• Title/Summary/Keyword: Electrically Assisted Solid State Joining

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A Study on Electrically Assisted Solid State Joining of Aluminum and Copper (알루미늄과 구리 간 통전고상접합 연구)

  • Park, J.W.;Choi, H.;Lee, S.;Jeong, H.J.;Hong, S.T.;Han, H.N.
    • Transactions of Materials Processing
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    • v.29 no.1
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    • pp.49-54
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    • 2020
  • The influence of electric current on the joining properties of aluminum and copper was investigated. Various pulsed electric current conditions were set to the joining specimens followed by pressure. The shear strength of the joint area between aluminum and copper was measured by the lab shear test. In addition, the microstructures of the joint area were observed through a field emission scanning electron microscope, energy dispersive X-ray, and electron backscatter diffraction. The mechanical properties of each phase in the joint region were measured by nano-indentation. As a result, it was confirmed that electrically assisted solid state joining of copper and aluminum could be applied in various industrial fields.

Study on Electrically Assisted Pressure Solid State Joining Between Aluminum Alloys (통전압접을 활용한 알루미늄 소재 간 고상접합에 관한 연구)

  • Choi, H.;Lee, S.;Kim, Y.;Hong, S.T;Han, H.N.
    • Transactions of Materials Processing
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    • v.31 no.6
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    • pp.337-343
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    • 2022
  • Electrically assisted pressure joining (EAPJ) utilizes electric current-induced kinetic enhancement to achieve solid state diffusion bonding within a short time. In this study, aluminum alloy specimens, which are known as a hard-to-weld metal, were successfully solid-state joined through EAPJ. The bonding process was performed in two ways: continuous direct current (CDC), which applies relatively low current density, and pulsed direct current (PDC), which applies high current density. It was observed that the bonding strength was higher in PDC than in CDC. The microstructure of the joint was characterized using 3D X-ray microscopy (XRM) and electron backscatter diffraction (EBSD).