• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.10
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• pp.1078-1082
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• 2002

In this paper, we have studied the dependence of insertion loss of a microstrip stepped impedance lowpass filter with coupled open stubs. Coupling mechanisms in the filter depend not only on the transmission line width of the filter but also the gap width of coupled open stubs and three attenuation poles are created with the proper conditions. Also edge capacitance between open stubs play an important role in having three attenuation Poles. We verify the results by obtaining [S] matrices.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.15 no.11
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• pp.1100-1107
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• 2004

In this paper, a new design method fur tapped coupled-line filters has been developed. The design equations for this tapped-line filter have been obtained using a new equivalent circuit model of tapped lines. These tapped-lines replace input/output coupled lines of the conventional edge coupled-line filters, which tend to have very narrow line gaps(few mils). Therefore, tapped coupled-line filters tend to be less sensitive to filter fabrication tolerances and to be easily fabricated using milling tools. The new filter design algorithm allows very accurate filter design for frequencies up to 20 GHz and bandwidth less than 20 %.

• Proceedings of the Korea Electromagnetic Engineering Society Conference
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• 2003.11a
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• pp.371-375
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• 2003

In this paper, a new design method for coupled-line filters with tapped input/output has been developed. The design equations for this tapped filter have been obtained using a new equivalent circuit model of tapped lines. From an edge coupled-line filter, tapped lines replaces the input/output coupled lines which tend to have very narrow gaps (few mils). Therefore, tapped coupled-line filters tend to be less sensitive to filter fabrication tolerances and to be easily fabricated using milling tools. The new filter design algorithm allows very accurate filter design for frequencies less than 20 GHz and bandwidth less than 20%. Above 20 GHz, the filter performance can be optimized starting from the filter design algorithm in this paper. Simulation problems with 2-D EM tools to characterize filter performance at high frequencies have shown to be solved by providing a channel for the filter to eliminate higher order modes.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.9 s.351
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• pp.64-68
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• 2006

Novel system-on-package (SOP) - D technology to improve the mechanical and thermal properties of a MCM-D substrate was suggested. Based on this investigation, the two types of band pass filters for the V-band application with unique structure were designed and implemented using 2-metals, 3-BCB layers. The first type using distributed resonator had the insertion loss below 2.6 dB at 55 GHz and group delay was below 0.06 ns. For the second type with edge coupled structure, the insertion loss and group delay were 3 dB and 0.1 ns, respectively. Suggested MCM-D substrate with band pass filter can be used to evaluate mm-Wave system including flip-chip bonded MMIC.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.4
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• pp.487-493
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• 2001

In this paper, A new microstrip bandpass filter is proposed. The novelty of the proposed structures is to use a interdigital capacitor and embeded slot that are fanned on a patch resonator such that its insertion loss and size can be significantly reduced simultaneously. As a result, it is found that the resonant frequency of patch filter designed at 5 GHz is decreased to 1.8946 GHz and the insertion loss is reduced from -2.168 dB to -0.379 dB. This proposed filter has small size and low insertion loss in comparison with the conventional parallel edge coupled bandpass filter.

• Journal of electromagnetic engineering and science
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• v.8 no.1
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• pp.12-16
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• 2008

In this paper, we introduce a coupling, which is achieved through the aperture instead of the conventional edge coupling, so that the bandpass filter is reduced less than half in size compared to conventional planar type. The resulting filter configuration has a near two-fold symmetry, where the aperture coupling is used in the middle of the coupling stages. We designed a bandpass filter using two tapped hairpin resonators, of which the order becomes four. The designed bandpass filter has the size of $8.9{\times}18.3\;mm$. It has the return loss better than 17dB and the insertion loss of less than 5 dB in overall passband. The measured results show good agreements with simulated ones.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.349-349
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• 2008

