• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1845-1850
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• 2003

The underground utility tunnels are important facility as a mainstay of country because of communication developments. The communication and electrical duct banks as well as various utility lines for urban life are installed in the underground utility tunnel systems. If a fire breaks out in this life-line tunnel, the function of the city will be discontinued and the huge damages are occurred. In order to improve the safety of life-line tunnel systems and the fire detection, the behaviors of the fire-induced smoke flow and temperature distribution are investigated. In this study we assumed that the fire is occurred at the contact or connection points of cable. Numerical calculations are carried out using different velocity of ventilation in utility tunnel. The fire source is modeled as a volumetric heat source. Three-dimensional flow and thermal characteristics in the underground tunnel are solved by means of FVM (Finite Volume Method) using SIMPLE algorithm and standard ${\kappa}-{\varepsilon}$ model for Reynolds stress terms. The numerical results of the fire-induced flow characteristics in an underground utility tunnel with different velocity of ventilation are graphically prepared and discussed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.402-409
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• 2013

An innovative application of voltage-contrast (VC) inspection allowed inline detection of NMOS leakage in dense SRAM cells is presented. Cell sizes of SRAM are continual to do the shrinkage with bit density promotion as semiconductor technology advanced, but the resulting challenges include not only development of smaller-scale devices, but also intra-devices isolation. The NMOS leakage caused by the underneath n+/P-well shorted to the adjacent PMOS/N-well was inspected by the proposed electron-beam (e-beam) scan in which VC images were compared during the in-line process step of post contact tungsten (W) CMP (Chemical Mechanical Planarization) instead of end-of-line electrical test, which has a long response time. A series of experiments based on the mechanism for improving the intra-well isolation was performed and verified by the inline VC inspection. An optimal process-integration condition involved to the tradeoff between the implant dosage and photo CD was carried out.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.11-18
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• 2016

Today, wearable technology products are used in a wide range of consumer, healthcare, bio-medical, and industrial applications. The market for wearable technology products is expected to increase dramatically over the next several years. In addition, concerns for safety, performance and reliability of wearable products keep increasing and will be essential for widespread acceptance in the marketplace. Wearable smart devices, which are generally in contact with the human body and skin, are exposed to the risk of the electric shock, burn, and explosion. Therefore, the standardization of wearable devices in terms of human safety and reliability should be very important. Furthermore, the development of test method and test certification of the wearable products will be one of the key technology for mass production. Such standardization and certification will help consumers to choose the safest and best quality wearable devices and allow manufacturers to prove the safety and quality of their products, thereby helping them to gain a competitive technology. This paper discusses the current status of the wearable smart devices as well as the standardization and test certification applicable to wearable technology products.

• Bulletin of the Korean Chemical Society
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• v.35 no.8
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• pp.2471-2476
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• 2014

The aim of the present study is to explore the possibility of utilizing loess for the adsorption of total phosphorous (T-P) and total nitrogen (T-N) in water. Batch adsorption studies were performed to evaluate the influences of various factors like initial concentration, contact time and temperature on the adsorption of T-P and T-N. The adsorption data showed that loess is not effective for the adsorption of T-N. However, loess exhibited much higher adsorption capacity for T-P. At concentration of $1.0mgL^{-1}$, approximately 97% of T-P adsorption was achieved by loess. The equilibrium data were fitted well to the Langmuir isotherm model. The pseudo-second-order kinetic model appeared to be the better-fitting model because it has higher $R^2$ compared with the pseudo-first-order and intra-particle kinetic model. The theoretical adsorption equilibrium $q_{e,cal}$ from pseudo-second-order kinetic model was relatively similar to the experimental adsorption equilibrium $q_{e,exp}$. The thermodynamic parameters such as free energy ${\Delta}G$, the enthalpy ${\Delta}H$ and the entropy ${\Delta}S$ were also calculated.

• Journal of Magnetics
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• v.20 no.4
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• pp.394-399
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• 2015

Electromagnetic Induction Launchers (EIL) have been receiving great attention due to their advantages of non-contact between the coils and a projectile. This paper describes the modeling and design of 3-stage EIL to accelerate a copper projectile of 50 kg with 290 mm diameter. Our EIL consists of three independent driving coils and pulsed power modules to generate separate driving currents. To find efficient acceleration conditions, the appropriate shape of the driving coils and the position of the projectile have been calculated by using a finite element analysis (FEA) method. The results showed that the projectile can be accelerated more effectively as the gap between the coils is smaller; a final velocity of 45 m/s was obtained. The acceleration efficiency was estimated to be 23.4% when a total electrical energy of 216 kJ was discharged.

