• Structural Engineering and Mechanics
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• 제64권3호
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• pp.339-346
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• 2017

Slabs prevent harmful effects of fire that may occur in any floor. However, it is necessary to protect the slabs from fire. Insulation materials may be appropriate to protect reinforced concrete (RC) slab from elevated temperature. In the present study, a model has been developed in artificial neural network (ANN) to predict the moment capacity ($M_r$) of RC slabs exposed to fire with insulation material. 672 data were obtained for ANN model through author's prepared program. Input layer in model consisted of seven input parameters; such as effective depth (d), ratio of d'/d, thermal conductivity coefficient ($k_{insulation}$), insulation materials thickness ($L_{insulation}$), reinforcement area ($A_{st}$), fire exposure time ($t_{\exp}$), and concrete compressive strength ($f_c$). The predicted $M_r$ by ANN was consistent with the obtained $M_r$ by author. It is proposed to ease computational complexity in determining $M_r$ using ANN. The effects of using insulation material on the moment capacity in RC slabs were also investigated. Insulating material with low thermal conductivity has been found to be more effective for durability to high temperature.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.950-952
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• 2000

Considering the effective distribution coefficient of Ni in Fe-Ni-Co invar alloy containing a little amount of carbon, we investigated on the thermal expansion coefficient(${\alpha}$). Fe-Ni-Co invar alloy had a large thermal expansion coefficient in as-casted compared with solution treated. The thermal expansion coefficient of Fe-Ni-Co alloy increased with the carbon content in both state of as-casted and solution treated. The effective distribution coefficient(Ke$\^$Ni/) of Ni was smaller than unity in alloy of not containing carbon, but is way larger than unity in alloy of containing carbon. It was considered that the homogeneity of Ni in primary austenite affected thermal expansion coefficient.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 추계 학술발표회
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• pp.263-268
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• 2010

Thermal characterization of geomaterials has significant implication on the geothermal energy, disposal of nuclear wastes, geological sequestration of carbon dioxides and recovery of hydrocarbon resources. Heat transfer in multiphase materials is dominated by the thermal conductivity of consisting components, porosity, degree of saturation and overburden pressure, which have been investigated by the empirical correlation at macro-scale. The thermal measurement by Transient Plane Source (TPS) and associated algorithm for interpretation of thermal behavior in geomaterials corroborate the robustness of sensing techniques. The method simultaneously provides thermal conductivity, diffusivity and volumetric heat capacity. The newly introduced thermal network model enables estimating thermal conductivity of geomaterials subjected to the effective stress, which has not been evaluated using previous thermal models. The proposed methods shows the applicability of reliability of TPS technique and thermal network model.

• 설비공학논문집
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• 제17권5호
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• pp.427-435
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• 2005

This paper investigates the thermal storage performance of the office building which has adopted an air conditioning system with its slab structure as a regenerator. Four cases of the thermal storage performance experiment were conducted. Room air temperatures, floor slab temperatures, temperatures around the air conditioning unit were logged and analyzed. The load handling capacity of the air conditioning unit and the amount of heat stored in the slab were decided from those experiments. Several efficiencies were investigated to evaluate the performance of the thermal storage. The results concluded that the slab as a regenerator is very effective in cutting down peak loads of the office building.

• Carbon letters
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• 제2권1호
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• pp.72-75
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• 2001

The performance of Li-ion system based on $LiCoO_2$ and Graphite is well optimized for the 3C applications. The charge-discharge mode, the manufacturing process, the cell performance and the thermal reactions affecting safety has been explained in the engineering point of view. The energy density of the current LIB system is in the range of 300~400 Wh/l. In order to achieve the energy density higher than 500 Wh/l, the active materials should be modified or changed. Adopting new high capacity anode materials would be effective to improve energy density.

• Tribology and Lubricants
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• 제18권1호
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• pp.34-41
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• 2002

This paper presents the contact thermal behaviors of mechanical seals depending on the contacting face geometry. Using the finite element analysis, the temperature distribution, thermal distortion and leakage have been analyzed as functions of sealing gap and rotating speed of the seal ring shaft. The FE results indicate that the inclined contacting face may be more effective and stable based on the results of thermal characteristic analysis if the seal ring has been designed with a same thermal capacity between conventional rectangular sealing faces and inclined seating surface of seal rings.

• 반도체디스플레이기술학회지
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• 제3권4호
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• pp.33-37
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• 2004

As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

• 한국분말재료학회지
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• 제2권3호
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• pp.208-215
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• 1995

The aging effects on the characteristics of the melt spun Cu based shape memory alloys have been investigated by the microhardness test, X-ray diffraction, differential scanning calorimetry, scanning electron microscopy and transmission electron microscopy. After aged for specific times, hardness of the ribbons began to increase and shape memory capacity diminished. At the initial stage of aging the austenitic transformation temperatures increased gradually, but at last became nearly constant: That is, the aging deteriorated the thermal stability. The increase in hardness was due to the formation of the $\gamma_2$ precipitates. The loss in the shape memory capacity was due to the decrement of solute atoms in the matrix by the formation of the $\gamma_2$ precipitates. In this study, it was confirmed that Mn is an effective element for Improving the thermal stability.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.91-95
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• 2017

Package-On-Package (PoP) technology is developing toward smaller form factors with high-speed data transfer capabilities to cope with high DDR4x memory capacity. The common application processor (AP) used for PoP devices in smartphones has the bottom package as logic and the top package as memory, which requires both thermally and electrically enhanced functions. Therefore, it is imperative that PoP designs consider both thermal and power distribution network (PDN) issues. Stacked packages have poorer thermal dissipation than single packages. Since the bottom package usually has higher power consumption than the top package, the bottom package impacts the thermal budget of the top package (memory). This paper investigates the thermal and electrical characteristics of PoP designs, particularly the bottom package. Findings include that via and dense via-cluster volume have an important role to lower thermal resistance to the motherboard, which can be an effective way to manage chip hot spots and reduce the thermal impact on the memory package. A Cu block and dense via-cluster layout with an optimal location are proposed to drain the heat from the chip hot spots to motherboard which will enhance thermal and electrical performance at the design stage. The analytical thermal results can be used for design guidelines in 3D packaging.

• 한국자동차공학회논문집
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• 제16권2호
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• pp.136-142
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• 2008

Thermal management of a junction box of a passenger car has recently become more challenging due to its smaller size and larger current capacity. Thus, it is essential to perform the thermal optimization of a junction box in its design on an early stage of vehicle design. In this study, 3 dimensional CFD simulation with experimental measurement has been done to study for better thermal management of the junction box. First, the study of thermal characteristics of electric relays in the junction box has revealed that each surface of the relay has very different thermal resistance. In addition, an idea to install a cooling fan on the junction box has been studied and it was found that the forced cooling method was not effective on the system to keep the thermal resistance to the reasonable level of the junction box. Finally, the effect of external flows around the junction box on the temperatures of the relays, fuses, etc. has been studied and the result shows that the installation of the junction box at the proper place in an engine room can avoid any unnecessary overdesign in thermal management.