유비쿼터스 시대를 맞이하여 현재의 전자제품은 고주파 환경에서의 소형화된 마이크로파 소자를 요구하고 있다. 현재 구현되고 있는 마이크로파 소자의 형태는 여러 가지 전송선로 중에 하나로서 금속의 그라운드면 위에 유전체 막을 형성하고 그 위에 금속선을 정밀하게 패터닝하여 각 종 소자를 연결하는 microstrip line의 형태가 많이 사용된다. 이러한 microstrip line 형태의 소자를 설계할 시에 소자 자체의 구조나 유전체 막이 그 소자의 성능을 크게 좌우한다. 여기서 유전체 막은 신호선과 그라운드면 간의 전자파를 집중시켜주어 방사손실을 줄여주는 역할을 한다. 유전체 막의 두께는 소자의 전체적인 크기를 결정하는 요인이 된다. 이는 유전체 막의 두께가 감소할 경우 50 $\Omega$ 임피던스 매칭을 위해 막 위에 형성되는 소자들의 선폭도 동시에 줄여야 하므로 소자의 소형화도 가능 하여진다. 하지만 유전체 막의 두께가 감소할 경우 전자파가 유전체 막에 집중되지 못하여 방사손실이 커지게 되고 소자의 성능이 저하된다. 이런 점을 고려할 때 소자의 소형화를 만족시키면서 동시에 소자의 성능을 유지할 수 있는 유전체 막의 최적화 두께에 대한 연구가 필요하다. 볼 연구에서는 유전체 막의 최적화 두께를 제시하기 위해 대표적 마이크로파 소자인 Edge-Coupled Filter에 대하여 3-D Electromagnetic Simulator로 설계하고 유전체 막의 두께와 Filter 성능 간의 관계를 연구하였다. Filter의 성능은 유지하도록 하면서 유전체 막의 두께를 감소시켜 나간 결과, 약 30 ~ 40 ${\mu}m$ 의 최적화 두께를 얻을 수 있었다. 한편 30 ~ 40 ${\mu}m$ 두께의 후막 공정을 고려할 때 기존의 성막공정으로는 성막시간, 공정의 난이도, 공정온도 등의 면에서 난점이 존재하며 이러한 점들을 극복할 수 있는 Aerosol Deposition Method의 적용 가능성에 대해서 연구하였다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.12
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• pp.2299-2304
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• 2011

In this paper, we propose the methodology to make the bandpass filters for the Smart Grid IED(Intelligent Electronic Device) smaller than the conventional bandpass filters. The size-reduction of the filters and the filter performances are indebted to devising small CRLH(composite right- and left-handed) resonators and coupling them as the metamaterial structures. The design methodology is validated by the equivalent circuit to be compared with the reliable full-wave EM simulation, and the proposed metamaterial filter outperforms the standard parallel-edge coupled filter with respect to the miniaturization and frequency response.

• Journal of Navigation and Port Research
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• v.31 no.5 s.121
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• pp.415-420
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• 2007

In this paper, we have designed and fabricated a new type of bandpass-filter that used rectangular ring and interdigital capacitive feeding-structure. The filter is applied the modified rectangular ring and interdigital capacitive feeding-structure in patch, which reduce rho size of filter and IEEE 802. 11 correspond to wireless LAN domain(2.45GHz and 5.2GHz) for operating. As a result, the design and fabrication process of the filter become simple and the size of it is reduced more than 60% compared with RF filter are available conventional PEMBF(Parallel Edge-coupled Microstrip Bandpass Filter) of accounted circuit by minimum stage, measurement result of fabricated filter, center frequence is down 2.408GHz and 5.075GHz. input return loss is -39.169dB at 2.408GHz, -40.922dB at 5.075GHz. insertion loss is -0.437dB at 2.408GHz, -1.669dB at 5.075GHz.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.523-526
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• 2002

This paper presents the simulation of Au / $Ba_{x}$S $r_{1-x}$ Ti $O_3$(BSTO) / Magnesium oxide (MgO) multi-layered and electrically tunable band-pass filters (BPFs) by using high frequency structure simulator (HFSS). This model is a two-pole microstrip edge coupled filter. The filter was designed fur a center frequency about 5.8 GHz. The tunabillity of the filter is achieved using the nonlinear dc electric-field dependence on the relative dielectric constant of BSTO frroelectric thin film. This work seems very promising for future wireless communication systems....