• Journal of Hydrogen and New Energy
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• v.26 no.2
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• pp.184-191
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• 2015

As the power electronics system increases the frequency, the power loss and thermal management are paid more attention. This research presents a real time model of dissipation power with junction temperature response for 120kw IGBT inverter which is applied to the thermal management of high power IGBT inverter. Since the computational time is critical for real time simulation, look-up tables of IGBT module characteristic curve are implemented. The power loss from IGBT provides a clue to calculate the temperature of each module of IGBT. In this study, temperature of each layer in IGBT is predicted by lumped capacitance analysis of layers with convective heat transfer. The power loss and temperature of layers in IGBT is then communicated due to mutual dependence. In the dynamic model, PWM pulses are employed to calculation real time IGBT and diode power loss. Under Matlab/Simulink$^{(R)}$ environment, the dynamic model is validated with experiment. Results showed that the dynamic response of power loss is closely coupled with effective thermal management. The convective heat transfer is enough to achieve proper thermal management under guideline temperature.

• Journal of Applied Reliability
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• v.13 no.2
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• pp.109-116
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• 2013

The solder is any of various fusible alloys, usually tin and lead, used to join metallic parts that provide the contact between the chip package and the printed circuit board. Solder plays an important role of electrical signals to communicate between the two components. In this study, two kinds of Ag-free solder as sample is made to conduct the thermal shock test and the high humidity temperature test. Low resistance is measured to estimate crack size of solder, using daisy chain. The low speed shear test is also performed to analyze strength of solder. The appropriate degradation model is estimated using the result data. Depending on the composition of solder, lifetime estimation is conducted by adopted degradation model. The lifetime estimated two kinds of Ag-free solder is compared with expected lifetime of Sn-Ag-Cu solder. The result is that both Ag-free composition are more reliable than Sn-Ag-Cu solder.

• Journal of Applied Reliability
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• v.8 no.4
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• pp.155-166
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• 2008

PTH cracks are caused by the mismatch of coefficient of thermal expansion(CTE) between polymer and laminated materials, and are one of the main failure mechanisms of multi layer boards. In spite of its importance, it is usually hard to measure or detect them because of its small size and invisibility. To detect PTH cracks more effectively, this paper proposes a theoretical model that can estimate the resistance value from crack size of PTHs. Using four-point probe resistance measurement method, the resistance value of test coupons is measured. Through measured data, we verify the validity of the proposed theoretical model and set up criteria of failure.

• Journal of the Korean Society of Safety
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• v.18 no.1
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• pp.14-18
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• 2003

The structural development of air-water bubble plumes has been measured under different condition on air flow rate in a cylindrical bath. The time-averaged structure of plumes has been measured with an oscilloscope and an electro-conductivity probe. The temperature of bubbles was also obtained by a thermal-infrared camera. Gas volume fraction and bubble frequency were high since bubbles concentrated on the nozzle. In general, their axial and radial values tended to decrease with increasing distance. Bubble temperature reached water temperature within a short time. The present study showed that thermal equilibrium between bubbles and water was completed before bubbles flow became stable.

• Journal of the Korea Institute of Military Science and Technology
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• v.5 no.4
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• pp.19-26
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• 2002

A chamber enduring 3,000 bars and an electrical high voltage power system have been designed and installed for studying the characteristics of the plasma produced in electro-thermal chemical propulsion system. In order to test the structural characteristics, polyethylene injectors were used which have 4 or 6 mm inner diameter and several lengths from 15 to 70 mm. The capacitors were charged at the voltages of 5.2, 7.3 and 10.4 kV which correspond to 5.58, 11 and 22.3 kJ in charging energy. The observed resistivities of the plasma injector are close to those predicted by a theoretical model that describes the plasma resistivity according to high current density.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.2
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• pp.236-242
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• 2003

