• 한국컴퓨터산업학회논문지
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• 제2권12호
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• pp.1533-1540
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• 2001

본 논문에서는 PCB 설계에서 전기적 파라미터 추출과 기판의 전기적 모델링 방법을 기술하였다. 실제 PCB 구조에서 전기적 특성을 해석하기 위해 캐시메모리 시스템을 예로하여 6층의 기판을 설계하였다. 설계된 PCB 기판에서 배선 구조 및 비아, BGA Ball 등 기본회로 요소 구조를 설정하여, 전기적 변수를 추출하였고 이를 재결합하여 PCB 네트를 모델링하였다. 이후 SPICE, XNS 등의 분석 도구를 사용하여 전기적 특성을 분석하였다. 그 결과 최대 2.6ns정도의 신호지연과 최대 281mV의 간섭잡음으로 시스템의 사양에 적합함을 알 수 있었다.

• 한국전기전자재료학회논문지
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• 제23권1호
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• pp.29-33
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• 2010

As the demands for the higher data transmission speed and capacity as well as integration density grow throughout the network, much works have being done in order to integrate the Electrical PCB with Optical PCB. However, one of the most troublesome problems in the commercial bonding process is to need the high temperature for the bonding. Due to the high temperature bonding process, lots of side problems are followed such as warpage and crack, etc. In this paper, we tried to develop the new bonding technology with low temperature around $100^{\circ}C$. As a result of this study, the PCB bonding technology with high bonding strength is demonstrated with the value of bonding strength from 7 to 8 MPa at the temperature of $100^{\circ}C$.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.150-152
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• 2004

The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

• Transactions on Electrical and Electronic Materials
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• 제9권1호
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• pp.33-37
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• 2008

This paper describes the development of a new $5.0{\times}3.2mm$ SAW filter bank which is consist of 12 L, C matching components and 4 SAW bare chips on PCB substrate with CSP technology. We improved the manufacturing cost by removing the ceramic package through direct flip bonding of $LiTaO_3$ SAW bare chip on PCB board after mounting L, C passive element on PCB board. After that we realized the hermitic sealing by laminating the epoxy film. To confirm the confidentiality and durability of the above method, we have obtained the optimum flip bonding & film laminating condition, and figured out material property and structure to secure the durability & moisture proof of PCB board. The newly developed super mini $5.0{\times}3.2mm$ filter bank shows the superior features than those of existing products in confidence, electrical, mechanical characters.

• 전력전자학회논문지
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• 제25권3호
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• pp.162-170
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• 2020

In this paper, we report our study of the current measuring technique by implementing a pick-up coil in the PCB pattern instead of the current measuring sensor in a power converter using a WBG device. The proposed PCB pattern coil structure has a higher mutual inductance value than the conventional pattern by constructing the coil using the multi layer board. It has high sensitivity and is configured without additional process outside the PCB. In the current measurement, the integrator is measured by integrating the coil at the back end and the current waveform measured using proposed pick-up coil is confirmed by comparing it with the original current waveform through DPT simulation.

• E2M - 전기 전자와 첨단 소재
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• 제10권9호
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• pp.952-959
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• 1997

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.297-298
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• 2009

대부분의 반도체 소자의 고장 원인은 85%정도가 열로 인한 것이며, 고출력 LED는 인가된 에너지의 20%정도의 광으로 출력되며 나머지 80%가 열로 전환된다. 본 논문에서는 PMS-50과 KEITHLEY 2430을 이용하여 PCB 구조와 Via hole 구성에 따른 LED 패키지의 열적 광학적 특성을 분석하였다. 0.6mm의 Via hole을 가진 FR4 PCB의 열특성이 가장 우수하였으며, Via hole 0.6mm FR4 PCB의 경우 McPCB에 상응하는 광출력 특성을 보였다.

• ETRI Journal
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• 제46권4호
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• pp.581-594
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• 2024

In this study, a planar printed circuit board (PCB) coil with FR4 substrate was designed and simulated using the finite element method, and the results were analyzed in the frequency domain. This coil can be used in wireless power transfer (WPT) as a transmitter or receiver, eliminating wires. It can also be used as the receiver in radio frequency energy-harvesting (RF-EH) systems by optimizing the planar PCB coil to convert radio-wave energy into electricity, and it can be employed as an excitation (transmitter) or receiver coil in nuclear magnetic resonance (NMR) spectroscopy. This PCB coil can replace the conventional coil, yielding a reduced occupied volume, a fine-tuned design, reduced weight, and increased efficiency. Based on the calculated gain, power, and electromagnetic and electric field results, this planar PCB coil can be implemented in WPT, NMR spectroscopy, and RF-EH devices with minor changes. In applications such as NMR spectroscopy, it can be used as a transceiver planar PCB coil. In this design, at frequencies of 915 MHz and 40 MHz with 5 mm between coils, we received powers of 287.3 μW and 480 μW, respectively, which are suitable for an NMR coil or RF-EH system.

• Journal of Microbiology and Biotechnology
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• 제13권4호
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• pp.495-500
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• 2003

Tight junctions (TJ) between adjacent Sertoli cells in testis are important for the formation of the blood testis barrier (BTB). In an effort to verify the reproductive health risk of endocrine-active chemicals (EACs), changes in the transepithelial electrical resistance (TER) and the expression of TJ genes were examined by co-planar polychlorinated biphenyl (PCB) treatment in cultured mouse Sertoli cells. Although the increase in TER of Sertoli cells was accelerated by 10 nM co-planar PCB, it was downregulated by 100 nM co-planar PCB. The expression of claudin-1 was downregulated by co-planar PCB in a concentration-dependent manner. On the contrary, the expression of claudin-1 was increased in the Sertoli cells by 10 nM co-planar PCB treatment. These results suggest that the structure and function of TJ may be targeted by co-planar PCB in Sertoli cells. Assessment of the structure and function of TJ in Sertoli cells might be useful for screening the reproductive health risk of EACs.

• 전기전자학회논문지
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• 제11권4호
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• pp.252-256
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• 2007

We demonstrate that the effect of the PCB ground length and the cover is important in the performance of 2.4 GHz patch antennas. The Center frequency in the return loss shifts as much as 0.5 GHz, when the length of the PCB ground increases from 30 to 85 mm. The position of 10-dB bandwidth accordingly shifts to lower frequency region. Finally, the resonance at 2.4 GHz becomes stronger when the top cover exists. The radiation pattern of the patch antenna is also strongly affected by the ground structure and the existence of the top cover. In both the return loss and the radiation pattern, 3-dimensional simulations are shown to be an efficient tool.