• Journal of the Korean Magnetics Society
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• v.12 no.2
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• pp.68-72
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• 2002

In this research, the effects of capacitance to the access time were studied at the junction area of tunneling magnetoresistance when these were used as memory devices. These results were obtained by applying electric signal input and magnetic field was not used. We applied bipolar square waves of 1MHz to the MTJ samples to obtain the results and time constant ($\tau$) calculated by observing wave responses utilizing an oscilloscope. And time constant was compared with junction area. Each part of MTJ sample, such as electrical pad, lead and contact area, was modeled as an electrical equivalent circuit based on experimental results. For the 200㎛$\times$200㎛ cell, junction capacitance was 90 pF. Also, measurement and simulation results were compared, which showed those similarity.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2008.05a
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• pp.281-284
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• 2008

Inundation of substation and ground power equipment breaks out every summer season in low-lying downtown and low-lying shore by localized heavy rain, typhoon and tidal wave. In case inundation excluding the exchanging cost of equipment, it occurs a great economic and social loss owing to recovery time and events of electric shock occur by inundation electrical equipment(Pad-mounted Transformer and Switch). In case of installing the power equipment at flood danger territory, we are necessary to the product development, the product is that water does not come in the inside the power equipment. Product of pressure maintaining are established on the basic frame and sensor operates at the flooding occurrence and is maintained a shutting tightly structure and it is a method. The product which is produced the reliability of the product it confirmed a flooding yes or no from the condition which puts in the water tank and it verified. We estimate that loss cost which is caused by with flooding and the power failure will be diminished if it is addition to advances the reliability evaluation and a security of the flood protection product.

• Korean Journal of Adult Nursing
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• v.20 no.6
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• pp.839-851
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• 2008

Purpose: This study was conducted to examine the effects of aroma-therapy combined with heat application on pain, ROM of lower limb joints, and discomfort from activities of daily living(ADL) among the patients with rheumatoid arthritis. Methods: Aroma blended oil was rubbed over the knees and ankles of 19 experimental group A and 20 B, and then heat therapy was given using an electric hot & wet poultice pad to only group A. There was no treatment on the 19 control group. There was measured for pain, ROM of lower limb joints and discomfort of ADL. The data was analyzed using SPSS Win 11.0 program. Results: In comparing the effects of pain reduction by time, the ROM of lower limb joints, and discomfort of ADL, there were significant differences among three groups. There was no significant difference between experimental group in pain scale by time, range of ROM of knee and ankle joint and discomfort of ADL. Conclusion: On the basis of results, aroma-therapy can be applied as a nursing intervention to reduce pain for not only rheumatoid arthritis patients but also for other patients with other diseases.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.253-259
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• 2015

The test equipment becomes more important with the development of semiconductor industry. MEMS probe is an important testing component to detect the defects from the generated electric signal when it contacts the metal pad of semiconductor devices. Ni-Pd alloy has been paid attention to as a candidate of MEMS probe material because of its high surface hardness and relatively low resistivity. In this study, electroplated Ni-Pd alloy has been prepared by using ethylene diamine as a complexing agent. Solid solution alloy coating could be formed when concentration of palladium chloride and current density were in the ranges of 1~5 mM and $0.2{\sim}1.5A/dm^2$, respectively. The increase of current density brought about an decrease in palladium content, which made both of lattice parameter and grain size smaller. As a result of grain refinement, high hardness could be obtained. However, surface cracking was observed due to residual stress when the current density was above $1.3A/dm^2$. When effects of heat treatment temperature on hardness and sheet resistance were investigated, the accompanied grain growth decreased both of them. The decrease of hardness remained stable at a temperature of $200^{\circ}C$. The sheet resistance was drastically reduced at $100^{\circ}C$. After that, it was found to become constant.

• Corrosion Science and Technology
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• v.6 no.2
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• pp.50-55
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• 2007

The smaller size and higher integration of advanced electronic package systems result in severe electrochemical reliability issues in microelectronic packaging due to higher electric field under high temperature and humidity conditions. Under these harsh conditions, electronic components respond to applied voltages by electrochemical ionization of metal and the formation of a filament, which leads to short-circuit failure of an electronic component, which is termed electrochemical migration. This work aims to evaluate electrochemical migration susceptibility of the pure Sn, Sn-3.5Ag, Sn-3.0Ag-0.5Cu solder alloys in $Na_{2}SO_{4}$. The water drop test was performed to understand the failure mechanism in a pad patterned solder alloy. The polarization test and anodic dissolution test were performed, and ionic species and concentration were analyzed. Ag and Cu additions increased the time to failure of Pb-free solder in 0.001 wt% $Na_{2}SO_{4}$ solution at room temperature and the dendrite was mainly composed of Sn regardless of the solders. In the case of SnAg solders, when Ag and Cu added to the solders, Ag and Cu improved the passivation behavior and pitting corrosion resistance and formed inert intermetallic compounds and thus the dissolution of Ag and Cu was suppressed; only Sn was dissolved. If ionic species is mainly Sn ion, dissolution content than cathodic deposition efficiency will affect the composition of the dendrite. Therefore, Ag and Cu additions improve the electrochemical migration resistance of SnAg and SnAgCu solders.

