• Title/Summary/Keyword: Effective Plastic strain Temperature behaviors

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The Soundness Evaluation of Cam Shaft Moulding for the Commercial Vehicle Brake System (상용차 브레이크 캠샤프트 성형의 건전성 평가)

  • Cha, Yong-Hun;Sung, Back-Sub;Kim, Jae-Yeol
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.1
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    • pp.60-66
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    • 2011
  • In this paper, the computer simulation analyzed the effective plastic strain and temperature behaviors. The quantitative analyses which proposed the effective mold design of S/CAM shaft was executed. The parameters of forging shape that affected on the optimize conditions that was calculated with simple equation were investigated. it is expected that the developed analysis model and design technique would greatly contribute to the drum brake optimal design considering effective plastic strain and temperature affected behaviors. This development could save more than 20% of production cost and reduced failure rate to more than 30%. By improving the life span of mold from 15,000 to 25,000, financial difficulty of company imposed on a mold manufacture could be overcome.

The Forging Analysis of S/CAM Shaft to the Drum Brake (드럼브레이크 S/CAM 샤프트 단조 해석)

  • Kim, Mi-Ae;Sung, Back-Sub;Cha, Yong-Hoon
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1113-1118
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    • 2008
  • In the hot forging process, The forging defects that are caused by metal were strain, temperate, and inclusion. In this paper, the computer simulation analyzed the effective plastic strain and temperature behaviors. The quantitative analyses which proposed the effective mold design of S/CAM shaft was executed. The parameters of forging shape that affected on the optimize conditions that was calculated with simple equation were investigated. it is expected that the developed analysis model and design technique would greatly contribute to the drum brake optimal design considering temperature affected and material behaviors. This development could save more than 20% of production cost and reduced failure rate to more than 30%. By improving the life span of mold from 15,000 to 25,000, financial difficulty of company imposed on a mold manufacture could be overcome.

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Failure Mechanism of Metal Matrix Composites Subject to Transverse Loading (횡방향 하중을 받는 금속모재 복합재료의 파손구조)

  • Ham, Jong-Ho;Lee, Hyeong-Il;Jo, Jong-Du
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.6 s.177
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    • pp.1456-1469
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    • 2000
  • Mechanical behaviors of uniaxially fiber-reinforced metal matrix composites under transverse loading conditions were studied at room and elevated temperatures. A mono-filament composite was selecte d as a representative analysis model with perfectly bonded fiber/matrix interface assumption. The elastic-plastic and visco-plastic models were investigated by both theoretical and numerical methods. The product of triaxiality factor and effective strain as well as stress components and strain energy was obtained as a function of location to estimate the failure sites in fiber-reinforced metal matrix composite. Results showed that fiber/ matrix interfacial debond plays a key role for local failure at the room temperature, while void creation and growth in addition to the interfacial debond are major concerns at the elevated temperature. It was also shown that there would be an optimal diameter of fiber for the strong fiber-reinforced metal matrix composite.

A Study on Hot Straining Embrittlement of Coarse Grained HAZ in Steel Weldments (강 용접열영향부 조립역의 열변형취화에 관한 연구)

  • 정세희;김태영;임재규
    • Journal of Welding and Joining
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    • v.3 no.1
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    • pp.22-31
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    • 1985
  • Hot straining embrittlement is one of the most important factors which cause the brittle fracture initiation even in the service temperature in the case of mild steel and high tensile steel. Therefore it is necessary to analyze thoroughly the hot straining embrittlement occurred in weld HAZ of the structural steels. The behaviors of plastic deformation and fracture toughness at the notch tip of the hot strained weld HAZ in structural steels (SB 41 KS, SA 588-Grade A ASTM) have been studied by the recrystallization technique and crack opening displacement (COD) test method. The obtained results are summarized as follows; 1. The plastic zone is formed at the notch tip of weld HAZ owing to nomotonic and cyclic hot stran, and the maximum plastic strain increases with the accumulated hot straining amounts. 2. The distribution of the effective strain at the plastic deformed zone in HAZ can be determined as follows; (.epsilon. over bar $_{p}$ )$_{\chi}$=.epsilon. over bar $_{cr}$ ( $R_{/chi}$/.chi.)$^{m}$ where, .epsilon. over bar $_{cr}$ : (SB 41; .epsilon. over bar $_{cr}$ = 0.2, SA 588; .epsilon. over bar $_{cr}$ = 0.1) 3. The embrittlement of weld HAZ in SB 41 and SA 588 is influenced by hot strain, and the degree of embrittlement becomes deeper with hot straining amounts. 4. The embrittlement of weld HAZ of SB 41 is not influenced by the hot straining amounts until .epsilon. over bar $_{max}$ = 0.36, $R_{\chi}$ = 0.065mm, however the embrittlement of structure in SA 588 is considerably influenced even by a small quantity of the hot straining amounts.s.

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Thermo-mechanical Behavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free Solder Using Moire Interferometry (무아레 간섭계를 이용한 유연 솔더와 무연 솔더 실장 WB-PBGA 패키지의 열-기계적 변형 거동)

  • Lee, Bong-Hee;Kim, Man-Ki;Joo, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.17-26
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    • 2010
  • Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.