• Journal of Sensor Science and Technology
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• v.23 no.1
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• pp.7-14
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• 2014

Noncontact electrocardiogram (ECG) measurement using capacitive-coupled technique is a very reliable long-term noninvasive health-care remote monitoring system. It can be used continuously without interrupting the daily activities of the user and is one of the most promising developments in health-care technology. However, ECG signal is a very small electric signal. A robust system is needed to separate the clean ECG signal from noise in the measurement environment. Noise may come from many sources around the system, for example, bad contact between the sensor and body, common-mode electrical noise, movement artifacts, and triboelectric effect. Thus, in this paper, the extended Kalman filter (EKF) is applied to denoise a real-time ECG signal in capacitive-coupled sensors. The ECG signal becomes highly stable and noise-free by combining the common analog signal processing and the digital EKF in the processing step. Furthermore, to achieve ubiquitous monitoring, android-based application is developed to process the heart rate in a realtime ECG measurement.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.103-105
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• 2003

COG (Chip on Glass) technology using solder bump reflow has been investigated to attach IC chip directly on glass substrate of LCD panel. As It chip and LCD panel have to be heated to reflow temperature of the so]der bumps for COG bonding, it is necessary to use low-temperature solders to prevent the damage of liquid crystals of LCD panel. In this study, using the Sn-52In solder bumps of $40{\mu}m$ pitch size, solder joints between Si chip and glass substrate were made at temperature below $150^{\circ}C$. The contact resistance of the solder joint was $8.58m\Omega$, which was much lower than that of the joint made using the conventional ACF bonding technique. The Sn-52In solder joints with underfill showed excellent reliability at a hot humid environment.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.168-171
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• 2005

In this paper, disk-type ultrasonic motor using a combination of radial and bending vibration modes is newly designed and fabricated. The characteristics of the test motor are also measured. By means of traveling elastic wave induced at the surface of circumference of the elastic disk, a steel bar in contact with the surface of circumferenceof elastic disk bonded onto the piezoelectric ceramic disks is driven in both directions by changing the sine and cosine voltage inputs. The stator of the motor is composed of two sheets of piezoelectric ceramic disk to bond onto both surfaces of a elastic disk, respectively. As the results, the diameter of elastic body is increased, the resonant frequency is decreased. The resonant frequency of the stator is about 92 kHz, which is composed with piezoelectric ceramic disks of 28 mm in diameter and 2 mm in thickness, and an elastic body of 32 mm in diameter and 2 mm in thickness. A driving voltage of 20 Vpp produces 200 rpm with a torque of 1Nm and an efficiency of about 10 %.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1988-1990
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• 1996

In this work, we have grown or evaporated thermal oxide and E-beam oxide on the (100) oriented n-type silicon wafers, respectively and they were directly bonded with another silicon wafer after hydrophilization using solutions of three types of $HNO_3$, $H_{2}SO_{4}$ and $NH_{4}OH$. Changes of average surface roughness after hydrophilizations of the single crystalline silicon wafer, thermal oxide and E-beam evaporated silicon oxide were studied using atomic force microscope. Bonding interfaces of the bonded pairs were inspected using scanning electron microscope. Void and non-contact area of the bonded pairs were also inspected using infrared transmission microscope.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.348-351
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• 1995

A modified silicon direct bonding method has been developed alloying an intimate contact between grooved and smooth mirror-polished oxide-free silicon wafers. A regular set of grooves was formed during preparation of heavily doped $p^+$-type grid network by oxide-masking und boron diffusion. Void-free bonded interfaces with filing of the grooves were observed by x-ray diffraction topography, infrared, optical. and scanning electron microscope techniques. The presence of regularly formed grooves in bending plane results in the substantial decrease of dislocation over large areas near the interface. Moreover two strongly misoriented waters could be successfully bonded by new technique. Diodes with bonded a pn-junction yielded a value of the ideality factor n about 1.5 and the uniform distribution of series resistance over the whole area of horded pn-structure. The suitability of the modified technique was confirmed by I - V characteristics of power diodes and reversly switched-on dynistor(RSD) with a working area about $12cm^2$. Both devices demonstrated breakdown voltages close to the calculation values.