• Title/Summary/Keyword: Electrical Contact

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Junction Capacitance Dependence of Response Time for Magnetic Tunnel Junction (터널링 자기저항 소자의 접합면 정전용량에 따른 전기적 응답특성)

  • Park, S.Y.;Choi, Y.B.;Jo, S.C.
    • Journal of the Korean Magnetics Society
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    • v.12 no.2
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    • pp.68-72
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    • 2002
  • In this research, the effects of capacitance to the access time were studied at the junction area of tunneling magnetoresistance when these were used as memory devices. These results were obtained by applying electric signal input and magnetic field was not used. We applied bipolar square waves of 1MHz to the MTJ samples to obtain the results and time constant ($\tau$) calculated by observing wave responses utilizing an oscilloscope. And time constant was compared with junction area. Each part of MTJ sample, such as electrical pad, lead and contact area, was modeled as an electrical equivalent circuit based on experimental results. For the 200㎛$\times$200㎛ cell, junction capacitance was 90 pF. Also, measurement and simulation results were compared, which showed those similarity.

Fabrication Of Ultraviolet LED Light Source Module Of Current Limiting Diode Circuit By Using Flip Chip Micro Soldering (마이크로솔더링을 이용한 정전류다이오드 회로 자외선 LED 광원모듈 제작)

  • Park, Jong-Min;Yu, Soon Jae;Kawan, Anil
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.29 no.4
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    • pp.237-240
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    • 2016
  • The improvement of irradiation intensity and irradiation uniformity is essential for large area and high power UVA light source application. In this study, large number of chips bonded by micro soldering technique were driven by low current, and current limiting diodes were configured to supply constant current to parallel circuits consisting of large number of series strings. The dimension of light source module circuit board was $350{\times}90mm^2$ and 16,650 numbers of 385 nm flip chip LEDs were used with a configuration of 90 parallel and 185 series strings. The space between LEDs in parallel and series strings were maintained at 1.9 mm and 1.0 mm distance, respectively. The size of the flip chip was $750{\times}750{\mu}m^2$ were used with contact pads of $260{\times}669{\mu}m^2$ size, and SAC (96.5 Sn/3.0 Ag/0.5 Cu) solder was used for flip chip bonding. The fabricated light source module with 7.5 m A supply current showed temperature rise of $66^{\circ}C$, whereas irradiation was measured to be $300mW/cm^2$. Inaddition, 0.23% variation of the constant current in each series string was demonstrated.

Local oxidation of 4H-SiC using an atomic force microscopy (Atomic Force Microscopy을 이용한 4H-SiC의 Local Oxidation)

  • Jo, Yeong-Deuk;Bahng, Wook;Kim, Sang-Cheol;Kim, Nam-Kyun;Koo, Sang-Mo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.04b
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    • pp.79-80
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    • 2009
  • The local oxidation using an atomic force microscopy (AFM) is useful for Si-base fabrication of nanoscale structures and devices. SiC is a wide band-gap material that has advantages such as high-power, high-temperature and high-frequency in applications, and among several SiC poly types, 4H-SiC is the most attractive poly type due to the high electron mobility. However, the AFM local oxidation of 4H-SiC for fabrication is still difficult, mainly due to the physical hardness and chemical inactivity of SiC. In this paper, we investigated the local oxidation of 4H-SiC surface using an AFM. We fabricated oxide patterns using a contact mode AFM with a Pt/Ir-coated Si tip (N-type, $0.01{\sim}0.025\;{\Omega}cm$) at room temperature, and the relative humidity ranged from 40 to 50%. The height of the fabricated oxide pattern ($1{\sim}3\;nm$) on SiC is similar to that of typically obtained on Si ($10^{15}{\sim}10^{17}\;cm^{-3}$). We perform the 2-D simulation to further analyze the electric field between the tip and the surface. Whereas the simulated electric field on Si surface is constant ($5\;{\times}\;10^7\;V/m$), the electric field on SiC surface increases with increasing the doping concentration from ${\sim}10^{15}$ to ${\sim}10^{17}\;cm^{-3}$. We demonstrated that a specific electric field ($4\;{\times}\;10^7\;V/m$) and a doping concentration (${\sim}10^{17}\;cm^{-3}$) is sufficient to switch on/off the growth of the local oxide on SiC.

