• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.224-226
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• 2004

CMP process requirements become tighter especially in sub-100nm technology. Especially, high planarity and low defectivity appear as leading issues in CMP technology. Also, the introduction of new materials and advanced lithography technique increases CMP applications. Here are listed some major issues and challenges in CMP technology, which can be categorized following four items. These have practical significance and should be considered more concretely for future generation.