of SiC codeposition, and that friction coefficient increased gradually with increased codeposition of SiC. Considering the wear and the friction behaviors, the composite coating layer obtained by using 50 wt.% of SiC codeposition is desirable for the practical application for anti-wear and anti-friction coatings.

• Composites Research
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• 제20권5호
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• pp.43-48
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• 2007

전자기파의 흡수와 간섭 문제는 상업적, 군사적 용도에서 중요한 문제로 다루어져 왔다. 스텔스 기술은 전자기파 흡수 기술의 가장 전형적인 적용 방법 중에 하나이다. 본 연구는 유전성 및 자성 손실을 함유한 복합성의 필러를 개발하고자 시작되었다. 전도성 나노 소재인 탄소나노섬유 (CNFs)에 자성을 부여하기 위해 두 가지의 니켈-인과 니켈-철을 무전해 도금을 적용하여 각각 코팅하는 실험에 성공하였다. 제작된 복합 소재의 미세 구조를 SEM/TEM을 통해 관찰하였고, 이들의 성분 분석(EDS/ELLS)을 수행하였다. 코팅 층의 평균 두께는 약 $50\;{\sim}\;100\;nm$의 결과를 나타내었으며, 코팅 층의 성분은 Ni-6wt%P와 Ni-70wt%Fe의 결과를 각각 나타내었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2000년도 춘계학술발표회 초록집
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• pp.15-16
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• 2000

• 한국표면공학회지
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• 제49권1호
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• pp.54-61
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• 2016

Screen printing of commercially available Ag paste is the most widely used method for the front side metallization of Si solar cells. However, the metallization using Ag paste is expensive and needs high temperature annealing for reliable contact. Among many metallization schemes, Ni/Cu/Sn plating is one of the most promising methods due to low contact resistance and mass production, resulting in high efficiency and low production cost. Ni layer serves as a barrier which would prevent copper atoms from diffusion into the silicon substrate. However, Ni based schemes by electroless deposition usually have low thermal stability, and require high annealing process due to phosphorus content in the Ni based films. These problems can be resolved by adding W element in Ni-based film. In this study, Ni-W-P alloys were formed by electroless plating and properties of it such as sheet resistance, resistivity, specific contact resistivity, crystallinity, and morphology were investigated before and after annealing process by means of transmission line method (TLM), 4-point probe, X-ray diffraction (XRD), and Scanning Electron Microscopy (SEM).

• 공업화학
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• 제24권4호
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• pp.438-442
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• 2013

본 연구에서는 무전해 도금법으로 니켈과 인을 탄소섬유 표면에 코팅한 후, 열처리시키는 과정에서 일어나는 변화를 다양한 분석방법을 이용하여 연구하였다. 전자현미경(Scanning Electron Microscopy, SEM)을 이용한 연구에서는, 코팅 후 추가적인 열처리를 하지 않은 경우 평평한 표면구조를 관찰하였으나, 열처리 온도가 $350^{\circ}C$에 이르면서 다공성구조가 생성됨을 알았다. 열처리 온도를 $50^{\circ}C$ 간격으로 증가시키면서 연구한 결과 $650^{\circ}C$까지는 열처리 온도가 증가할수록 기공의 크기는 증가하고, 개수는 감소하는 경향성이 관찰되었다. X-선 회절법(x-ray diffraction, XRD) 측정 결과, 코팅 후 추가 열처리가 없는 경우 금속성 Ni, Ni-P 화합물이 관찰되었으며, 열처리 온도가 증가함에 따라 NiO 봉우리는 세기가 증가하며, 금속성 Ni 봉우리의 세기는 감소하였다. X-선 광전자 분광법(X-ray Photoelectron Spectroscopy, XPS) 측정에서는 $650^{\circ}C$, $700^{\circ}C$의 열처리 후 인 산화물이 표면에서 검출됨을 확인하였는데, 이는 코팅된 니켈 필름의 내부에 존재하던 인 화합물이 열처리 온도가 증가함에 따라서 표면 밖으로 빠져 나오는 현상이 일어나는 결과로 해석할 수 있다. 이상의 분석 데이터를 토대로, 무전해 도금으로 코팅된 Ni-P 화합물($Ni_xP_y$)이 열처리 과정에서 산화되면서, 이때 생성된 인 화합물 기체가 승화하면서 필름에 기공을 생성시키는 것으로 제안할 수 있다. 다공성 물질은 넓은 비표면적 등의 우수한 물성때문에 불균일 촉매 등 다양한 분야에 적용될 수 있으며, 본 연구에서 소개하는 다공성 니켈 필름의 제작법은 대량 생산에 적용이 쉬워 환경 필터 분야 등의 다양한 곳에 응용될 수 있을 것으로 생각된다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2018년도 춘계학술대회 논문집
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• pp.33.1-33.1
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• 2018

pH is expressed mathematically as $pH=-{\log}[H^+]$, is a measure of the hydrogen ion concentration, [$H^+$] to specify the acidity or basicity of an aqueous solution. The pH scale usually ranges from 0 to 14. Every aqueous solution can be measured to determine its pH value. The pH values below 7.0 express the acidity, above 7.0 are alkalinity and pH 7.0 is a neutral solution. The solution pH can be determined by indicator or by measurement using pH sensor, which measuring the voltage generated between a glass electrode and a reference electrode according to the Nernst Equation. The pH value of solutions depends on the temperature and the activity of contained ions. In nickel electroless plating process, the controlled pH value in some limited ranges are extremely important to achieve optimal deposition rate, phosphorus content as well as solution stability. Basically, nickel electroless plating solution contains of $Ni^{2+}ions$, reducing agent, buffer and complexing agents. The plating processes are normally carried out at $82-92^{\circ}C$. However, the change of its pH values with temperatures does not follow any rule. Thus, the purpose of study is to understand the relationship between pH and temperature of some based solutions and electroless nickel plating solutions. The change of pH with changing temperatures is explained by view of the thermal dynamic and the practical measurements.

• 한국표면공학회지
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• 제26권4호
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• pp.175-182
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• 1993

Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2003년도 춘계학술발표회 초록집
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• pp.80-81
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• 2003

• Tribology and Lubricants
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• 제26권1호
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• pp.68-72
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• 2010

A ceramic coating is a surface treatment method that is being used widely in the industrial field, recently. Ni-P plating is also being used widely because of its corrosion resistance and low cost. An anodizing method is applicable to aluminum alloy. An anodizing method generates a thick oxide layer on the surface and then, that heightens hardness and protects the surface. These surface treatments are applied to various mechanical components and treated surfaces relatively move one another. In this study, tribological characteristics of Ni-P plating and TiAlN coating on anodized Al alloy are compared. The counterpart, anodized Al alloy, is worn out abrasively by Ni-P plating and TiAlN coating that have higher hardness. Abrasively worn debris accumulated on the surfaces of Ni-P plating and TiAlN coating, and then transferred layer is formed. This transferred layer affects the amplitude of variation of friction coefficient, which is related to noise and vibration. The amplitude of variation of friction coefficient of Ni-P plating is lower than those of TiAlN coating during the tests.