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A 3-D Steady-State Analysis of Thermal Behavior in EHV GIS Busbar

  • Lei, Jin;Zhong, Jian-ying;Wu, Shi-jin;Wang, Zhen;Guo, Yu-jing;Qin, Xin-yan
    • Journal of Electrical Engineering and Technology
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    • v.11 no.3
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    • pp.781-789
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    • 2016
  • Busbar has been used as electric conductor within extra high voltage (EHV) gas insulated switchgear (GIS), which makes EHV GIS higher security, smaller size and lower cost. However, the main fault of GIS is overheating of busbar connection parts, circuit breaker and isolating switch contact parts, which has been already restricting development of GIS to a large extent. In this study, a coupled magneto-flow-thermal analysis is used to investigate the thermal properties of GIS busbar in steady-state. A three-dimensional (3-D) finite element model (FEM) is built to calculate multiphysics fields including electromagnetic field, flow field and thermal field in steady-state. The influences of current on the magnetic flux density, flow velocity and heat distribution has been investigated. Temperature differences of inner wall and outer wall are investigated for busbar tank and conducting rod. Considering the end effect in the busbar, temperature rise difference is compared between end sections and the middle section. In order to obtain better heat dissipation effect, diameters of conductor and tank are optimized based on temperature rise simulation results. Temperature rise tests have been done to validate the 3-D simulation model, which is observed a good correlation with the simulation results. This study provides technical support for optimized structure of the EHV GIS busbar.

The Design of Regenerating Codes with a Varying Number of Helper Nodes (다양한 도움 노드의 수를 가지는 재생 부호의 설계)

  • Lee, Hyuk;Lee, Jungwoo
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.41 no.12
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    • pp.1684-1691
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    • 2016
  • Erasure codes have recently been applied to distributed storage systems due to their high storage efficiency. Regenerating codes are a kind of erasure codes, which are optimal in terms of minimum repair bandwidth. An (n,k,d)-regenerating code consists of n storage nodes where a failed node can be recovered with the help of the exactly d numbers of surviving nodes. However, if node failures occur frequently or network connection is unstable, the number of helper nodes that a failed node can contact may be smaller than d. In such cases, regenerating codes cannot repair the failed nodes efficiently since the node repair process of the codes does not work when the number of helper nodes is less than d. In this paper, we propose an operating method of regenerating codes where a failed node can be repaired from ${\bar{d}}$ helper nodes where $$k{\leq_-}{\bar{d}}{\leq_-}d$$.

Electromagnetic Properties of Magnetic Core Materials and Attenuation of Blocking Filter (Blocking filter용 자심 재료의 전자기 특성 및 신호 감쇄율)

  • 오영우;이해연;김현식
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.16 no.6
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    • pp.490-495
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    • 2003
  • The electromagnetic properties and thermal behavior of Mn-Zn ferrite cores for the blocking filter of Power Line Communication(PLC) application were investigated as a function of additives. The highest density and permeability were 4.98 g/$\textrm{cm}^2$ and 8,221, respectively and were obtained to the specimen with composition of MnO 24 mol%, ZnO 25 mol% and Fe$_2$O$_3$ mol%, added MoO$_3$ of 400 ppm, SiO$_2$ of 100 ppm, and CaO of 200 ppm. The uniform grains were organized, and the microstructures were densified due to reduction of pores in the specimen. The permeability was increased up to 13,904 as the temperature of specimen increased to 110$^{\circ}C$. However, it was decreased precipitously under 100 over 110$^{\circ}C$. The exothermic behavior was observed in the frequency range from 1 kHz to 1 MHz, and the maximum temperature of specimen was 102$^{\circ}C$ at 1 MHz. In the consequence, the Mn-Zn ferrite core developed in this research will maintain the stable electromagnetic properties since the temperature of ferrite core rose to 93$^{\circ}C$ in the range of 100 kHz to 450 kHz bandwidth qualified for PLC. The blocking filters were designed for single phase and three phases using the in-line and non-contact core. The best attenuation ratios of -46.46 dB and -73.9 dB were measured in the range of 100 kHz to 450 kHz bandwidth, respectively.

High-Voltage 4H-SiC pn diode with Field Limiting Ring Termination (Field Limiting Ring termination을 이용한 고전압 4H-SiC pn 다이오드)

  • Song, G.H.;Bahng, W.;Kim, H.W.;Kim, N.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.396-399
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    • 2003
  • 4H-SiC un diodes with field limiting rings(FLRs) were fabricated and characterized. The dependences of reverse breakdown voltage on the number of FLRs, the distance between p-base main junction and first FLR, and activation temperatures, were investigated. Al and B ions were implanted and activated at high temperature to form p-base region and p+ region in the n-epilayer. We have obtained up to 1782V of reverse breakdown voltage in the un diode with two FLRs on loom thick epilayer. The differential on-resistances of the fabricated diode are $5.3m{\Omega}cm^2$ at $100A/cm^2$ and $2.7m{\Omega}cm^2$ at $1kA/cm^2$, respectively. All pn diodes with FLRs have higher avalanche breakdown voltages than that of diode without an FLR. Regardless of the activation temperature, the un diode with a FLR located 5um apart from main junction has the highest mean breakdown voltage around 1600V among the diodes with one ring. On the other hand, the pn diode with two rings showed different behavior with activation temperature. It reveals that high voltage SiC pn diodes with low on-resistance can be fabricated by using the FLR edge termination.

