• Title/Summary/Keyword: Electroforming process

Search Result 60, Processing Time 0.031 seconds

Preparation of Low-cost and Flexible Metal Mesh Electrode Used in the Hybrid Solar Cell by Simple Electrochemical Depositon (전기화학적 전착에 의한 태양전지용 저가 유연 금속 메쉬 제작)

  • Lee, Ju-Yeol;Lee, Sang-Yeol;Lee, Ju-Yeong;Kim, Man
    • Proceedings of the Korean Institute of Surface Engineering Conference
    • /
    • 2017.05a
    • /
    • pp.123.1-123.1
    • /
    • 2017
  • Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

  • PDF

Study and Fabrication of Transparent Electrode Film by using Thermal-Roll Imprinted Ag Mesh Pattern and Coated Conductive Polymer (열형-롤 각인으로 형성한 Ag 격자 패턴과 전도성 고분자 코팅을 이용한 투명전극 필름 제작에 관한 연구)

  • Yu, Jong-Su;Jo, Jeong-Dai;Yoon, Seong-Man;Kim, Do-Jin
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.27 no.9
    • /
    • pp.11-15
    • /
    • 2010
  • In this study, to fabricate a low-resistance and high optical transparency electrode film, the following steps were performed: the design and manufacture of electroforming stamp, the fabrication of a thermal roll-imprinted polycarbonate (PC) patterned films, the filled low-resistance Ag paste using doctor blade process on patterned PC films and spin coating by conductive polymers. As a result of PC films imprinted line width of $26.69{\pm}2\;{\mu}m$, channel length of $247.57{\pm}2\;{\mu}m$, and pattern depth of $7.54{\pm}0.2\;{\mu}m$. Ag paste to fill part of the patterned film with conductive polymer coating and then the following parameters were obtained: a sheet resistance of $11.1\;{\Omega}/sq$ optical transparency values at a wavelength of 550 nm was 80.31 %.

Micro Metal Powder Injection Molding in the W-Cu System (W-Cu의 마이크로 금속분말사출성형)

  • 김순욱;양주환;박순섭;김영도;문인형
    • Journal of Powder Materials
    • /
    • v.9 no.4
    • /
    • pp.267-272
    • /
    • 2002
  • The production of micro components is one of the leading technologies in the fields of information and communiation, medical and biotechnology, and micro sensor and micro actuator system. Microfabrication (micromachining) techniques such as X-ray lithography, electroforming, micromolding and excimer laser ablation are used for the production of micro components out of silicon, polymer and a limited number of pure metals or binary alloys. However, since the first development of microfabrication technologies there have been demands for the cost-effective replication in large scale series as well as the extended range of available material. One such promising process is micro powder injection molding (PIM), which inherits the advantages of the conventional PIM technology, such as low production cost, shape complexity, applicability to many materials, applicability to many materials, and good tolerance. This paper reports on a fundamental investigation of the application of W-Cu powder to micro metal injection molding (MIM), especially in view of achieving a good filling and a safe removal of a micro mold conducted in the experiment. It is absolutely legitimate and meaningful, at the present state of the technique, to continue developing the micro MIM towards production processes for micro components.

Fabrication and evaluation of label-free protein sensor for diagnosing acute myocardial infarction (급성 심근경색 검지를 위한 비표지식 단백질 센서 제작 및 검증에 관한 연구)

  • Cho, Younggeol;Kang, Ki-Won;Kim, Hyo-Kyum;Cho, Eikhyun;Kang, Shinill
    • Transactions of the Society of Information Storage Systems
    • /
    • v.9 no.1
    • /
    • pp.28-31
    • /
    • 2013
  • We proposed a method to fabricate label-free protein sensor with sub-wavelength nanograting structures to be used for diagnosing acute myocardial infarction. A nickel stamp for the injection molding of nanograting integrated protein sensor was fabricated by electroforming process with high fidelity. By using metallic stamp, we replicated label-free protein sensor via injection molding, which is an outstanding method for low-cost and mass production of polymer products. Finally, we performed a feasibility test, examining cardiac troponin T (cTnT) and anti-cTnT interactions. From the results, we demonstrated that the fabricated protein sensor can provide information for the early and accurate detection of cardiac diseases such as acute myocardial infarction.

