• 제목/요약/키워드: Electro-thermal annealing

검색결과 25건 처리시간 0.032초

Modulation of Defect States in Co- and Fe-implanted Silicon by Rapid Thermal Annealing

  • Lee, Dong-Uk;Lee, Kyoung-Su;Pak, Sang-Woo;Suh, Joo-Young;Kim, Eun-Kyu;Lee, Jae-Sang
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.314-314
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    • 2012
  • The dilute magnetic semiconductors (DMS) have been developed to multi-functional electro-magnetic devices. Specially, the Si based DMS formed by ion implantation have strong advantages to improve magnetic properties because of the controllable effects of carrier concentration on ferromagnetism. In this study, we investigated the deep level states of Fe- and Co-ions implanted Si wafer during rapid thermal annealing (RTA) process. The p-type Si (100) wafers with hole concentration of $1{\times}10^{16}cm^{-3}$ were uniformly implanted by Fe and Co ions at a dose of $1{\times}10^{16}cm^{-2}$ with an energy of 60 keV. After RTA process at temperature ranges of $500{\sim}900^{\circ}C$ for 5 min in nitrogen ambient, the Au electrodes with thickness of 100 nm were deposited to fabricate a Schottky contact by thermal evaporator. The surface morphology, the crystal structure, and the defect state for Fe- and Co- ion implanted p-type Si wafers were investigated by an atomic force microscopy, a x-ray diffraction, and a deep level transient spectroscopy, respectively. Finally, we will discuss the physical relationship between the electrical properties and the variation of defect states for Fe- and Co-ions implanted Si wafer after RTA.

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Fabrication of a polymerase chain reaction micro-reactor using infrared heating

  • Im, Ki-Sik;Eun, Duk-Soo;Kong, Seong-Ho;Shin, Jang-Kyoo;Lee, Jong-Hyun
    • 센서학회지
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    • 제14권5호
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    • pp.337-342
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    • 2005
  • A silicon-based micro-reactor to amplify small amount of deoxyribonucleic acid (DNA) has been fabricated using micro-electro-mechanical systems (MEMS) technology. Polymerase chain reaction (PCR) of DNA requires a precise and rapid temperature control. A Pt sensor is integrated directly in the chamber for real-time temperature measurement and an infrared lamp is used as external heating source for non-contact and rapid heating. In addition to the real-time temperature sensing, PCR needs a rapid thermocycling for effective PCR. For a fast thermal response, the thermal mass of the reactor chamber is minimized by removal of bulk silicon volume around the reactor using double-side KOH etching. The transparent optical property of silicon in the infrared wavelength range provides an efficient absorption of thermal energy into the reacting sample without being absorbed by silicon reactor chamber. It is confirmed that the fabricated micro-reactor could be heated up in less than 30 sec to the denaturation temperature by the external infrared lamp and cooled down in 30 sec to the annealing temperature by passive cooling.

Liquid Crystal Aligning Capabilities for Nematic Liquid Crystal on the ZrOx Thin Film Layer with E-beam Evaporation

  • Kim, Mi-Jung;Han, Jin-Woo;Kim, Young-Hwan;Kim, Byoung-Yong;Han, Jeong-Min;Moon, Hyun-Chan;Park, Kwang-Bum;Seo, Dae-Shik
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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    • pp.378-378
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    • 2007
  • In this study, liquid crystal (LC) aligning capabilities for homeotropic alignment on the $ZrO_x$ thin film by electron beam evaporation method were investigated. Also, the control of pretilt angles and thermal stabilities of the NLC treated on $ZrO_x$ thin film were investigated. The uniform LC alignment on the $ZrO_x$ thin film surfaces and good thermal stabilities with electron beam evaporation can be achieved. It is considerated that the LC alignment on the $ZrO_x$ thin film by electron beam evaporation is attributed to elastic interaction between LC molecules and micro-grooves at the $ZrO_x$ thin film surface created by evaporation. In addition, it can be achieved the good electro-optical (EO) properties of the VA-LCD on $ZrO_x$ thin film layer with. oblique electron beam evaporation.