• Journal of the Korea Safety Management & Science
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• v.17 no.3
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• pp.195-204
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• 2015

The live fire test has been playing a critical role in evaluating the goals-to-meet of the weapon systems which utilize the power of explosives. As such, the successful development of the test systems therein is quite important. The test systems development covers that of ranges and facilities including system-level key components such as mission control, instrumentation or observation, safety control, electric power, launch pad, and so on. In addition, proper operational guidelines are needed with well-trained test and operation personnel. The emerging weapon systems to be deployed in future battle field would thus have to be more precise and dynamic, smarter, thereby requiring more elaboration. Furthermore, the safety consideration is becoming more serious due to the ever-increasing power of explosives. In such a situation, development of live fire test systems seems to be challenging. The objective of the paper is on how to incorporate the safety and other requirements in the development. To achieve the goal, an architectural approach is adopted by utilizing both the system components relationship and safety requirement when advanced instrumentation technology needs to be developed and deteriorated components of the range are replaced. As an evaluation method, it is studied how the level of maturity of the test systems development can be assessed particularly with the safety requirement considered. Based on the concepts of both systems engineering and SoS (System-of-Systems) engineering process, an enhanced model for the system readiness level is proposed by incorporating safety. The maturity model proposed would be helpful in assessing the maturity of safety-critical systems development whereas the costing model would provide a guide on how the reasonable test resource allocation plan can be made, which is based on the live fire test scenario of future complex weapon systems such as SoS.

• Korean Journal of Applied Biomechanics
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• v.31 no.4
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• pp.297-307
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• 2021

Objective: The aim of this study was to analyze kinetic variables between thermotherapy and dynamic warm-up during drop-landing. Method: Twenty male healthy subjects (Age: 21.85 ± 1.90 years, Height: 1.81 ± 0.06 cm, Weight: 68.5 ± 7.06 kg) underwent three treatments applied on the thermotherapy of femoral muscles and a dynamic warm-up. The thermotherapy was performed for 15 minutes while sitting in a chair using an electric heating pad equipped with a temperature control device. Dynamic warm-up performed 14 exercise, a non-treatment was sitting in a chair for 15 minutes. Core temperature measurements of all subjects were performed before landing at a height of 50 cm. During drop-landing, core temperature, joint angle, moment, work of the sagittal plane was collected and analyzed. All analyses were performed with SPSS 21.0 and for repeated measured ANOVA and Post-hoc was Bonferroni. Results: Results indicated that Thermotherapy was increased temperature than other treatments (p = .000). During drop-landing, hip joint of dynamic warm-up was slower for angular velocity (p < .005), and left ankle joint was fastest than other treatments (p = .004). Maximum joint moment of dynamic warm-up was smaller for three joints (hip extension: p = .000; knee flexion/extension: p = .001/.000; ankle plantarflexion: p = .000). Negative work of dynamic warm-up was smaller than other treatments (p = .000). Conclusion: In conclusion, the thermotherapy in the local area doesn't affect the eccentric contraction of the thigh. The dynamic warm-up treatment minimized the joint moment and negative work of the lower joint during an eccentric contraction, it was confirmed that more active movement was performed than other treatment methods.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.1
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• pp.17-22
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• 2011

ZnO-based thin-film transistors (TFTs) have been fabricated and the mechanical characteristics of electric circuits, such as stress, strain, and deformation are analyzed by the finite element method (FEM). In this study, a mechanical-stability design guide for such systems is proposed; this design takes into account the stress and deformation of the bridge to estimate the stress distribution in an $SiO_2$ film with 0 to 5% stretched on 0.5-${\mu}m$-thick. The predicted buckle amplitude of $SiO_2$ bridges agrees well with experimental results within 0.5% error. The stress and strain at the contact point between bridges and a pad were measured in a previous structural analysis. These structural analysis suggest that the numerical measurement of deformation, SU-8 coating thickness for Neutral Mechanical Plane (NMP) and ITO electrode size on a dielectric layer was useful in enhancing the structural and electrical stabilities.