Verification on the Configuration Change of Thruster Heat Shield for Satellite Attitude Control through Stress Analysis (구조해석을 이용한 인공위성 자세제어용 추력기 열차폐막의 형상 변경에 대한 타당성 검증)

  • Lee, Kyun-Ho;Kim, Jin-Hee;Han, Cho-Young;Choi, Joon-Min
    • Journal of the Korean Society for Aeronautical & Space Sciences
    • /
    • v.32 no.6
    • /
    • pp.126-133
    • /
    • 2004
  • MRE-1 Dual Thruster Module(DTM), which will be used in KOMPSAT(Korea Multi-Purpose Satellite), can provide reliable and cost-effective means for attitude and maneuvering control system. Thruster heat shield, one of the main components of DTM, is designed to prevent the critical radiative heat exchange between thruster and satellite during firing. To overcome the manufacturing difficulties, a electroforming process is preferred to classical welding process. In this case, an inner diameter of a new shield will be decreased a little due to the change of manufacturing process. Therefore, the interference problem between thruster nozzle and heat shield is investigated through structural analysis and their results are described in this paper.

Replication of Multi-level Microstructures by Microinjection Molding Using Modularized and Sectioned Micromold System (모듈화된 초소형 몰드 시스템(MSMS)을 이용한 다단 마이크로 구조물의 초소형 사출성형 공정)

  • Lee, Bong-Kee;Kwon, Tai-Hun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.34 no.7
    • /
    • pp.859-866
    • /
    • 2010
  • In this study, microinjection molding process using the newly developed micromold system, namely modularized and sectioned micromold system (MSMS), has been carried out for a replication of multi-level microstructures. The present MSMS consisted of several micromold modules, each having cross-sectional microstructures on the top surface. The micromold modules were precisely fabricated by deep X-ray lithography and subsequent nickel electroforming. By assembling the micromold modules, an MSMS having multi-level microstructures, which could be used as a mold system in micromolding processes, was obtained. In this manner, polymeric multi-level microstructures, such as the triangular prism microstructures on a stepped surface, were successfully replicated by the microinjection molding process.

Fabrication of Transparent Electrode Film for Organic Photovoltaic using Ag grid and Conductive Polymer (Ag grid와 전도성 고분자를 이용한 인쇄기반 OPV용 투명전극 형성)

  • Yu, Jongsu;Kim, Jungsu;Yoon, Sungman;Kim, Dongsoo;Kim, Dojin;Jo, Jeongdai
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2011.05a
    • /
    • pp.116.1-116.1
    • /
    • 2011
  • Materials with a combination of high electrical conductivity and optical transparency are important components of many electronic and optoelectronic devices such as liquid crystal displays, solar cells, and light emitting diodes. In this study, to fabricate a low-resistance and high optical transparent electrode film for organic photovoltaic, the following steps were performed: the design and manufacture of an electroforming stamp mold, the fabrication of thermal roll imprinted (TRI) poly-carbonate (PC) patterned films, the manufacture of high-conductivity and low-resistance Ag paste which was filled into patterned PC film using a doctor blade process and then coated with a thin film layer of conductive polymer by a spin coating process. As a result of these imprinting processes the PC films obtained a line width of $10{\pm}0.5{\mu}m$, a channel length of $500{\pm}2{\mu}m$, and a pattern depth of $7.34{\pm}0.5{\mu}m$. After the Ag paste was used to fill part of the patterned film with conductive polymer coating, the following parameters were obtained: a sheet resistance of $9.65{\Omega}$/sq, optical transparency values were 83.69 % at a wavelength of 550 nm.