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Electrical and Mechanical Properties of Indium-tin-oxide Films Deposited on Polymer Substrate Using Organic Buffer Layer

  • Han, Jeong-In;Lee, Chan-Jae;Rark, Sung-Kyu;Kim, Won-Keun;Kwak, Min-GI
    • Journal of Information Display
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    • 제2권2호
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    • pp.52-60
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    • 2001
  • The electrical and mechanical properties in indium-tin-oxide films deposited on polymer substrate were examined. The materials of substrates were polyethersulfone (PES) which have gas barrier layer and anti-glare coating for plastic-based devices. The experiments were performed by rf-magnetron sputtering using a special instrument and buffer layers. Therefore, we obtained a very flat polymer substrate deposited ITO film and investigated the effects of buffer layers, and the instrument. Moreover, the influences of an oxygen partial pressure and post-deposition annealing in ITO films deposited on polymer substrates were clarified. X-ray diffraction observation, measurement of electrical property, and optical microscope observation were performed for the investigation of micro-structure and electro-mechanical properties, and they indicated that as-deposited ITO thin films are amorphous and become quasi-crystalline after adjusting oxygen partial pressure and thermal annealing above $180^{\circ}C$. As a result, we obtained 20-25 ${\Omega}/sq$ of ITO films with good transmittance (above 80 %) of oxygen contents with under 0.2 % and vacuum annealing. Furthermore, using organic buffer layer, we obtained ITO films which have a rather high electrical resistance (40-45 ${\Omega}/sq$) but have improved optical (more than 85 %) and mechanical characteristics compared to the counterparts. Consequently, a prototype reflective color plastic film LCD was fabricated using the PES polymer substrates to confirm whether the ITO films could be realized in accordance with our experimental results.

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Liquid crystal aligning capabilities for vertical aligned NLC on the $CeO_x$ thin film layer with thermal evaporation

  • Han, Jin-Woo;Kim, Mi-Jung;Kim, Jong-Yeon;Han, Jeong-Min;Kim, Young-Hwan;Kim, Jong-Hwan;Kim, Byoung-Yong;Seo, Dae-Shik
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.371-371
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    • 2007
  • In this study, liquid crystal (LC) aligning capabilities for vertical alignment on the $CeO_x$ thin film by thermal evaporation method were investigated. Also, the control of pretilt angles and thermal stabilities of the NLC treated on $CeO_x$ thin film were investgated. The uniform LC alignment on the $CeO_x$ thin film surfaces and good thermal stabilities with thermal evaporation can be achieved. It is considerated that the LC alignment on the $CeO_x$ thin film by thermal evaporation is attributed to elastic interaction between LC molecules and micro-grooves at the $CeO_x$ thin film surface created by evaporation. In addition, it can be achieved the good electro-optical (EO) properties of the VA-LCD on $CeO_x$ thin film layer with oblique thermal evaporation.

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급속열처리를 통한 알루미나 나노템플릿의 기공 균일도 개선에 관한 연구 (A Study on Improved Pore Uniformity of Nano Template Using the Rapid Thermal Processor)

  • 김동희;김진광;권오대;양계준;이재형;임동건
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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    • pp.637-638
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    • 2005
  • AAO templates were fabricated using a two-step anodization process with pretreatment such as electro polishing and annealing. To reduce process time and get well-aligned pore array, rapid thermal processor by an halogen lamp was employed in vacuum state at $500^{\circ}C$ for various time. The pore array of AAO template annealed at $500^{\circ}C$ for 2 h is comparable to a template annealed in conventional furnace at $500^{\circ}C$ for 30 h. The well-fabricated AAO template has the mean pore diameter of 70 nm, the barrierlayer thickness of 25 nm, and the pore depth of $9{\mu}m$. And the pore density can be as high as $2.0\times10^{10}cm^{-2}$.

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Low-temperature crystallization of high-dielectric (Ba,Sr)$TiO_3$ thin films for embedded capacitors

  • Cho, Kwang-Hwan;Kang, Min-Gyu;Kang, Chong-Yun;Yoon, Seok-Jin
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 춘계학술회의 초록집
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    • pp.21-21
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    • 2010
  • (Ba,Sr)$TiO_3$ (BST) thin film with a perovskite structure has potential for the practical application in various functional devices such as nonvolatile-memory components, capacitor, gate insulator of thin-film transistors, and electro-optic devices for display. Normally, the BST thin films derived from sol-gel and sputtering are amorphous or partially crystalline when processed below $600^{\circ}C$. For the purpose of integrating BST thin film directly into a Si-based read-out integrated circuit (ROIC), it is necessary to process the BST film below $400^{\circ}C$. The microstructural and electrical properties of low-temperature crystallized BST film were studied. The BST thin films have been fabricated at $350^{\circ}C$ by UV-assisted rapidly thermal annealing (RTA). The BST films are in a single perovskite phase and have well-defined electrical properties such as high dielectric constant, low dielectric loss, low leakage current density, and high breakdown voltage. Photoexcitation of the organics contained in the sol-gel-derived films by high-intensity UV irradiation facilitates elimination of the organics and formation of the single-crystalline phase films at low temperatures. The amorphous BST thin film was transformed to a highly (h00)-oriented perovskite structure by high oxygen pressure processing (HOPP) at as low as $350^{\circ}C$. The dielectric properties of BST film were comparable to (or even better than) those of the conventionally processed BST films prepared by sputtering or post-annealing at temperature above $600^{\circ}C$. When external pressure was applied to the well-known contractive BST system during annealing, the nucleation energy barrier was reduced; correspondingly, the crystallization temperature decreased. The UV-assisted RTA and HOPP, as compatible with existing MOS technology, let the BST films be integrated into radio-frequency circuit and mixed-signal integrated circuit below the critical temperature of $400^{\circ}C$.