Thermal bubbles find their diverse application areas in the MEMS (MicroElectroMechanial Systems) technology, including bubble jet printers, microactuators, micropumps, etc.. Especially, microactuators and micropumps, which use a microbubble growing by a controlled heat input, frequently involve mechanical and thermal interaction of the bubble with a solid structure, such as a cantilever beam and a membrane. Although the concept is experimentally verified that an internal pressure of the bubble can build up high enough to deflect a thin solid plate or a beam, the physics of the entire process have not yet been thoroughly explored. This work reports the experimental study of the growth of a thermal bubble while deflecting a thin cantilever beam. A physical model is presented to predict the elastic response of the cantilever beam based on the experimental measurements. The scaling law constructed through this work can provide a design guide for micro- and nano-systems that employ a thermal bubble for their actuation/pumping mechanism.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.61 no.12
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• pp.1886-1891
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• 2012

In this paper, the analytical models for the electrothermal feedback of a ${\mu}$-bolometer focal plane array(FPA) are proposed and applied to the conceptually designed FPA to investigate the electrothermal feedback effect on bolometer FPA signal. The temperature and resistance change of the ${\mu}$-bolometer by the electrothermal feedback(ETF) model are increased upto 20 and 35.7 % of those of no feedback case, respectively, while those by the effective thermal conductance(ETC) model increased 8.5 and 15.1 %. The integration current and output voltage of a CTIA used as an column amplifier of FPA are also increased upto 41.6 and 32.4 % by the ETF model, while increased upto 17.2 and 13.5 % by the ETC model. The proposed models give more accurate temperature change, accordingly larger signal than no feedback considering case. Electrothermal feedback effect should be considered to design a high performance and high density ${\mu}$-bolometer FPA. The proposed models are very useful to investigate the transient thermal analysis, also considered to be useful to predict the responsivity and dynamic range of ${\mu}$-bolometer FPAs.

• Advances in Computational Design
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• v.2 no.2
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• pp.107-119
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• 2017

The Micro circular diaphragm (MCD) is the mechanical actuator part used in the micro electro-mechanical sensors (MEMS) that combine electrical and mechanical components. These actuators are working under harsh mechanical and thermal conditions, so it is very important to study the mechanical and thermal behaviors of these actuators, in order to do with its function successfully. The objective of this paper is to determine the thermo-mechanical behavior of MCD by developing the traditional bulge test technique to achieve the aims of this work. The specimen is first pre-stressed to ensure that is no initial deflection before applied the loads on diaphragm and then clamped between two plates, a differential pressure (P) and temperature ($T_b$) is leading to a deformation of the MCD. Analytical formulation of developed bulge test technique for MCD thermo-mechanical characterization was established with taking in-to account effect of the residual strength from pre-stressed loading. These makes the plane-strain bulge test ideal for studying the mechanical and thermal behavior of diaphragm in both the elastic and plastic regimes. The differential specimen thickness due to bulge effect to describe the mechanical behavior, and the temperature effect on the MCD material properties to study the thermal behavior under deformation were discussed. A finite element model (FEM) can be extended to apply for investigating the reliability of the proposed bulge test of MCD and compare between the FEM results and another one from analytical calculus. The results show that, the good convergence between the finite element model and analytical model.

• Journal of the Korea Society for Simulation
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• v.23 no.2
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• pp.17-24
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• 2014

This study attempts to show an example of developing and applying thermal hydraulic simulation model for Aircraft-EHA. The overview of research procedure is as in the following. First, The unit hydraulic simulation model, which reflects physical quantity answering engineer's purpose is developed. Second, The unit hydraulic simulation model is combined, and then branched out to EHA hydraulic model. Third, a simulation model including flow thermal is developed, and then oil temperature rise time according to 'initial temperature and load' is examined. Finally, the master graph that can be used for designing EHA combined with thermal hydraulic analysis results in several cases is compiled, and suggested. AMESim, commercial software, is used through whole procedure.

• 제어로봇시스템학회:학술대회논문집
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• 1994.10a
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• pp.587-592
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• 1994

To realize artificial device with sensing ability of the human skin, a mono-material tactile sensor with three sensing functions made of some elastic thin electro-conductive rubber sheet with eight latticed patch elements is proposed. This trial sensor provides the information of three kinds of model material characteristics such as thermal property, hardness property and the surface situation of materials by setting up three kinds of surface models as test materials. It can be finally expected to estimate unknown model materials by analyzing the data of the sensor.