  • PDF

MATERIAL RELIABILITY OF Ni ALLOY ELECTRODEPOSITION FOR STEAM GENERATOR TUBE REPAIR

  • Kim, Dong-Jin;Kim, Myong-Jin;Kim, Joung-Soo;Kim, Hong-Pyo
    • Nuclear Engineering and Technology
    • /
    • v.39 no.3
    • /
    • pp.231-236
    • /
    • 2007
  • Due to the occasional occurrences of stress corrosion cracking(SCC) in steam generator tubing(Alloy 600), degraded tubes are removed from service by plugging or are repaired for re-use. Since electrodeposition inside a tube does not entail parent tube deformation, residual stress in the tube can be minimized. In this work, tube restoration via electrodeposition inside a steam generator tubing was performed after developing the following: an anode probe to be installed inside a tube, a degreasing condition to remove dirt and grease, an activation condition for surface oxide elimination, a tightly adhered strike layer forming condition between the electro forming layer and the Alloy 600 tube, and the condition for an electroforming layer. The reliability of the electrodeposited material, with a variation of material properties, was evaluated as a function of the electrodeposit position in the vertical direction of a tube using the developed anode. It has been noted that the variation of the material properties along the electrodeposit length was acceptable in a process margin. To improve the reliability of a material property, the causes of the variation occurrence were presumed, and an attempt to minimize the variation has been made. A Ni alloy electrodeposition process is suggested as a primary water stress corrosion cracking(PWSCC) mitigation method for various components, including steam generator tubes. The Ni alloy electrodeposit formed inside a tube by using the installed assembly shows proper material properties as well as an excellent SCC resistance.

Effects of the Changes of Current Density and Additive Concentration on Ni Thin Films in Ni Sulfamate-chloride Electrodeposition Baths (Ni Sulfamate-chloride 전기도금 용액에서 전류밀도와 첨가제의 농도 변화가 Ni 박막에 미치는 영향)

  • Yoon, Pilgeun;Park, Deok-Yong
    • Journal of Surface Science and Engineering
    • /
    • v.51 no.1
    • /
    • pp.62-70
    • /
    • 2018
  • Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress, surface morphology and microstructure of Ni thin films electrodeposited from Ni sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 95%, independent of the changes of current density and saccharin concentration in the baths. Residual stress of Ni thin film was appeared to be the compressive stress modes in the range of $5{\sim}30mA/cm^2$ current density. Maximum compressive stress was observed at the current density of $10mA/cm^2$. Compressive stress values of Ni thin/thick films were increased to be about -85~-100 MPa with increasing saccharin concentration from 0 to 0.0195 M(4 g/L). Surface morphology was changed from smooth to nodule surface appearance with increasing the current density. Smooth surface morphology of Ni thin films electrodeposited from the baths containing saccharin was observed, independent of the saccharin concentration. Ni thin/thick films consist of FCC(111), FCC(200), FCC(220), FCC(311) and FCC(222) peaks. It was revealed that the FCC(200) peak of Ni thin films is the preferred orientation in the range of $5{\sim}30mA/cm^2$ current density. The intensity of FCC(200) peak was gradually decreased and the intensity of FCC(111) peak was increased with increasing saccharin concentration in the baths.

Nano-scale Information Materials Using Organic/Inorganic Templates (유기/무기 나노 템플레이트를 이용한 나노 정보소재 합성 연구)

  • Lee, Jeon-Kook;Jeung, Won-Young
    • Journal of the Korean Magnetics Society
    • /
    • v.14 no.4
    • /
    • pp.149-161
    • /
    • 2004
  • The fusion of nano technology and information technology is essential to sustain the present growth rate and to induce new industry in this ever-growing information age. Considering Korean industry whose competitiveness lies heavily on information related technologies, this field will be inevitable for future. Nano materials can be described as novel materials whose size of elemental structure has been engineered at the nanometer scale. Materials in the nanometer size range exhibit fundamentally new behavior, as their size falls below the critical length scale associated with any given property. " Bottom-up' techniques involve manipulating individual atoms and molecules. Bottom-up process usually implies controlled or directed self assembly of atoms and molecules into nano structures. It resembles more closely the processes of biology and chemistry, where atoms and molecules come together to create structures such as crystals or living cells. Nano scale sensors are included in the electronics area since the diverse sensing mechanisms are often housed on a semiconductor substrate and usually give rise to an electronic signal. The application of nano technology to the chemical sensors should allow improvements in functionality such as gas sensing. In this presentation, we will discuss about the nano scale information materials and devices fabricated by using the organic/inorganic nano templates.