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Performance Characteristics of Polymer Photovoltaics using Dimethyl Sulphoxide incorporated PEDOT:PSS Buffer Layer

  • Park, Seong-Hui;Lee, Hye-Hyeon;Jo, Yeong-Ran;Hwang, Jong-Won;Gang, Yong-Su;Choe, Yeong-Seon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.08a
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    • pp.238-239
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    • 2010
  • Dimethyl sulphoxide (DMSO) is one of the widely-used secondary dopants in order to enhance the conductivity of poly(3, 4-ethylenedioxy-thiophene):poly(styrene sulfonate) (PEDOT:PSS) film. In this work, we investigated the effect of DMSO doping in to PEDOT:PSS on the electrical performance of the bulk heterojunction photovoltaics consisting of poly(3-hexylthiophene-2, 5-diyl) and phenyl-C61-butyric acid methyl ester. Correlation between the power conversion efficiency and the mechanism of improving conductivity, surface morphology, and contact properties was examined. The PEDOT:PSS films, which contain different concentration of DMSO, have been prepared and annealed at different annealing temperatures. The mixture of DMSO and PEDOT:PSS was prepared with a ratio of 1%, 5%, 15%, 25%, 35%, 45%, 55% by volume of DMSO, respectively. The DMSO-contained PEDOT:PSS solutions were stirred for 1hr at $40^{\circ}C$, then spin-coated on the ultra-sonicated glass. The spin-coated films were baked for 10min at $65^{\circ}C$, $85^{\circ}C$, and $120^{\circ}C$ in air. In order to investigate the electrical performance, P3HT:PCBM blended film was deposited with thickness of 150nm on DMSO-doped PEDOT:PSS layer. After depositing 100nm of Al, the device was post-annealed for 30min at $120^{\circ}C$ in vacuum. The fabricated cells, in this study, have been characterized by using several techniques such as UV-Visible spectrum, 4-point probe, J-V characteristics, and atomic force microscopy (AFM). The power conversion efficiency (AM 1.5G conditions) was increased from 0.91% to 2.35% by tuning DMSO doping ratio and annealing temperature. It is believed that the improved power conversion efficiency of the photovoltaics is attributed to the increased conductivity, leading to increasing short-circuit current in DMSO-doped PEDOT:PSS layer.

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A Study on the Bonding Performance of COG Bonding Process (COG 본딩의 접합 특성에 관한 연구)

  • Choi, Young-Jae;Nam, Sung-Ho;Kim, Kyeong-Tae;Yang, Keun-Hyuk;Lee, Seok-Woo
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.7
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    • pp.28-35
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    • 2010
  • In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

Degradation of electrical characteristics in Bio-FET devices by O2 plasma surface treatment and improving by heat treatment (O2 플라즈마 표면처리에 의한 Bio-FET 소자의 특성 열화 및 후속 열처리에 의한 특성 개선)

  • Oh, Se-Man;Jung, Myung-Ho;Cho, Won-Ju
    • Journal of the Korean Vacuum Society
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    • v.17 no.3
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    • pp.199-203
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    • 2008
  • The effects of surface treatment by $O_2$ plasma on the Bio-FETs were investigated by using the pseudo-MOSFETs on the SOI substrates. After a surface treatment by $O_2$ plasma with different RF powers, the current-voltage and field effect mobility of pseudo-MOSFETs were measured by applying back gate bias. The subthreshold characteristics of pseudo-MOSFETs were significantly degraded with increase of RF power. Additionally, a forming gas anneal process in 2 % diluted $H_2/N_2$ ambient was developed to recover the plasma process induced surface damages. A considerable improvement of the subthreshold characteristics was achieved by the forming gas anneal. Therefore, it is concluded that the pseudo-MOSFETs are a powerful tool for monitoring the surface treatment of Bio-FETs and the forming gas anneal process is effective for improving the electrical characteristics of Bio-FETs.