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RTA 후 FA 공정을 포함한 $P^{+}$-n 박막 접합 특성 (Characteristics of Shallow $P^{+}$-n Junctions Including the FA Process after RTA)

  • 한명석;김재영;이충근;홍신남
    • 대한전자공학회논문지SD
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    • 제39권5호
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    • pp.16-22
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    • 2002
  • 본 논문에서는 선비정질화 이온주입과 BPSG(boro-phosphosilicate glass)를 위한 FA(furnace anneal) 공정이 적용된 양질의 p/sup +/-n 박막 접합을 형성하는 공정 조건을 제시하였다. 단결정 실리콘 기판을 As과 Ge 이온으로 45keV와 3×10/sup 14/cm/sup -2/로 주입하여 선비정질화 하였으며, p형 이온으로는 BF₂ 이온을 20keV, 2×10/sup 15/cm/sup -2/로 주입하였다. 고온 열처리는 furnace와 급속 열처기로 수행하였으며, 급속 열처리 온도는 950∼1050℃이며 FA는 BPSG 공정을 위해 850℃/4O분간 수행하였다. 박막 접합의 특성을 고려하기 위해 접합깊이, 면저항 및 다이오드 누설 전류를 측정 ·분석하였다. Ge 이온으로 선비정질화 하였을 경우 As 이온보다 대부분의 접합 특성에서 우수한 결과를 나타내었다. Ge으로 선비정질화하고 1000℃의 RTA를 수행한 경우에 가장 양호한 특성을 나타내었으며, FA를 포함한 경우에는 RTA 1050℃+FA의 열처리 조건에서 Ge 이온으로 선비정질화 했을 때 면저항과 접합깊이의 곱 및 누설 전류에서 양호한 특성을 나타내었다.

열처리된 탄소나노튜브 상대전극의 전기화학적 특성 연구 (Electrochemical properties of heat-treated multi-walled carbon nanotubes)

  • 이수경;문준희;황숙현;김금채;이동윤;김도현;전민현
    • 한국진공학회지
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    • 제17권1호
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    • pp.67-72
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    • 2008
  • 본 연구에서는 염료감응 태양전지의 상대전극으로써 다중벽 탄소나노튜브를 사용하여 전기화학적 특성에 미치는 열처리 효과에 대해 연구하였다. 다중벽 탄소나노튜브는 실리콘 기판위에 철 촉매를 사용하여 열화학 기상증착법으로 합성하였다. 직경이 다른 다중벽 탄소나노튜브를 각각 성장하여 두 개의 샘플을 준비하였고 질소 분위기의 RTA(rapid thermal annealing) system에서 $900^{\circ}C$ 온도로 1분간 열처리 하였다. 다중벽 탄소나노튜브의 구조적, 전기적, 전기화학적 특성은 FE-SEM, Raman spectroscopy, 2-point probe station, electrochemical impedance spectroscopy (EIS)을 이용하여 측정하였다. 라만 스펙트럼 분석에서 열처리 한 다중벽 탄소나노튜브의 I(D)/I(G) ratio는 상당히 감소한 것을 확인하였으며, 다중벽 탄소나 노튜브 표면과 전해질과의 산화 환원 반응 특성에서는 열처리 전보다 열처리 후의 전해질과의 산화 환원 반응 특성이 향상된 것을 알 수 있었다. 표면에서의 반응 저항 또한 열처리 후의 다중벽 탄소나노튜브가 더 낮은 값을 나타내었다. 그 결과, 열처리 후의 다중벽 탄소나노튜브를 상대전극으로 사용하였을 때의 전기화학적 특성이 더 좋은 것을 확인하였다.